TWI880732B - Ghz pulse burst laser source system and method for dicing composite material - Google Patents

Abstract

The present invention provides a GHz pulse burst laser source system. The GHz pulse burst laser source system comprises: a carrier module, configured to carry a composite material; a laser light generator module, configured to provide a laser beam; a collimating module, configured to collimate the laser beam to a collimated laser beam; a laser light adjustment scanning module, configured to reflect the collimated laser beam; and a condenser, configured to aggregate the reflected collimated laser beam into an focused laser beam having a predetermined cutting width, so as to project the focused laser beam to a cutting place of the composite material; wherein projection path of the focused laser beam is adjusted by the laser light adjustment scanning module to project the composite material to the cut part The focused laser beam is shifted in parallel, or the cutting place of the composite material is shifted in parallel by movement of the composite material. A pulse width of the laser beam is between 50 and 500 fs.

Description

GHz pulse train laser source system and method for cutting composite materials

The present invention relates to a laser light source system, and more particularly to a GHz pulse train laser light source system and method for cutting composite materials.

Glass has always been an indispensable material in industry, and its potential application areas include optical components, microelectronics, microfluidics, and display technology. In recent years, many products have been miniaturized to the micron and nanometer levels, which means that the precision requirements for glass processing will be more stringent than in the past.

Femtosecond laser is a very important technological breakthrough in recent years. Femtosecond laser refers to a laser pulse width in the order of femtosecond (fs), 10 ^-15 seconds. The laser beam can generate extremely high power density through focusing. When processing materials, the heat affect zone (HAZ) of femtosecond laser is extremely small, and it can process the inside of transparent materials. Cutting is one of the most popular technologies in laser applications, and when cutting with femtosecond laser, it has many advantages, such as no need for prior heat treatment, more precise spatial resolution, less prone to significant thermal deformation, and only cutting near the focus. In addition, compared with traditional cutting, femtosecond laser glass cutting can effectively maintain the structural integrity of the cutting point, which is definitely a huge leap for glass cutting.

Therefore, how to use femtosecond laser to improve the processing efficiency of glass cutting has become the direction of the industry's efforts.

The present invention provides a GHz pulse train laser light source system and method for cutting composite materials to avoid delamination at the cutting portion of the processed composite materials and maintain a small heat affect zone (HAZ), thereby avoiding any fragments and cracks at the cutting portion of the processed composite materials.

The embodiment of the present invention discloses a GHz pulse train laser light source system for cutting composite materials, which includes a carrier module, a laser light generating module, a collimating module, a laser light adjusting module and a focusing lens. The carrier module is used to carry the composite material. The laser light generating module is used to provide a laser beam. The collimating module is used to collimate the laser beam into a collimated laser beam. The laser light adjusting module is used to reflect the collimated laser beam. The focusing lens is used to focus the reflected collimated laser beam into a focused laser beam with a predetermined cutting width, so as to project the focused laser beam onto the cutting portion of the composite material. The projection path of the focused laser beam is adjusted by the laser light adjusting module so that the focused laser beam projected onto the cutting portion of the composite material is parallel offset, or the composite material is moved by the carrier module so that the cutting portion of the composite material is parallel offset. The pulse width of the laser beam is between 50~500fs, the repetition frequency of the laser beam is between 0.5~10GHz, and the pulse energy of the laser beam is between 100~1000μJ. The laser light generation module, collimation module, laser light adjustment module, condenser and carrier module are set in the same optical path.

The present invention also discloses a method for cutting composite materials, which includes: S1: providing a laser beam through a laser light generating module of a GHz pulse train laser light source system; S2: generating a focused laser beam according to the laser beam through a collimating module, a laser light adjusting module and a condenser lens of the GHz pulse train laser light source system; S3: projecting the focused laser beam to a cutting position of the composite material on a carrier module; S4: when the focused laser beam contacts the surface of the cutting position, The surface is melted (ablation) by the focused laser beam; S5: when the focused laser beam melts the surface, the focused laser beam is incident on the inner wall of the cut portion of the composite material and smoothes it; S6: according to multiple laser parameters of the focused laser beam, a portion of the composite material is effectively removed; S7: steps S1 to S6 are executed at multiple time periods during the cutting period to generate multiple cutting holes at the cutting portion, wherein the cutting holes are arranged along the cutting portion and overlap each other. The pulse width of the laser beam is between 50~500fs, the repetition frequency of the laser beam is between 0.5~10GHz, and the pulse energy of the laser beam is between 100~1000μJ. The laser light generation module, collimation module, laser light adjustment module, condenser and carrier module are set in the same optical path.

In summary, the GHz pulse train laser light source system and method disclosed in the embodiment of the present invention uses a GHz pulse train (burst) laser beam with a pulse width between 50 and 500 fs to cut the cutting part of the composite material to avoid the delamination phenomenon at the cutting part of the processed composite material and maintain a small HAZ. In addition, since the HAZ of the processed composite material is small, any fragments and cracks can be avoided at the cutting part of the processed composite material.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the scope of protection of the present invention.

102: Laser light generation module

104: Collimation module

106: Laser light adjustment module

108: Focusing lens

110: Carrier module

112: Composite materials

114: Cutting point

116: Surface

118: Inner wall

120: Cutting holes

1022: Pulse laser light generation module

1024: Sound and light modulator

1026: Laser Amplifier

D1: GHz pulse train laser light source system

L1: Laser beam

L2: Collimated laser beam

L3: Focused laser beam

V: translation speed

P1-Pn: pulse signal

Ls: Laser light source

Lb: pulsed laser light

B1-Bn: Pulse signal

HAZ: Heat affected area

S1-S7: Steps

FIG1 is a schematic diagram showing the structure of a GHz pulse train laser light source system for cutting composite materials according to an embodiment of the present invention.

Figure 2A shows a schematic diagram of the structure of the laser light generating module.

FIG2B is a schematic diagram showing a structure of multiple pulse trains of a laser beam.

Figure 3 shows a schematic diagram of the cutting method of the focused laser beam.

FIG. 4 shows a flow chart of the method for the cutting method of FIG. 1 and FIG. 3 .

Figure 5 shows a schematic diagram of the processing results using the cutting method of Figure 3.

FIG6 is a schematic diagram showing the processing results of the composite material using the cutting method of FIG3.

FIG7 is a schematic diagram showing the processing form of the GHz pulse train laser light source system of FIG1.

Figure 8 shows a schematic diagram of multiple overlapping cutting holes.

The following is a specific embodiment to illustrate the implementation of the "GHz pulse train laser light source system and method for cutting composite materials" disclosed in the present invention. Technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the attached figures of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical content of the present invention in detail, but the disclosed content is not used to limit the scope of protection of the present invention.

It should be understood that although the terms "first", "second", "third" and so on may be used in this article to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this article may include any one or more combinations of the related listed items depending on the actual situation.

Please refer to FIG. 1, which shows a schematic diagram of the structure of a GHz burst laser light source system D1 for cutting composite materials according to an embodiment of the present invention. The GHz burst laser light source system D1 includes a laser light generating module 102, a collimating module 104, a laser light adjusting module 106, a focusing lens 108, and a supporting module 110. The laser light generating module 102, the collimating module 104, the laser light adjusting module 106, the focusing lens 108, and the supporting module 110 are arranged in the same optical path, but the present invention is not limited thereto. It is worth mentioning that, for example, in another feasible embodiment, the GHz pulse series laser light source system D1 may include a laser light generating module 102, a laser light beam expander, an X-axis laser light oscillator scanning module (not shown), an X-axis laser light oscillator controller (not shown), a Y-axis laser light oscillator scanning module (not shown), a Y-axis laser light oscillator controller (not shown), a condenser 108 and a carrier module 110, wherein the laser light generating module 102, the laser light beam expander, the X-axis laser light oscillator scanning module, the Y-axis laser light oscillator scanning module, the condenser 108 and the carrier module 110 are arranged in the same optical path, but the present invention is not limited thereto.

Please refer to FIG. 2A , which shows a schematic diagram of the structure of the laser light generating module 102. The laser light generating module 102 includes a pulse laser light generating module 1022, an acousto-optic modulator (AOM) 1024, and a laser light amplifier 1026. The pulse laser light generating module 1022 is used to generate a laser light source Ls having a plurality of pulse signals P1-Pn. The acousto-optic modulator 1024 is adjacent to the pulse laser light generating module 1022 and is used to increase the repetition frequency of the laser light source Ls, so as to generate a pulse train laser light Lb having a plurality of pulse trains (bursts) according to the increased laser light source Ls. The laser light amplifier 1026 is adjacent to the acousto-optic modulator 1024 and is used to increase the pulse energy of the pulse train laser light Lb to generate the laser beam L1. The repetition frequency of the pulse train laser light Lb is between 0.5 and 10 GHz (for example, any positive integer between 0.5 and 10 GHz), and the pulse energy of the laser beam L1 is between 100 and 1000 μJ (for example, any positive integer between 10 and 30 mJ), but the present invention is not limited thereto.

Please refer to FIG2B, which shows a schematic diagram of the structure of multiple pulse trains B1-Bn of the laser beam L1. As can be seen from FIG2B, the pulse trains B1-Bn include multiple pulse signals P1-Pn, that is, multiple pulse signals P1 form a pulse train B1, multiple pulse signals P2 form a pulse train B2, ..., multiple pulse signals Pn form a pulse train Bn, so that the pulse trains B1-Bn respectively form multiple pulse signals P1-Pn. The pulse width of the pulse signals P1-Pn is between 50 and 500 fs (for example, any positive integer between 50 and 500 fs), the number of the pulse signals P1-Pn is between 50 and 1000 (for example, any positive integer between 50 and 1000), and the frequency of the pulse signals P1-Pn is between 1 and 2000 KHz (for example, any positive integer between 1 and 2000 KHz), but the present invention is not limited thereto.

1, 2A, and 2B, the laser light generating module 102 is used to provide a laser light beam L1. The collimating module 104 is adjacent to the laser light generating module 102 and is used to collimate the laser light beam L1 into a collimated laser light beam L2. The laser beam L1 can be adjusted through the laser light generating module 102, the pulse width of the laser beam L1 (i.e., the pulse width of the pulse signals P1-Pn) is between 50 and 500 fs (e.g., any positive integer between 50 and 500 fs), the repetition frequency of the laser beam L1 (i.e., the repetition frequency of the pulse train laser light Lb) is between 0.5 and 10 GHz (e.g., any positive integer between 0.5 and 10 GHz), the average power of the laser beam L1 is determined according to the pulse energy of the laser beam L1 and the repetition frequency, and the collimating module 104 can be a Fresnel lens (F-Lens), but the present invention is not limited thereto.

It is worth noting that the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the frequency of the pulse signals P1-Pn, the repetition frequency of the laser beam L1 and the number of the pulse signals P1-Pn can be appropriately adjusted according to personal needs. For example, if the pulse energy of the laser beam L1 used when cutting composite materials is higher, the repetition frequency of the laser beam L1 can be adjusted to a lower frequency. However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

In addition, it is worth noting that if the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the frequency of the pulse signals P1-Pn, the repetition frequency of the laser beam L1, and the number of the pulse signals P1-Pn used when cutting the composite material are lower than the above-mentioned predetermined range, the laser beam will have difficulty in cutting into the composite material; if the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the frequency of the pulse signals P1-Pn, the repetition frequency of the laser beam L1, and the number of the pulse signals P1-Pn used when cutting the composite material exceed the above-mentioned predetermined range, cracks will easily occur at the cutting part of the composite material. For example, if the pulse width of the laser beam L1 used when cutting a composite material is 600 fs, cracks are likely to occur at the cut portion of the composite material. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

The laser light adjustment module 106 is adjacent to the collimation module 104 and is used to reflect the collimated laser beam L2, wherein the laser light adjustment module may be a "laser light galvanometer scanning module having a scanning galvanometer" or a "laser light focusing module having a fixed focusing processing head". In one embodiment, if the laser light galvanometer scanning module is used to cut composite materials, the laser light galvanometer scanning module reflects the collimated laser beam L2 according to a plurality of rotation angles (e.g., 0°, 30°, 60°, ...) (not shown), that is, the laser light galvanometer scanning module 106 performs a rotational motion to generate a plurality of rotation angles, so that the laser light galvanometer scanning module 106 reflects the collimated laser beam L2 with mirror surfaces at different angles. In one embodiment, if a laser light focusing module is used to cut composite materials, the laser light focusing module reflects the collimated laser beam L2 at a reflection angle, that is, the laser light focusing module reflects the collimated laser beam L2 with a mirror with a fixed reflection angle.

For example, the user can input a control command to a controller (not shown) according to the cutting requirements, and the controller sends a corresponding driving command to the laser oscillator scanning module according to the control command, so that the laser oscillator scanning module performs corresponding driving rotation according to the driving command to generate multiple rotation angles, so that the laser oscillator scanning module can reflect the collimated laser beam L2 with mirrors at different angles according to the cutting requirements. However, the above example is only one feasible embodiment and is not used to limit the present invention.

The carrying module 110 is used to carry the composite material 112. The focusing lens 108 is adjacent to the laser light adjustment module 106 and is used to aggregate the reflected collimated laser beam L2 into a focused laser beam L3, so as to project the focused laser beam L3 to the cutting position 114 of the composite material 112. The composite material 112 has a thickness of 50-1000 μm and includes at least two substrates to be cut, each of which is a glass, a metal, a ceramic or a semiconductor wafer, but the present invention is not limited thereto.

Specifically, if a laser oscillator scanning module (laser light adjustment module 106) is used to cut the composite material, the projection path of the focused laser beam L3 can be adjusted by the laser oscillator scanning module so that the focused laser beam L3 projected onto the cutting portion 114 of the composite material 112 is parallelly offset at a translation speed V. That is, the composite material 112 on the support module 110 is fixed and the laser oscillator scanning module (laser light adjustment module 106) is adjusted so that the focused laser beam L3 is projected onto the cutting portion 114 of the composite material 112 at a translation speed V. In one embodiment, if a laser light focusing module (laser light adjustment module 106) is used to cut the composite material, the composite material 112 can be parallel-shifted at a translation speed V by moving the supporting module 110 (for example, the supporting module 110 can move along the X-axis or Y-axis direction on a horizontal plane). That is, the laser light focusing module (laser light adjustment module 106) is fixed and the supporting module 110 is moved, so that the supporting module 110 is parallel-shifted at the translation speed V, thereby driving the cutting part 114 of the composite material 112 to be parallel-shifted at the translation speed V. In one embodiment, the laser oscillating mirror scanning module (laser light adjustment module 106) can be adjusted and the carrier module 110 can be moved so that the focused laser beam L3 and the cutting position of the composite material 112 can be offset in parallel in opposite directions at a translation speed V.

Therefore, through the adjustment of the laser light adjustment module 106 and/or the movement of the carrier module 110, the focused laser beam L3 is projected to the cutting position 114 of the composite material 112 for cutting. For the cutting method of the composite material 112 by the focused laser beam L3, please refer to the detailed description of FIG. 3 below.

Please refer to FIG. 3, which shows a schematic diagram of the cutting method of the focused laser beam L3. First, the focused laser beam L3 is projected onto the cutting portion 114 of the composite material 112 on the carrier module 110. When the focused laser beam L3 contacts the surface 116 of the cutting portion 114, the surface 116 is melted (ablation) by the focused laser beam L3. After that, when the focused laser beam L3 melts the surface 116, the focused laser beam L3 is incident on the inner wall 118 of the cutting portion 114 of the composite material 112 and makes it smooth. After that, according to According to the multiple laser parameters of the focused laser beam L3, a portion of the composite material is effectively removed, wherein the method in which the focused laser beam L3 melts from the surface 116 to the inner wall 118 is called a preheating phenomenon, and the multiple laser parameters include the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the number of multiple pulse signals P1-Pn of the multiple pulse trains B1-Bn of the laser beam L1, the repetition frequency of the laser beam L1, and the frequency of the multiple pulse signals P1-Pn. In addition, in the process of the focused laser beam L3 melting the inner wall 118, the focused laser beam L3 is reflected and scattered multiple times at the inner wall 118 under grazing incidence, and the focused laser beam L3 loses part of its energy at each reflection, causing the energy of the drill hole to decrease as the drill hole depth increases, and finally the drill hole depth reaches saturation.

Specifically, when the bottom influence of the focused laser beam L3 is lower than a melting threshold, the inner wall 118 is stopped from melting. The bottom influence may be the energy density of the laser beam melting the composite material, and the energy density refers to the joule amount ( J/cm2 ⁾ of the laser beam per square unit. The melting threshold may be adjusted according to the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the number of the multiple pulse signals P1-Pn of the multiple pulse trains B1-Bn of the laser beam L1, the repetition frequency of the laser beam L1, and the frequency of the multiple pulse signals P1-Pn, but the present invention is not limited thereto.

Finally, the cutting method of FIG. 3 is performed at multiple time periods during a cutting process to generate multiple cutting holes 120 at the cutting location 114, wherein the cutting holes 120 are arranged along the cutting location 114 and overlap each other. It is worth noting that during the cutting process, the focused laser beam L3 is repeatedly projected back and forth at the cutting location 114 at a translation speed V according to the above-mentioned cutting method, so that the cutting location 114 is cut to ensure the complete cutting of the cutting location 114.

For example, when the cutting period is 1ms to 19s, the repetition frequency of the laser beam L3 after focusing is 1KHz, and each pulse train of each 1Gz repetition frequency contains 50 pulse signals, the cutting method of FIG. 3 is performed at multiple time periods (e.g., 1ms, 2ms..., 19s) during the cutting period, so that multiple overlapping cutting holes 120 are generated at the cutting position 114 of the composite material 112, and the laser beam L3 after focusing is repeatedly projected back and forth at the cutting position 114 at a translation speed V, so that the cutting position 114 can be completely cut. However, the above example is only one of the feasible embodiments and is not used to limit the present invention.

Please refer to FIG. 4, which shows a flow chart of a method for the cutting method of FIG. 1 and FIG. 3, the method comprising: step S1: providing a laser beam L1 through a laser light generating module 102 of a GHz pulse train laser light source system D1; step S2: generating a focused laser beam L3 according to the laser beam L1 through a collimating module 104, a laser light adjusting module 106 and a focusing lens 108 of the GHz pulse train laser light source system D1; step S3: projecting the focused laser beam L3 to a cutting position 114 of a composite material 112 on a carrier module 110; step S4: when the focused laser beam L3 is When the laser beam L3 contacts the surface 116 of the cutting location 114, the surface 116 is melted (ablation) by the focused laser beam L3; Step S5: When the focused laser beam L3 melts the surface 116, the focused laser beam L3 is incident on the inner wall 118 of the cutting location 114 of the composite material 112 and smoothes it; Step S6: According to multiple laser parameters of the focused laser beam L3, a portion of the composite material is effectively removed; Step S7: Execute steps S1 to S6 at multiple time periods during the cutting period to generate multiple cutting holes 120 at the cutting location 114.

Please refer to FIG. 5, which shows a schematic diagram of the processing result using the cutting method of FIG. 3. As can be seen from FIG. 5, the cutting holes 120 at the cutting position 114 are cylindrical holes, the cutting holes 120 have a fixed hole diameter, the inner wall of the cutting holes 120 is a smooth wall, the depth of the cutting holes 120 is determined by the number of pulse trains and the energy density, and the depth of the cutting holes 120 varies linearly. The hole diameter of the cutting holes 120 is between 20 and 40 μm, the depth of the cutting holes 120 is between 70 and 295 μm, and the inner wall smoothness (Rz) of the cutting holes 120 is between 100 and 5000 nm (ten-point average roughness Rz), but the present invention is not limited thereto.

Please refer to FIG. 6, which shows a schematic diagram of the processing result of the composite material 112 using the cutting method of FIG. 3. As can be seen from FIG. 6, through the cutting method of FIG. 3, the cut portion 114 of the processed composite material 112 does not undergo delamination, and maintains a small heat affected zone HAZ (Heat Affect Zone), so the processed composite material 112 and its surface 116 are not damaged, and the electrical performance is measured to be normal. In addition, since the HAZ of the processed composite material 112 is small, any debris and cracks can be avoided at the cut portion 114 of the processed composite material 112.

Please refer to FIG. 7, which shows a schematic diagram of the processing form of the GHz pulse train laser light source system D1 of FIG. 1. As can be seen from FIG. 1 and FIG. 7, the processing form of the GHz pulse train laser light source system D1 includes full cutting (dicing) or half cutting (scribing) of the composite material 112. The full cutting of the composite material 112 is controlled according to the number of multiple pulse signals P1-Pn of the multiple pulse trains B1-Bn of the laser beam L1. The laser spot size of the laser beam L3 after focusing is similar to the width of the cutting point 114.

In addition, the laser spot overlap rate of the focused laser beam L3 is determined according to the laser spot size of the focused laser beam L3 and the overlap rate of the cutting holes 120 at the cutting location 114, the translation speed V of the focused laser beam L3 is determined according to the laser spot overlap rate of the focused laser beam L3 and the repetition frequency of the laser beam L1, and the translation speed V of the carrier module 110 is determined according to the overlap rate, wherein the overlap rate of the cutting holes 120 is between 70% and 99%, but the present invention is not limited thereto.

FIG8 is a schematic diagram of a plurality of overlapping cutting holes 120. As can be seen from FIG8, the cutting holes 120 overlap with each other at a hole ratio (as indicated by the diagonal lines in FIG8), and the hole ratio is the overlap rate of the cutting holes 120.

Thus, the GHz pulse train laser light source system D1 of the present invention uses a GHz pulse train (burst) laser beam L1 with a pulse width between 50 and 500 fs to cut the cutting portion 114 of the composite material 112, so as to avoid delamination at the cutting portion 114 of the processed composite material 112 and maintain a small HAZ. In addition, since the HAZ of the processed composite material 112 is small, any fragments and cracks can be avoided at the cutting portion 114 of the processed composite material 112.

It is worth mentioning that the above specific embodiments can clearly understand the implementation of the GHz pulse train laser light source system D1 for cutting composite materials, as well as the advantages and effects of the present invention. However, the present invention is not limited to the above examples.

[Beneficial effects of the embodiments of the present invention]

In summary, the GHz pulse train laser light source system and method disclosed in the embodiment of the present invention uses a GHz pulse train (burst) laser beam with a pulse width between 50 and 500 fs to cut the cutting part of the composite material to avoid the delamination phenomenon at the cutting part of the processed composite material and maintain a small HAZ. In addition, since the HAZ of the processed composite material is small, no fragments and cracks will be generated at the cutting part of the processed composite material, and no melting or evaporation will occur.

In addition, the GHz pulse train laser light source system and method provided by the present invention can be used to cut composite materials such as glass to glass, glass to metal, glass to ceramic, and glass to silicon wafers (silicon chips), and can be applied to 5G power components using third-generation semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC).

Furthermore, the composite material (e.g., glass) used in the present invention has the advantages of low electromagnetic signal shielding, high hardness, low cost, and light weight, which has gradually become the material of 3C panels and camera modules in recent years. Therefore, the value of using femtosecond laser to cut glass in the present invention is correspondingly improved, the processing efficiency is improved, and the economic cost is reduced, so it has a broad prospect.

The above disclosed contents are only the preferred feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the contents of the specification and drawings of the present invention are included in the patent scope of the present invention.

102: Laser light generation module

104: Collimation module

106: Laser light adjustment module

108: Focusing lens

110: Carrier module

112: Composite materials

114: Cutting point

D1: GHz pulse train laser light source system

L1: Laser beam

L2: Collimated laser beam

V: translation speed

Claims (10)

A GHz pulse train laser light source system for cutting composite materials, comprising: A carrier module for carrying the composite material; A laser light generating module for providing a laser beam; A collimating module for collimating the laser beam into a collimated laser beam; A laser light adjusting module for reflecting the collimated laser beam; and A condenser for focusing the reflected collimated laser beam into a focused laser beam with a predetermined cutting width, so as to project the focused laser beam onto a cutting position of the composite material; Wherein, the projection path of the focused laser beam is adjusted by the laser light adjusting module so that the focused laser beam projected onto the cutting position of the composite material is parallelly offset, or the composite material is moved by the carrier module so that the cutting position of the composite material is parallelly offset; The pulse width of the laser beam is between 50 and 500 fs, the repetition frequency of the laser beam is between 0.5 and 10 GHz, the pulse energy of the laser beam is between 100 and 1000 μJ, and the laser light generation module, the collimation module, the laser light adjustment module, the focusing lens and the carrier module are arranged in the same optical path; Wherein, the laser light adjustment module is a laser light vibrating mirror scanning module or a laser light focusing module. The laser light vibrating mirror scanning module reflects the collimated laser beam according to a plurality of rotation angles, and the laser light focusing module reflects the collimated laser beam according to a reflection angle. The focused laser beam is projected to the cutting part of the composite material at a translation speed, and the carrier module is parallelly offset at the translation speed. The cutting part includes a plurality of cutting holes, and the depth of the cutting holes is determined according to a pulse train number and an energy density; Wherein, a laser spot overlap rate of the focused laser beam is determined according to a laser spot size of the focused laser beam and an overlap rate of the cutting holes, the translation speed of the focused laser beam is determined according to the laser spot overlap rate and the repetition frequency, an average power of the laser beam is determined according to the pulse energy and the repetition frequency, and the translation speed of the carrier module is determined according to the overlap rate; Wherein, the laser light generation module includes: A pulse laser light generation module for generating a laser light source having a plurality of pulse signals; an acousto-optic modulator, adjacent to the pulse laser light generating module, and used to increase the repetition frequency of the laser light source, so as to generate a pulse train laser light having a plurality of pulse trains according to the increased laser light source; and a laser light amplifier, adjacent to the acousto-optic modulator, and used to increase the pulse energy of the pulse train laser light to generate the laser beam, wherein the pulse trains include the pulse signals. A GHz pulse train laser light source system as described in claim 1, wherein the frequency of the pulse signals is between 1 and 2000 KHz. A GHz pulse train laser light source system as described in claim 1, wherein the cutting holes are cylindrical holes, the cutting holes have a hole diameter, the inner wall of the cutting holes is a smooth wall, the cutting holes are arranged along the cutting position and overlap with each other, the hole diameter is between 20 and 40 µm, the depth of the cutting holes is between 70 and 295 µm, and the inner wall smoothness of the cutting holes is between 100 and 5000 nm. A GHz pulse train laser light source system as described in claim 3, wherein the laser spot size is similar to the width of the cut. A GHz pulse train laser light source system as described in claim 1, wherein the thickness of the composite material is 50-1000 µm and comprises at least two substrates to be cut, each of which is a glass, a metal, a ceramic or a semiconductor wafer. A method for cutting composite materials, comprising: S1: providing a laser beam through a laser light generating module of a GHz pulse train laser light source system; S2: generating a focused laser beam according to the laser beam through a collimating module, a laser light adjustment module and a focusing lens of the GHz pulse train laser light source system; S3: projecting the focused laser beam to a cutting position of a composite material on a carrier module; S4: when the focused laser beam contacts a surface of the cutting position, the surface is melted through the focused laser beam; S5: when the focused laser beam melts the surface, the focused laser beam is incident on an inner wall of the cutting position of the composite material and smoothes it; S6: effectively removing a portion of the composite material according to a plurality of laser parameters of the focused laser beam; and S7: Execute steps S1 to S6 at multiple time periods during a cutting period to generate multiple cutting holes at the cutting position, wherein the cutting holes are arranged along the cutting position and overlap each other; Wherein, the pulse width of the laser beam is between 50 and 500 fs, the repetition frequency of the laser beam is between 0.5 and 10 GHz, the pulse energy of the laser beam is between 100 and 1000 μJ, and the laser light generation module, the collimation module, the laser light adjustment module, the focusing lens and the carrier module are arranged in the same optical path; Wherein, the laser light adjustment module is a laser light vibrating mirror scanning module or a laser light focusing module. The laser light vibrating mirror scanning module reflects a collimated laser beam according to a plurality of rotation angles, and the laser light focusing module reflects the collimated laser beam according to a reflection angle. The focused laser beam is projected to the cutting position of the composite material at a translation speed, and the carrier module is offset in parallel at the translation speed. The depth of the cutting holes is determined according to the number of pulse trains and the energy density; Wherein, a laser spot overlap rate of the focused laser beam is determined according to a laser spot size of the focused laser beam and an overlap rate of the cutting holes, the translation speed of the focused laser beam is determined according to the laser spot overlap rate and the repetition frequency, an average power of the laser beam is determined according to the pulse energy and the repetition frequency, and the translation speed of the carrier module is determined according to the overlap rate; Wherein, the laser light generation module includes: A pulse laser light generation module for generating a laser light source having a plurality of pulse signals; an acousto-optic modulator, adjacent to the pulse laser light generating module, and used to increase the repetition frequency of the laser light source, so as to generate a pulse train laser light having a plurality of pulse trains according to the increased laser light source; and a laser light amplifier, adjacent to the acousto-optic modulator, and used to increase the pulse energy of the pulse train laser light to generate the laser beam, wherein the pulse trains include the pulse signals. A method for cutting composite materials as described in claim 6, wherein the frequency of the pulse signals is between 1 and 2000 KHz. A method for cutting a composite material as described in claim 6, wherein the cutting holes are cylindrical holes, the cutting holes have a hole diameter, the inner wall of the cutting holes is a smooth wall, the hole diameter is between 20 and 40 µm, the depth of the cutting holes is between 70 and 295 µm, and the smoothness of the inner wall of the cutting holes is between 100 and 5000 nm. A method for cutting a composite material as described in claim 8, wherein the laser spot size is similar to the width of the cut. A method for cutting a composite material as described in claim 6, wherein the composite material has a thickness of 50-1000 µm and comprises at least two substrates to be cut, each of which is a glass, a metal, a ceramic or a semiconductor wafer.

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