TWI871160B - Electronic device - Google Patents
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- TWI871160B TWI871160B TW112151747A TW112151747A TWI871160B TW I871160 B TWI871160 B TW I871160B TW 112151747 A TW112151747 A TW 112151747A TW 112151747 A TW112151747 A TW 112151747A TW I871160 B TWI871160 B TW I871160B
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本發明是有關於一種電子裝置,特別是有關於一種可插接儲存裝置的電子裝置。The present invention relates to an electronic device, in particular to an electronic device capable of being plugged into a storage device.
目前現有抽取式固態硬碟(例如M.2 SSD)通常會經由轉接板插接至電腦主機的連接器上。然而,在成本、重量以及系統空間等方面較為侷限的情況下,這種採用轉接板型式的設計需要較大的配置空間,因此在使用上較不具優勢。不僅如此,轉接板還會造成阻抗值過高及訊號衰減等問題,因此會對固態硬碟傳輸效能造成影響。Currently, existing removable solid-state drives (such as M.2 SSDs) are usually plugged into the connector of a computer host via an adapter plate. However, under the constraints of cost, weight, and system space, this design using an adapter plate requires a larger configuration space, so it is not advantageous in use. Not only that, the adapter plate will also cause problems such as excessively high impedance and signal attenuation, which will affect the transmission performance of the solid-state drive.
因此,如何提出一種可解決上述問題的電子裝置,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to come up with an electronic device that can solve the above problems is one of the problems that the industry is eager to invest research and development resources to solve.
有鑑於此,本發明之一目的在於提出一種可解決上述問題的電子裝置。In view of this, one object of the present invention is to provide an electronic device that can solve the above problems.
為了達到上述目的,依據本發明之一實施方式,一種電子裝置包含基座、儲存裝置、第一導引結構以及第二導引結構。基座具有容置槽。儲存裝置配置以容置於容置槽內。第一導引結構設置於儲存裝置與容置槽的內壁中之一者上。第二導引結構設置於儲存裝置與容置槽的內壁中之另一者上,並包含第一導引部以及第二導引部。第一導引部配置以導引第一導引結構沿著第一方向於容置槽之入口與容置槽內的第一位置之間移動。第二導引部配置以導引第一導引結構沿著第二方向於第一位置與容置槽內的第二位置之間移動。In order to achieve the above-mentioned purpose, according to one embodiment of the present invention, an electronic device includes a base, a storage device, a first guide structure and a second guide structure. The base has a storage tank. The storage device is configured to be accommodated in the storage tank. The first guide structure is disposed on one of the storage device and the inner wall of the storage tank. The second guide structure is disposed on the other of the storage device and the inner wall of the storage tank, and includes a first guide portion and a second guide portion. The first guide portion is configured to guide the first guide structure to move along a first direction between an entrance of the storage tank and a first position in the storage tank. The second guide portion is configured to guide the first guide structure to move along a second direction between a first position and a second position in the storage tank.
於本發明的一或多個實施方式中,第二方向實質上平行於基座的外表面。In one or more embodiments of the present invention, the second direction is substantially parallel to the outer surface of the base.
於本發明的一或多個實施方式中,電子裝置進一步包含連接器。連接器設置於基座內。儲存裝置配置以連接連接器。In one or more embodiments of the present invention, the electronic device further comprises a connector. The connector is disposed in the base. The storage device is configured to connect to the connector.
於本發明的一或多個實施方式中,當第一導引結構位於第一位置時,儲存裝置與連接器分離。當第一導引結構位於第二位置時,儲存裝置與連接器連接。In one or more embodiments of the present invention, when the first guide structure is located at the first position, the storage device is separated from the connector. When the first guide structure is located at the second position, the storage device is connected to the connector.
於本發明的一或多個實施方式中,基座具有開口。開口位於容置槽內。儲存裝置包含卡合部。當第一導引結構位於第二位置時,卡合部插入於開口。In one or more embodiments of the present invention, the base has an opening. The opening is located in the receiving groove. The storage device includes a clamping portion. When the first guide structure is located at the second position, the clamping portion is inserted into the opening.
於本發明的一或多個實施方式中,第二導引結構實質上呈L字型。In one or more embodiments of the present invention, the second guide structure is substantially L-shaped.
於本發明的一或多個實施方式中,電子裝置進一步包含卡閂件。卡閂件可移動地設置於基座上。儲存裝置具有卡槽。該卡閂件配置以卡合至卡槽。In one or more embodiments of the present invention, the electronic device further comprises a latching member. The latching member is movably disposed on the base. The storage device has a slot. The latching member is configured to be engaged with the slot.
於本發明的一或多個實施方式中,卡閂件配置以沿著第三方向相對於基座移動。當第一導引結構位於第二位置時,卡閂件與卡槽在第三方向上對位。In one or more embodiments of the present invention, the latch is configured to move relative to the base along a third direction. When the first guide structure is located at the second position, the latch is aligned with the slot in the third direction.
於本發明的一或多個實施方式中,電子裝置進一步包含彈性件。彈性件設置於容置槽內。當第一導引結構位於第二位置時,儲存裝置與彈性件分離。在第一導引結構由第二位置移動至第一位置期間,彈性件受儲存裝置擠壓而產生彈力。彈力具有平行於第一方向的分力。In one or more embodiments of the present invention, the electronic device further comprises an elastic member. The elastic member is disposed in the receiving groove. When the first guide structure is located at the second position, the storage device is separated from the elastic member. When the first guide structure moves from the second position to the first position, the elastic member is squeezed by the storage device to generate an elastic force. The elastic force has a component force parallel to the first direction.
於本發明的一或多個實施方式中,彈性件呈肋條狀。彈性件的兩端連接基座。In one or more embodiments of the present invention, the elastic member is in the shape of a rib, and two ends of the elastic member are connected to the base.
於本發明的一或多個實施方式中,彈性件具有斜面。斜面配置以受儲存裝置擠壓。In one or more embodiments of the present invention, the elastic member has an inclined surface, and the inclined surface is configured to be squeezed by the storage device.
於本發明的一或多個實施方式中,儲存裝置具有斜面。儲存裝置的斜面配置以擠壓彈性件的斜面。In one or more embodiments of the present invention, the storage device has an inclined surface, and the inclined surface of the storage device is configured to squeeze the inclined surface of the elastic member.
於本發明的一或多個實施方式中,儲存裝置的斜面受彈性件的斜面導引。彈力還具有平行於第二方向的分力。In one or more embodiments of the present invention, the inclined surface of the storage device is guided by the inclined surface of the elastic member. The elastic force also has a component force parallel to the second direction.
於本發明的一或多個實施方式中,儲存裝置具有斜面。斜面配置以擠壓彈性件。In one or more embodiments of the present invention, the storage device has an inclined surface configured to squeeze the elastic member.
於本發明的一或多個實施方式中,儲存裝置包含殼體、儲存單元以及蓋體。殼體包含底板以及連接底板的卡固結構。儲存單元限位於底板與卡固結構之間。蓋體覆蓋於儲存單元遠離底板的一側,並與卡固結構銜接。In one or more embodiments of the present invention, the storage device includes a housing, a storage unit and a cover. The housing includes a bottom plate and a clamping structure connected to the bottom plate. The storage unit is limited between the bottom plate and the clamping structure. The cover covers a side of the storage unit away from the bottom plate and is connected to the clamping structure.
於本發明的一或多個實施方式中,殼體更包含兩側牆。兩側牆連接底板。卡固結構設置於兩側牆上。儲存單元限位於兩側牆之間。In one or more embodiments of the present invention, the housing further includes two side walls. The two side walls are connected to the bottom plate. The clamping structure is disposed on the two side walls. The storage unit is limited between the two side walls.
於本發明的一或多個實施方式中,卡固結構為卡合塊。蓋體包含卡勾結構。卡勾結構與卡合塊卡合。In one or more embodiments of the present invention, the fastening structure is a locking block. The cover body includes a hook structure. The hook structure is locked with the locking block.
於本發明的一或多個實施方式中,儲存裝置更包含鎖固件。底板具有鎖固孔。鎖固件穿過蓋體並鎖固至鎖固孔。In one or more embodiments of the present invention, the storage device further comprises a locking member. The bottom plate has a locking hole. The locking member passes through the cover and is locked to the locking hole.
為了達到上述目的,依據本發明之一實施方式,一種儲存裝置包含殼體、儲存單元以及蓋體。殼體包含底板以及連接底板的卡固結構。儲存單元限位於底板與卡固結構之間。蓋體覆蓋於儲存單元遠離底板的一側,並與卡固結構銜接。To achieve the above object, according to one embodiment of the present invention, a storage device includes a housing, a storage unit and a cover. The housing includes a bottom plate and a clamping structure connected to the bottom plate. The storage unit is limited between the bottom plate and the clamping structure. The cover covers a side of the storage unit away from the bottom plate and is connected to the clamping structure.
於本發明的一或多個實施方式中,殼體更包含兩側牆。兩側牆連接底板。卡固結構設置於兩側牆上。儲存單元限位於兩側牆之間。In one or more embodiments of the present invention, the housing further includes two side walls. The two side walls are connected to the bottom plate. The clamping structure is disposed on the two side walls. The storage unit is limited between the two side walls.
於本發明的一或多個實施方式中,卡固結構為卡合塊。蓋體包含卡勾結構。卡勾結構與卡合塊卡合。In one or more embodiments of the present invention, the fastening structure is a locking block. The cover body includes a hook structure. The hook structure is locked with the locking block.
於本發明的一或多個實施方式中,儲存裝置更包含鎖固件。底板具有鎖固孔。鎖固件穿過蓋體並鎖固至鎖固孔。In one or more embodiments of the present invention, the storage device further comprises a locking member. The bottom plate has a locking hole. The locking member passes through the cover and is locked to the locking hole.
綜上所述,於本發明的電子裝置中,藉由分別在基座的容置槽內與儲存裝置上設置導引結構,儲存裝置即可在導引結構的相互導引下插入容置槽內,並與容置槽內的連接器直接插接。因此,相互導引的導引結構可避免儲存裝置在直接插接連接器時,造成連接器的損壞。並且,直接與連接器插接的儲存裝置可省略現有抽取式固態硬碟所採用的轉接板,因此在成本、重量以及系統空間等方面較為侷限的情況下,本發明的儲存裝置需要的配置空間較小,從而在使用上較具優勢。不僅如此,直接與連接器插接的儲存裝置還可降低因使用轉接板所造成的阻抗值過高及訊號衰減等問題對儲存裝置的傳輸效能造成的影響。In summary, in the electronic device of the present invention, by providing guide structures in the receiving slot of the base and on the storage device, the storage device can be inserted into the receiving slot under the mutual guidance of the guide structures and directly plugged into the connector in the receiving slot. Therefore, the mutually guiding guide structures can prevent the storage device from being damaged when the connector is directly plugged into the connector. In addition, the storage device directly plugged into the connector can omit the adapter plate used in the existing removable solid-state hard disk. Therefore, under the situation of relatively limited cost, weight and system space, the storage device of the present invention requires less configuration space, which is more advantageous in use. Furthermore, directly plugging a storage device into a connector can also reduce the impact of problems such as high impedance and signal attenuation caused by using an adapter board on the transmission performance of the storage device.
以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to explain the problem to be solved by the present invention, the technical means for solving the problem, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following implementation method and related drawings.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some commonly used structures and components will be shown in the drawings in a simple schematic manner.
請參照第1圖,其為繪示根據本發明一實施方式之電子裝置100的立體圖。如第1圖所示,電子裝置100包含基座110、顯示器120以及儲存裝置130。電子裝置100係以筆記型電腦為例,其中基座110可為其上設有鍵盤裝置的主機本體,而顯示器120可藉由例如鉸鏈裝置可轉動地連接基座110,但本發明並不以此為限。於實際應用中,電子裝置100可為其他類型的電子產品(例如,平板電腦、擴充座…等)。顯示器120配置以蓋合至基座110的一側。儲存裝置130設置於基座110遠離顯示器120的一側,但本發明並不以此為限。Please refer to FIG. 1, which is a three-dimensional diagram of an
請參照第2圖以及第3圖。第2圖為繪示第1圖中之電子裝置100的局部放大的立體分解圖。第3圖為繪示第1圖中之基座110的局部放大圖。如第2圖與第3圖所示,於本實施方式中,基座110具有容置槽111。容置槽111由基座110遠離顯示器120的一側的外表面112凹陷形成。儲存裝置130配置以容置於容置槽111內。電子裝置100進一步包含第一導引結構140以及第二導引結構150。第一導引結構140設置於儲存裝置130上。第二導引結構150設置於容置槽111的內壁111b上,並包含第一導引部151以及第二導引部152。第一導引部151配置以導引第一導引結構140沿著第一方向D1於容置槽111之入口111a與容置槽111內的第一位置之間移動。第二導引部152配置以導引第一導引結構140沿著第二方向D2於第一位置與容置槽111內的第二位置之間移動。Please refer to Figures 2 and 3. Figure 2 is a partially enlarged three-dimensional exploded view of the
請參照第4圖、第5圖以及第6圖。第4圖為繪示第2圖中之電子裝置100的剖面示意圖。第5圖為繪示第2圖中之電子裝置100的另一剖面示意圖。第6圖為繪示第2圖中之電子裝置100的又一剖面示意圖。詳言之,於第4圖所示的階段中,儲存裝置130位於容置槽111外,並正對容置槽111的入口111a。當由第4圖所示的階段進展至第5圖所示的階段時,儲存裝置130沿著第一方向D1經由容置槽111的入口111a進入容置槽111中,而第一導引結構140對應地由容置槽111的入口111a沿著第一方向D1移動至容置槽111內的第一位置。當由第5圖所示的階段進展至第6圖所示的階段時,儲存裝置130再沿著第二方向D2於容置槽111中移動,而第一導引結構140對應地由容置槽111內的第一位置沿著第二方向D2移動至容置槽111內的第二位置。由第4圖所示的階段進展至第6圖所示的階段,儲存裝置130即可安裝於基座110上。相對地,由第6圖所示的階段進展至第4圖所示的階段,儲存裝置130即可由基座110拆卸下來。Please refer to Figures 4, 5 and 6. Figure 4 is a schematic cross-sectional view of the
於一些實施方式中,第二方向D2實質上平行於基座110遠離顯示器120的一側的外表面112,但本發明並不以此為限,可依據實際需求而彈性地調整。In some implementations, the second direction D2 is substantially parallel to the
於一些實施方式中,第一方向D1與第二方向D2相互垂直,但本發明並不以此為限,可依據實際需求而彈性地調整。對應地,如第2圖與第3圖所示,第二導引結構150實質上呈L字型,但本發明並不以此為限。In some embodiments, the first direction D1 and the second direction D2 are perpendicular to each other, but the present invention is not limited thereto and can be flexibly adjusted according to actual needs. Correspondingly, as shown in FIG. 2 and FIG. 3 , the
如第2圖與第3圖所示,於一些實施方式中,第二導引結構150為導引滑槽,但本發明並不以此為限。於實際應用中,第二導引結構150可為設置於容置槽111的內壁111b上的導引凸肋。As shown in FIG. 2 and FIG. 3 , in some embodiments, the
請配合參照第3圖,基座110具有開口111c。開口111c位於容置槽111內。電子裝置100進一步包含連接器160。連接器160設置於基座110內,並由開口111c暴露出。如第5圖所示,當第一導引結構140位於第一位置時,儲存裝置130與連接器160分離。如第6圖所示,當第一導引結構140位於第二位置時,儲存裝置130與連接器160連接。詳言之,儲存裝置130包含儲存單元133。儲存單元133具有插接部133a。插接部133a配置以於第一導引結構140位於第二位置時插接至連接器160。Please refer to Figure 3, the
藉由前述結構配置,儲存裝置130即可在第一導引結構140與第二導引結構150的相互導引下插入容置槽111內,並與容置槽111內的連接器160直接插接。因此,第一導引結構140與第二導引結構150可避免儲存裝置130在直接插接連接器160時造成連接器160的損壞。並且,直接與連接器160插接的儲存裝置130可省略現有抽取式固態硬碟所採用的轉接板,因此在成本、重量以及系統空間等方面較為侷限的情況下,本實施方式的儲存裝置130需要的配置空間較小,從而在使用上較具優勢。不僅如此,直接與連接器160插接的儲存裝置130還可降低因使用轉接板所造成的阻抗值過高及訊號衰減等問題對儲存裝置130的傳輸效能造成的影響。By means of the above-mentioned structural configuration, the
如第2圖與第3圖所示,於本實施方式中,第一導引部151與第二導引部152彼此相連,但本發明並不以此為限。於實際應用中,只要能起到導引第一導引結構140的目的,第一導引部151與第二導引部152亦可彼此分離。舉例來說,第一導引部151與第二導引部152可為分離地設置於容置槽111的內壁111b上的導引凸肋,但本發明並不以此為限。As shown in FIG. 2 and FIG. 3 , in this embodiment, the
於其他實施方式中,第一導引結構140可改為設置於容置槽111的內壁111b上,且第二導引結構150設置於儲存裝置130上。藉此,第一導引結構140與第二導引結構150同樣可在儲存裝置130組裝至容置槽111的過程中達到導引的目的。In other embodiments, the
於一些實施方式中,儲存裝置130為M.2固態硬碟,但本發明並不以此為限。需說明的是,本發明沿著第二方向D2將儲存裝置130平插至連接器160的插接方式,明顯有別於現有M.2固態硬碟先斜插至連接器再相對於連接器壓平的插接方式,因此能夠避免斜插方式容易導致連接器160損壞之情形。In some embodiments, the
如第2圖與第3圖所示,並配合參照第5圖與第6圖,於本實施方式中,儲存裝置130包含卡合部131c。卡合部131c與儲存單元133的插接部133a位於儲存裝置130的同一端。當第一導引結構140位於第二位置時(即第6圖所示的階段),卡合部131c插入於開口111c。亦即,卡合部131c與開口111c此時在第一方向D1上相對。藉此,卡合部131c與開口111c可在插接部133a插接至連接器160期間提供輔助導引的作用,並可避免插接部133a在第一方向D1上相對於連接器160發生位移而導致插接部133a毀損的問題。As shown in FIG. 2 and FIG. 3, and with reference to FIG. 5 and FIG. 6, in this embodiment, the
如第2圖與第3圖所示,於本實施方式中,電子裝置100進一步包含卡閂件170。卡閂件170可移動地設置於基座110上。儲存裝置130具有卡槽131b1。該卡閂件170配置以卡合至卡槽131b1。具體來說,卡閂件170設置於基座110的外表面112上,並配置以沿著第三方向D3相對於基座110移動,進而可選擇性地突伸進入容置槽111內或離開容置槽111。另外,當第一導引結構140位於第二位置時(即第6圖所示的階段),卡閂件170與卡槽131b1在第三方向D3上對位。換言之,只有在第一導引結構140位於第二位置時,卡閂件170才能沿著第三方向D3上移動而卡合至卡槽131b1中。藉此,卡閂件170與卡槽131b1的組合可避免插接至連接器160的插接部133a沿著第二方向D2脫離連接器160,從而達到提升插接部133a與連接器160之間的插接穩定性的效果。As shown in FIG. 2 and FIG. 3 , in this embodiment, the
請參照第7圖以及第8圖。第7圖為繪示第1圖中之基座110的另一局部放大圖。第8圖為繪示第5圖的局部放大圖。如第7圖與第8圖所示,於本實施方式中,電子裝置100進一步包含彈性件180。彈性件180設置於容置槽111內。當第一導引結構140位於第二位置時(即第6圖所示的階段),儲存裝置130與彈性件180分離。在第一導引結構140由第二位置移動至第一位置期間(即由第6圖所示的階段進展至第5圖所示的階段),彈性件180受儲存裝置130擠壓而產生彈力。彈力具有平行於第一方向D1的分力。藉此,儲存裝置130沿著第二方向D2遠離連接器160移動而使插接部133a由連接器160卸除後,儲存裝置130會被彈性件180平行於第一方向D1的分力頂起而部分地突伸於容置槽111外,從而便於使用者將儲存裝置130由容置槽111取出。Please refer to FIG. 7 and FIG. 8. FIG. 7 is another partial enlarged view of the base 110 in FIG. 1. FIG. 8 is a partial enlarged view of FIG. 5. As shown in FIG. 7 and FIG. 8, in this embodiment, the
如第7圖所示,於本實施方式中,彈性件180呈肋條狀。彈性件180的兩端連接基座110。於一些實施方式中,彈性件180與基座110為單體結構的不同部位,亦即兩者為一體成形,但本發明並不以此為限。彈性件180在其兩端之間的部位懸空於基座110上,並可受力而彈性變形。As shown in FIG. 7 , in this embodiment, the
於一些實施方式中,彈性件180的材料包含塑料,但本發明並不以此為限。於實際應用中,彈性件180的材料可包含金屬。舉例來說,彈性件180可為彈簧或彈片等可提供彈力的元件。In some embodiments, the material of the
如第7圖與第8圖所示,於本實施方式中,彈性件180具有斜面181。儲存裝置130具有斜面132a。儲存裝置130的斜面132a配置以擠壓彈性件180的斜面181。藉此,由第4圖所示的階段進展至第6圖所示的階段時(即組裝程序),以及由第6圖所示的階段進展至第4圖所示的階段時(即拆卸程序),儲存裝置130的斜面132a都會受彈性件180的斜面181導引。As shown in FIGS. 7 and 8 , in this embodiment, the
詳言之,彈性件180由於具有斜面181,因此在受壓時所產生的彈力除了具有平行於第一方向D1的分力之外,也會具有平行於第二方向D2的分力。如前所述,由第6圖進展至第4圖的拆卸過程,儲存裝置130會被平行於第一方向D1的分力頂起而部分地突伸於容置槽111外,此時第一導引結構140會沿著第一方向D1由容置槽111內的第一位置往容置槽111的入口111a移動。相對地,由第4圖進展至第6圖的組裝過程,儲存裝置130會被平行於第二方向D2的分力平推而使得插接部133a插接至連接器160,此時第一導引結構140會沿著第二方向D2由容置槽111內的第一位置移動至第二位置。In detail, since the
請參照第9圖、第10圖以及第11圖。第9圖為繪示第2圖中之儲存裝置130的立體圖。第10圖為繪示第8圖中之儲存裝置130的分解圖。第11圖為繪示第8圖中之儲存裝置130的另一分解圖。如第9圖至第11圖所示,於本實施方式中,儲存裝置130除了儲存單元133之外,還進一步包含殼體131以及蓋體134。殼體131包含底板131a以及連接底板131a的卡固結構131d。具有斜面132a的凸塊132亦連接底板131a。儲存單元133限位於底板131a與卡固結構131d之間。蓋體134覆蓋於儲存單元133遠離底板131a的一側,並與卡固結構131d銜接。藉此,本實施方式的儲存裝置130無須使用轉接板即可達到對儲存單元133定位及固定的目的。Please refer to Figures 9, 10 and 11. Figure 9 is a three-dimensional diagram of the
具體來說,殼體131進一步包含兩側牆131b。兩側牆131b連接底板131a,並彼此相對。卡固結構131d設置於兩側牆131b的相向側上。第一導引結構140設置於兩側牆131b的相反側上。亦即,卡固結構131d是經由側牆131b而連接至底板131a。儲存單元133的本體限位於兩側牆131b之間。另外,殼體131進一步包含兩擋牆131e。兩擋牆131e連接底板131a,並彼此相對。儲存單元133的本體還限位於兩擋牆131e之間。儲存單元133的插接部133a越過其中一個擋牆131e。藉此,兩側牆131b與兩擋牆131e即可限制儲存單元133沿著平行於底板131a的任一方向相對於底板131a的移動。另外,卡固結構131d可限制儲存單元133遠離底板131a的移動。Specifically, the
如第11圖所示,於本實施方式中,每一擋牆131e的兩端分別連接兩側牆131b,但本發明並不以此為限。於實際應用中,兩側牆131b與兩擋牆131e可彼此分離。As shown in FIG. 11 , in this embodiment, two ends of each baffle 131e are respectively connected to two
如第11圖所示,於本實施方式中,卡固結構131d為卡合塊。蓋體134包含卡勾結構134a。卡勾結構134a與卡合塊卡合。藉此,卡固結構131d除了可將儲存單元133限位於底板131a上以使儲存單元133與殼體131相互固定之外,還可與蓋體134的卡勾結構134a卡合而使殼體131與蓋體134相互固定。As shown in FIG. 11 , in this embodiment, the
如第11圖所示,於本實施方式中,儲存裝置130更包含鎖固件135。底板131a具有鎖固孔131a1。鎖固件135穿過蓋體134並鎖固至鎖固孔131a1。藉此,即可防止相互卡合的卡固結構131d與卡勾結構134a分離。舉例來說,鎖固件135為螺絲,但本發明並不以此為限。As shown in FIG. 11 , in this embodiment, the
由以上對於本發明之具體實施方式之詳述,可以明顯地看出,於本發明的電子裝置中,藉由分別在基座的容置槽內與儲存裝置上設置導引結構,儲存裝置即可在導引結構的相互導引下插入容置槽內,並與容置槽內的連接器直接插接。因此,相互導引的導引結構可避免儲存裝置在直接插接連接器時,造成連接器的損壞。並且,直接與連接器插接的儲存裝置可省略現有抽取式固態硬碟所採用的轉接板,因此在成本、重量以及系統空間等方面較為侷限的情況下,本發明的儲存裝置需要的配置空間較小,從而在使用上較具優勢。不僅如此,直接與連接器插接的儲存裝置還可降低因使用轉接板所造成的阻抗值過高及訊號衰減等問題對儲存裝置的傳輸效能造成的影響。From the above detailed description of the specific implementation of the present invention, it can be clearly seen that in the electronic device of the present invention, by respectively providing a guide structure in the receiving slot of the base and on the storage device, the storage device can be inserted into the receiving slot under the mutual guidance of the guide structure and directly plugged into the connector in the receiving slot. Therefore, the mutually guiding guide structures can avoid damage to the connector when the storage device is directly plugged into the connector. In addition, the storage device directly plugged into the connector can omit the adapter plate used in the existing removable solid-state hard disk. Therefore, under the situation of relatively limited cost, weight and system space, the storage device of the present invention requires a smaller configuration space, which is more advantageous in use. Furthermore, directly plugging a storage device into a connector can also reduce the impact of problems such as high impedance and signal attenuation caused by using an adapter board on the transmission performance of the storage device.
雖然本發明已以實施方式揭露如上,然其並不用以限定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.
100:電子裝置
110:基座
111:容置槽
111a:入口
111b:內壁
111c:開口
112:外表面
120:顯示器
130:儲存裝置
131:殼體
131a:底板
131a1:鎖固孔
131b:側牆
131b1:卡槽
131c:卡合部
131d:卡固結構
131e:擋牆
132:凸塊
132a,181:斜面
133:儲存單元
133a:插接部
134:蓋體
134a:卡勾結構
135:鎖固件
140:第一導引結構
150:第二導引結構
151:第一導引部
152:第二導引部
160:連接器
170:卡閂件
180:彈性件
D1:第一方向
D2:第二方向
D3:第三方向
100: electronic device
110: base
111:
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為繪示根據本發明一實施方式之電子裝置的立體圖。 第2圖為繪示第1圖中之電子裝置的局部放大的立體分解圖。 第3圖為繪示第1圖中之基座的局部放大圖。 第4圖為繪示第2圖中之電子裝置的剖面示意圖。 第5圖為繪示第2圖中之電子裝置的另一剖面示意圖。 第6圖為繪示第2圖中之電子裝置的又一剖面示意圖。 第7圖為繪示第1圖中之基座的另一局部放大圖。 第8圖為繪示第5圖的局部放大圖。 第9圖為繪示第2圖中之儲存裝置的立體圖。 第10圖為繪示第8圖中之儲存裝置的分解圖。 第11圖為繪示第8圖中之儲存裝置的另一分解圖。 In order to make the above and other purposes, features, advantages and embodiments of the present invention more clearly understandable, the attached drawings are described as follows: FIG. 1 is a three-dimensional diagram of an electronic device according to an embodiment of the present invention. FIG. 2 is a three-dimensional exploded diagram of a partial enlargement of the electronic device in FIG. 1. FIG. 3 is a partial enlargement of the base in FIG. 1. FIG. 4 is a cross-sectional schematic diagram of the electronic device in FIG. 2. FIG. 5 is another cross-sectional schematic diagram of the electronic device in FIG. 2. FIG. 6 is another cross-sectional schematic diagram of the electronic device in FIG. 2. FIG. 7 is another partial enlargement of the base in FIG. 1. FIG. 8 is a partial enlargement of FIG. 5. FIG. 9 is a three-dimensional diagram of the storage device in FIG. 2. FIG. 10 is an exploded view of the storage device in FIG. 8. FIG. 11 is another exploded view of the storage device in FIG. 8.
110:基座 110: Base
111:容置槽 111: Storage tank
111a:入口 111a: Entrance
111b:內壁 111b: Inner wall
112:外表面 112: External surface
130:儲存裝置 130: Storage device
131:殼體 131: Shell
131b1:卡槽 131b1: Card slot
131c:卡合部 131c: snap-fitting part
181:斜面 181: Slope
140:第一導引結構 140: First guide structure
150:第二導引結構 150: Second guide structure
151:第一導引部 151: First guide section
152:第二導引部 152: Second guide section
170:卡閂件 170: latch
180:彈性件 180: Elastic parts
D1:第一方向 D1: First direction
D2:第二方向 D2: Second direction
D3:第三方向 D3: Third direction
Claims (17)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112151747A TWI871160B (en) | 2023-12-29 | 2023-12-29 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112151747A TWI871160B (en) | 2023-12-29 | 2023-12-29 | Electronic device |
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| Publication Number | Publication Date |
|---|---|
| TWI871160B true TWI871160B (en) | 2025-01-21 |
| TW202526564A TW202526564A (en) | 2025-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112151747A TWI871160B (en) | 2023-12-29 | 2023-12-29 | Electronic device |
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| Country | Link |
|---|---|
| TW (1) | TWI871160B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080253065A1 (en) * | 2007-04-13 | 2008-10-16 | Inventec Corporation | Fixing mechanism |
| TWM563061U (en) * | 2018-03-23 | 2018-07-01 | 煜頂精密股份有限公司 | Solid state disk structure |
| TWM597966U (en) * | 2020-02-05 | 2020-07-01 | 陳俊銘 | Solid-state hard disk snap-in structure |
| KR20210152914A (en) * | 2020-06-09 | 2021-12-16 | 삼성전자주식회사 | Memory device and electroic device including the same |
| TWM630943U (en) * | 2022-01-22 | 2022-08-21 | 宏碁股份有限公司 | Hard disk drive carrier and chassis having the same |
-
2023
- 2023-12-29 TW TW112151747A patent/TWI871160B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080253065A1 (en) * | 2007-04-13 | 2008-10-16 | Inventec Corporation | Fixing mechanism |
| TWM563061U (en) * | 2018-03-23 | 2018-07-01 | 煜頂精密股份有限公司 | Solid state disk structure |
| TWM597966U (en) * | 2020-02-05 | 2020-07-01 | 陳俊銘 | Solid-state hard disk snap-in structure |
| KR20210152914A (en) * | 2020-06-09 | 2021-12-16 | 삼성전자주식회사 | Memory device and electroic device including the same |
| TWM630943U (en) * | 2022-01-22 | 2022-08-21 | 宏碁股份有限公司 | Hard disk drive carrier and chassis having the same |
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| Publication number | Publication date |
|---|---|
| TW202526564A (en) | 2025-07-01 |
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