Why Move To 2nm?

By Ed Sperling - 04 Feb, 2026 - Comments: 0

Key Takeaways: Scaling digital logic still provides significant benefits, especially lower power. Multi-die assemblies will be the predominant approach, and most of the circuitry will not be 2nm or below. While these systems are inherently more flexible, the number and complexity of tradeoffs required for optimizing PPA/C are increasing. The rollout of 2nm process nodes and ... » read more

Chip Industry Week In Review

By The SE Staff - 30 Jan, 2026 - Comments: 0

Big deals and fundings Teradyne and MultiLane are forming a joint venture, MultiLane Test Products (MLTP), to accelerate the development of test solutions for high speed data connections. Teradyne will be the majority owner. Ricursive Intelligence raised $300M Series A for AI-driven IC design. IonQ plans to acquire SkyWater for ~$1.8B, creating a "vertically integrated full-stack q... » read more

Ultra-low-bit LLM Inference Allows AI-PC CPUs And Discrete Client GPUs To Approach High-end GPU-Level (Intel)

By Technical Paper Link - 28 Jan, 2026 - Comments: 0

A new technical paper titled "Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs" was published by researcher at Intel. Abstract "The advent of ultra-low-bit LLM models (1/1.58/2-bit), which match the perplexity and end-task performance of their full-precision counterparts using the same model size, is ushering in a new era of LLM inference for resource-constrained environments... » read more

Chip Industry Week In Review

By The SE Staff - 23 Jan, 2026 - Comments: 0

TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

Chip Industry Week in Review

By The SE Staff - 09 Jan, 2026 - Comments: 0

SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Chip Industry Technical Paper Roundup: Dec 30

By Emma Riverso - 30 Dec, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=509 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review

By The SE Staff - 29 Dec, 2025 - Comments: 0

Deals: NVIDIA inked a $20B non-exclusive licensing deal with Groq for its inference technology. The startup's founder, Jonathan Ross, and some other employees will join NVIDIA to assist in scaling and advancing the technology. The non-exclusive licensing deal, versus an outright purchase, is a tool other companies have used to avoid antitrust regulation. Samsung Ventures made a strategic inv... » read more

AFM-Based Protocol for Characterizing the Incipient Stages of Plasticity on Hybrid Bonding-Ready Copper Pads (NIST, Intel, Colorado School of Mines)

By Technical Paper Link - 23 Dec, 2025 - Comments: 0

A new technical paper titled "Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy" was published by researchers at the National Institute of Standards and Technology, Intel, and Colorado School of Mines. Excerpt "The slowdown of Moore’s law has elicited a paradigm shift whereby shrinking of in-plane dim... » read more

When To Move To Multi-Die Assemblies

By Ann Mutschler - 23 Dec, 2025 - Comments: 0

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it's often not feasible to fit everything onto a single planar die. But determining when to move to a multi-die assembly isn't always straightforward. Multi-die approaches have some well-documented benefits. They allow designers to split functions across different dies, which can impro... » read more

Chip Industry Week in Review

By The SE Staff - 12 Dec, 2025 - Comments: 0

Deals of the week: Arteris announced plans to acquire cybersecurity provider Cycuity. “Expanding our technology portfolio to include Cycuity’s hardware security assurance products will enable our customers to achieve secure on-chip data movement,” said Charlie Janac, chairman and CEO of Arteris. Qualcomm acquired Ventana Micro Systems, a maker of RISC-V data center-class CPU IP. ... » read more

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tag: Intel

Why Move To 2nm?

Chip Industry Week In Review

Ultra-low-bit LLM Inference Allows AI-PC CPUs And Discrete Client GPUs To Approach High-end GPU-Level (Intel)

Chip Industry Week In Review

Chip Industry Week in Review

Chip Industry Technical Paper Roundup: Dec 30

Chip Industry Week In Review

AFM-Based Protocol for Characterizing the Incipient Stages of Plasticity on Hybrid Bonding-Ready Copper Pads (NIST, Intel, Colorado School of Mines)

When To Move To Multi-Die Assemblies

Chip Industry Week in Review

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