TWI833901B - Processing methods of processed objects - Google Patents

Abstract

When the transport pallet is of a specific type, information can be written into the recording medium.

move The tray 1 accommodates and transports a plurality of component wafers 204 . The transfer tray 1 is provided with a tray body 2 which has a component support part 6 having a surface 6 - 1 for supporting a plurality of component wafers 204 and a frame 7 which surrounds the outer periphery of the component support part 6 The recording medium 4 is provided on the tray body 2 and can write or read information through wireless communication; and the identification mark 5 identifies whether the transport tray 1 is of a type that can write information on the recording medium 4 .

Description

Processing methods of processed objects

The present invention relates to a transfer tray for accommodating processed wafers and a processing method of a workpiece.

In the semiconductor industry, for example, there is a process in which a plurality of wafers divided by a dicing device are accommodated in one tray and transported to the next step (see, for example, Patent Document 1). At this time, in order to transmit the information during processing to the next step, a frame as a transportation means has been developed, which has an RFID (Radio Frequency Identifier, Radio Frequency Identification) tag (for example, see Patent Document 2).

[Prior technical literature]

[Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2000-095291

[Patent Document 2] Japanese Patent Application Publication No. 2008-040810

However, when the provider of the processing equipment recommends the use of a specific transfer pallet, it is required to allow information such as processing information to be written in the recording medium only when the recommended transfer pallet is used, and to manage the quality of the divided wafers. In this way, in the conveyance means shown in Patent Document 2, it is desirable to write information in the recording medium when the conveyance means is of a specific type.

The present invention was made in view of the above-mentioned problems, and an object thereof is to provide a transport pallet that can write information on a recording medium when the transport pallet is of a specific type, and a processing method of a workpiece.

In order to solve the above-mentioned problems and achieve the object, the transfer tray of the present invention is a transfer tray that accommodates a plurality of wafers and carries them, and is characterized in that it includes: a tray body, which is provided with a component support part and a frame, and the component support part has a support structure for supporting multiple wafers. On the surface of a chip, the frame system is formed around the periphery of the component support part; a recording medium is provided on the tray body and can write or read information through wireless communication; and an identification mark identifies whether the transfer tray is acceptable. The type of recording medium to write to.

The transfer tray may also be provided with an adhesive layer, which is installed on the surface of the component support portion of the tray body and has adhesive force.

The processing method of a workpiece of the present invention is a processing method of a workpiece that accommodates wafers on the transfer tray, and is characterized by comprising: a processing step of processing the workpiece to form a plurality of wafers; and an accommodation step of processing the workpiece into a plurality of wafers; The plurality of wafers are accommodated in the transfer tray; the determination step is to capture the identification mark with a camera and determine whether the transfer tray is of a type that can be written into the recording medium; and the recording step is to determine whether the transfer tray is of a type that can be written to. In the writing type, the information in the processing step is recorded on the recording medium.

In the processing method of the workpiece, the transfer pallet may also be provided with an adhesive layer. The adhesive layer is installed on the surface of the component support part of the pallet body and has adhesive force.

The invention of this application has the following effect: when the transport pallet is of a specific type, information can be written into a recording medium.

The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural requirements described below include structures that can be easily imagined by a person with ordinary knowledge in the art and substantially the same structures. In addition, the structures described below can be combined appropriately. In addition, various omissions, substitutions, or changes in the structure may be made without departing from the gist of the present invention.

[Embodiment 1] A method of processing a transport pallet and a workpiece according to Embodiment 1 of the present invention will be described based on the drawings. FIG. 1 is a perspective view showing a structural example of a transport pallet according to Embodiment 1. FIG. 2 is a perspective view showing a structural example of the processing device using the transport pallet according to Embodiment 1. FIG. 3 is a perspective view showing an example of a workpiece to be processed by the processing apparatus shown in FIG. 2 . FIG. 4 is a cross-sectional view showing a state in which component wafers are accommodated in the transfer tray shown in FIG. 1 . FIG. 5 is a flowchart showing the flow of the processing method of the workpiece according to the first embodiment. FIG. 6 is a diagram schematically showing, in partial cross-section, the identification steps and recording steps of the processing method of the workpiece shown in FIG. 5 .

The transport pallet 1 shown in FIG. 1 of Embodiment 1 is used in the processing device 210 shown in FIG. 2 . The processing device 210 shown in FIG. 2 is a device that cuts the workpiece 200 shown in FIG. 3 . As shown in FIG. 3 , the workpiece 200 to be processed by the processing device 210 in Embodiment 1 is formed into a rectangular flat plate shape in plan view. In Embodiment 1, as shown in FIG. 3 , the workpiece 200 is a plurality of packages sealed with resin such as CSP (Chip Size Package, wafer level package) or QFN (Quad Flat Non-leaded package, Quad Flat Non-leaded package). A so-called packaging substrate composed of semiconductor wafers.

The electrodes of each semiconductor chip are respectively connected to the plurality of bumps 202 . A plurality of planned dividing lines 203 are formed in a grid shape on the surface of the workpiece 200 , and semiconductor wafers are mounted in each area divided by the planned dividing lines 203 . The workpiece 200 configured in the above manner is divided into individual element wafers (corresponding to the wafers described in the patent application) 204 by cutting the planned dividing lines 203 by the processing device 210 shown in FIG. 2 .

Next, this specification describes the processing device 210 that divides the workpiece 200 into element wafers 204. The processing device 210 is a device that holds the workpiece 200 on the holding table 10 and performs cutting processing along a plurality of planned dividing lines 203 . In Embodiment 1, the processing device 210 is a device that holds the workpiece 200 to which a dicing film is not attached on the holding table 10 and performs so-called complete cutting of the workpiece 200 to divide the workpiece 200 into element wafers 204 .

As shown in FIG. 2 , the processing device 210 is provided with: a holding table 10 that attracts and holds a workpiece 200 with a holding surface 11 ; and a cutting unit 20 that uses a cutting blade 21 to divide the workpiece 200 that is attracted and held on the holding table 10 . A cutting means for cutting and dividing the predetermined line 203; and a control unit 100.

The holding table 10 is formed in a rectangular shape and includes a holding surface 11 for holding the workpiece 200 . The holding surface 11 is provided with: a suction opening (not shown in the figure) for attracting the workpiece 200 and the component chip 204; and a retraction groove (not shown in the figure) for retracting the cutting blade 21. The suction port is provided at a position overlapping the element wafer 204 and opens on the holding surface 11 . The escape groove is provided at a position corresponding to the planned dividing line 203 and is formed to be recessed from the holding surface 11 .

The suction port of the holding table 10 is connected to a vacuum suction source (not shown in the figure). The suction port is attracted by the vacuum suction source, whereby the workpiece 200 is attracted and held on the holding surface 11 . In addition, the holding table 10 is provided to be freely movable in the X-axis direction by a processing and feeding unit not shown in the figure and to be freely rotatable around an axis parallel to the Z-axis direction by a rotational drive source not shown in the figure.

The cutting unit 20 is a member that cuts the workpiece 200 . The cutting unit 20 has a spindle (not shown), and a cutting blade 21 for cutting the workpiece 200 held on the holding table 10 is mounted thereon.

The cutting blade 21 is an extremely thin cutting grindstone having a substantially annular shape. The spindle rotates the cutting blade 21 to cut the workpiece 200 . The spindle is accommodated in the spindle housing 22 . The main axis of the cutting unit 20 and the axis center of the cutting blade 21 are set parallel to the Y-axis direction.

The cutting unit 20 is arranged to move freely in the Y-axis direction with respect to the workpiece 200 held by the holding table 10 by an indexing feed unit not shown in the figure, and is arranged to cut through an indexing feed unit not shown in the figure. The feeding unit can move freely in the Z-axis direction. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 through the indexing feeding unit and the cutting feeding unit. The cutting unit 20 moves in the Y-axis direction and the Z-axis direction using the indexing feed unit and the cutting feed unit, thereby holding the workpiece 200 held by the holding table 10 that moves in the X-axis direction using the processing feed unit. The workpiece 200 is divided into a plurality of element wafers 204 by cutting along the planned division lines 203 .

In addition, the processing device 210 is provided with: a cassette 30 that accommodates a plurality of processed objects 200 before processing; an unloading unit 40 that takes out the processed objects 200 from the cassette 30; and a package transport unit 50 that takes out the processed objects from the cassette 30. The workpiece 200 before processing is transported to the holding table 10; the camera unit 60 photographs the workpiece 200 before processing to obtain an image for alignment; the cleaning unit 70 cleans the bottom surface of the individual component wafers 204. ; The drying unit 80 dries the component wafer 204 cleaned by the cleaning unit 70 ; the transport tray mounting portion 90 is used to mount the transport tray 1 shown in FIG. 3 for accommodating the divided component wafers 204 ; the transport unit 110, which is a conveying means; and the tray imaging unit 120, which is an imaging means.

The cassette 30 is a member that accommodates a plurality of workpieces 200 . In the cassette 30, a plurality of workpieces 200 are overlapped with intervals in the Z-axis direction. The cassette 30 is provided with an opening 31 for freely taking out and feeding the workpiece 200 . The cassette 30 is configured to be freely raised and lowered in the Z-axis direction by a cassette lift (not shown in the figure).

The unloading unit 40 is equipped with: an unloading means 41 for taking out one piece of the workpiece 200 before processing from the cassette 30 ; and a pair of slide rails 42 for temporarily placing the workpiece 200 taken out from the cassette 30 . The package transport unit 50 attracts and holds the workpiece 200 on the pair of slide rails 42 , transports the suctioned and held workpiece 200 to the holding table 10 , and places it on the holding surface 11 of the holding table 10 . The camera unit 60 outputs the captured image to the control unit 100 . In Embodiment 1, the imaging unit 60 is attached to the package transport unit 50 . The cleaning unit 70 is provided between the holding table 10 and the transport tray placement part 90 . The drying unit 80 is provided between the cleaning unit 70 and the transport tray mounting part 90 .

The transport tray 1 is placed on the upper surface 91 of the transport tray placement portion 90 . In Embodiment 1, two transport tray placement parts 90 are provided with a gap in the Y-axis direction. The upper surface 91 of the transport pallet placing part 90 is formed flat along the horizontal direction and is larger than the planar shape of the workpiece 200 and the transport pallet 1 . In addition, a plurality of transport pallets 1 can be stacked and accommodated in the transport pallet mounting section 90. In order to place the transport pallets 1 downward, the transport pallet mounting section 90 may further be equipped with a lifting means capable of moving up and down. Furthermore, in order to take out the stacked plurality of transport pallets 1 , a door for opening and closing connected to the transport tray placement part 90 may be provided on the front surface of the device.

The transfer unit 110 is a member that transfers the cut workpiece 200 , that is, the plurality of element wafers 204 , from the holding table 10 to the transfer tray 1 placed on the upper surface 91 of the transfer tray placement portion 90 . As shown in FIG. 2 , the transport unit 110 includes a first transport unit 111 , a second transport unit 112 , and a third transport unit 113 .

The first transport unit 111 transports the cut workpiece 200 , that is, the plurality of element wafers 204 , from the holding table 10 to the cleaning unit 70 . The second transport unit 112 transports the cleaned workpiece 200 , that is, the plurality of element wafers 204 , from the cleaning unit 70 to the drying unit 80 . The third transport unit 113 transports the dried workpiece 200 , that is, the plurality of element wafers 204 , from the drying unit 80 to the transport tray 1 placed on the upper surface 91 of the one transport tray mounting part 90 .

The pallet camera unit 120 takes an image of the identification mark (shown in FIG. 4 ) 5 of the transport pallet 1 placed on the upper surface 91 of the transport pallet placement part 90 after accommodating the workpiece 200, and obtains an image of the identification mark 5. The tray camera unit 120 outputs the acquired image to the control unit 100 . In Embodiment 1, the tray imaging unit 120 is attached to the 3rd conveyance unit 113.

The transfer tray 1 placed on the upper surface 91 of the transfer tray placement portion 90 is a member for accommodating and transporting a plurality of element wafers 204 formed by dividing the workpiece 200 along the planned division lines 203 . As shown in FIGS. 1 and 4 , the transport pallet 1 includes a tray body 2 , an adhesive layer 3 , a recording medium 4 (only shown in FIG. 4 ), and an identification mark 5 (only shown in FIG. 4 ).

The tray body 2 includes a component support portion 6 formed into a rectangular flat plate shape and composed of a recessed portion large enough to accommodate the workpiece 200; and a frame 7 formed around the outer periphery of the component support portion 6.

The component support portion 6 is composed of a recessed portion recessed from the upper surface of the transfer tray 1. In the first embodiment, the component support portion 6 is formed into a rectangle larger than the planar shape of the workpiece 200. The component support part 6 has a surface 6 - 1 at the bottom that supports a plurality of component chips 204 through the adhesive layer 3 . The surface 6-1 is formed flat along the horizontal direction. The surface 6 - 1 of the element support portion 6 is configured to accommodate all the element wafers 204 singulated from the workpiece 200 at one time.

The frame 7 is formed around the outer periphery of the surface 6 - 1 of the component support portion 6 . The adhesive layer 3 is provided on the surface 6-1 of the component support part 6 of the tray body 2, and is installed on the surface 6-1 of the component support part 6. The adhesive layer 3 is exposed on the element support portion 6 .

The adhesive layer 3 is a member having adhesive force (that is, adhesive force) for bonding the plurality of element chips 204 . In Embodiment 1, the adhesive layer 3 is disposed on the entire surface 6-1 of the element support portion 6 and has a certain thickness. The adhesive layer 3 can be composed of, for example, a temperature-sensitive adhesive sheet Intelimer (registered trademark) film manufactured by Nitta Co., Ltd.

The recording medium 4 is installed in the tray body 2 . In Embodiment 1, as shown in FIG. 4 , the recording medium 4 is embedded in the tray body 2 . The recording medium 4 can write information from the outside through wireless communication, and records information written from the outside through wireless communication. The recording medium 4 can read recorded information from the outside through wireless communication. In Embodiment 1, the recording medium 4 is an RFID (Radio Frequency Identifier) tag, but the present invention is not limited to the RFID tag.

The identification mark 5 is a member for identifying whether the transport tray 1 is of a type capable of writing information on the recording medium 4 . In Embodiment 1, the identification mark 5 is provided on the frame 7 . In Embodiment 1, the identification mark 5 is a mark indicating the manufacturing company of the processing device 210. For example, a registered trademark of the manufacturing company showing the processing device 210 is used. However, the present invention is not limited to this. The identification mark 5 may be formed by printing marks, numbers, or characters, for example, or may be formed by concavities and convexities formed on the frame 7 or the like, cuts formed on the frame 7 or the like, or the like.

As shown in FIG. 4 , the transport pallet 1 having the above structure sticks a plurality of component wafers 204 of the workpiece 200 into individual parts on the adhesive layer 3 and accommodates them all at once. In this way, the transfer tray 1 accommodating a plurality of component wafers 204 has each component wafer 204 adhered to the adhesive layer 3. Therefore, the component wafer 204 accommodated in the component support part 6 can be prevented from moving and contacting other component wafers 204 during transport. As a result, the outer periphery of the element wafer 204 may be chipped, or the element wafer 204 may fly out from the element support part 6 and be damaged. Furthermore, in Embodiment 1, in the transfer tray 1, the component support portion 6 is not provided with a partition that separates the component wafers 204 from each other.

The control unit 100 controls each component of the processing device 210 so that the processing device 210 performs processing operations on the workpiece 200 . As shown in FIG. 2 , the control unit 100 includes a memory means 101 , a determination means 102 , and a writing means 103 .

The memory means 101 stores the image of the identification mark 5 . In Embodiment 1, the storage means 101 stores the image of the identification mark 5 of the conveyance pallet 1 captured by the pallet imaging unit 120 . Furthermore, in Embodiment 1, the storage means 101 stores processing content information (corresponding to information in processing step ST1 described below) that displays conditions when the processing device 210 processes the object 200 and the element wafer 204 .

The determination means 102 determines whether the transport tray 1 placed on the transport tray placement section 90 photographed by the tray imaging unit 120 is of a type in which information can be written into the recording medium 4 . In Embodiment 1, if the image of the identification mark 5 of the transport pallet 1 placed on the transport pallet mounting part 90 captured by the tray imaging unit 120 matches the image of the identification mark 5 stored in the storage means, the determination means 102 It is determined that the transport tray 1 placed on the transport tray placement section 90 is of a type capable of writing information on the recording medium 4 . In addition, in Embodiment 1, the determination means 102 compares the image of the identification mark 5 of the transport pallet 1 mounted on the transport pallet mounting part 90 photographed by the tray imaging unit 120 with the image of the identification mark 5 stored in the memory means. Normalized correlation, if the correlation value is greater than a preset predetermined value, it is determined that the images are consistent, and the transport tray 1 placed on the transport tray placement unit 90 is determined to be of a type that can write information on the recording medium 4 .

Furthermore, in Embodiment 1, the determination means 102 compares the image of the identification mark 5 of the transport pallet 1 placed on the transport pallet placement section 90 captured by the tray imaging unit 120 with the image of the identification mark 5 stored in the storage means. If the correlation value is less than a preset predetermined value, it is determined that the images are inconsistent, and further it is determined that the transport tray 1 placed on the transport tray placement section 90 is not of a type that can write information on the recording medium 4 .

If the determination means 102 determines that the transport tray 1 placed on the transport tray placement section 90 is of a type that can write information on the recording medium 4, the writing means 103 reads the information displayed on the transport tray placement section from the memory means 101. The processing content information of the conditions when processing the component wafer 204 in the transfer tray 1 of the unit 90 is output to the recording means 104 connected to the control unit 100 .

The recording means 104 writes the processing content information from the writing means 103 to the recording medium 4 placed on the transport tray 1 of the transport tray placement section 90 . The recording means 104 is composed of, for example, a conventional RFID tag reader.

The control unit 100 is connected to a display device 105, which is composed of a liquid crystal display device that displays the status or image of the processing operation, and an input device 106, which is used when the operator registers processing content information, etc. . The input device 106 is composed of an external input device 107 such as a touch panel and a keyboard provided on the display device 105 .

In addition, the control unit 100 is a computer having the following components: a computing device, including a microprocessor such as a CPU (central processing unit, central processing unit); a memory device, such as a ROM (read only memory, read-only memory) ) or RAM (random access memory, random access memory) and other memories; and input and output interface devices. The arithmetic processing device of the control unit 100 performs arithmetic processing according to the computer program stored in the memory device, and outputs the control signal for controlling the processing device 210 to the above-mentioned components of the processing device 210 through the input and output interface device.

The function of the memory means 101 can be realized by storing the processing content information and the image of the identification mark 5 in the memory device. The functions of the determining means 102 and the writing means 103 can be realized by using the arithmetic processing device to perform arithmetic processing according to the computer program stored in the memory device.

Next, the processing operation of the processing device 210 according to Embodiment 1 will be described. The operator accommodates the workpiece 200 before cutting processing in the cassette 30 , places the transport pallet 1 on the transport tray placement part 90 , and operates the input device 106 to register the processing content information in the control unit 100 . When the control unit 100 receives a processing operation start instruction from the operator, the processing device 210 starts the processing operation. During the processing operation, the control unit 100 sequentially executes the processing method of the workpiece 200 shown in FIG. 5 on the workpiece 200 in the cassette 30 .

The processing method of the workpiece is a method of accommodating the element wafer 204 on the transfer tray 1. As shown in FIG. 5, it includes a processing step ST1, an accommodating step ST2, a determining step ST3, and a recording step ST4. The processing step ST1 is a step of cutting the workpiece 200 to form a plurality of element wafers 204 . In the processing step ST1 , the processing device 210 causes the unloading unit 40 to take out one workpiece 200 from the cassette 30 , and causes the package transport unit 50 to transport the workpiece 200 from the slide rail 42 to the holding table 10 . In the processing step ST1, the processing device 210 uses the vacuum suction source to attract and hold the workpiece 200 on the holding surface 11 of the holding table 10, moves the holding table 10 toward the bottom of the imaging unit 60 by the processing feeding unit, and moves the imaging unit 60 shoots the object to be processed 200 and performs alignment.

In the processing step ST1, the processing device 210 uses the processing feed unit, the indexing feed unit, the cutting feed unit and the rotation drive source to make the cutting unit 20 and the holding table 10 face each other along the planned division line 203 according to the processing content information. While moving, the cutting blade 21 cuts into the planned dividing line 203 until it reaches the escape groove, thereby cutting the planned dividing line 203 .

In the processing step ST1, after the dicing blade 21 cuts all the planned dividing lines 203, the processing device 210 causes the component wafer 204 on the holding table 10 to be suctioned and held by the holding table 10 in the first conveyance state. Unit 111. The processing device 210 releases the suction and holding of the holding table 10 and transports the component wafer 204 held by suction and suction in the first transfer unit 111 to the cleaning unit 70 at once.

In the processing step ST1 , after the processing device 210 cleans the component wafer 204 in the cleaning unit 70 , the cleaned component wafer 204 is sucked and held in the second transport unit 112 and transported to the drying unit 80 . After drying the device wafer 204 in the drying unit 80, the processing device 210 proceeds to the accommodation step ST2.

The accommodating step ST2 is a step of accommodating the plurality of element wafers 204 on the transfer tray 1 . In the accommodation step ST2, the processing device 210 suctions and holds the cut, cleaned and dried element wafer 204 in the third transport unit 113, and transports it to the transport tray 1 placed on the transport tray placement section 90.

In the accommodating step ST2, the processing device 210 pushes the component wafer 204 held by the third transport unit 113 against the adhesive layer 3 of the transport tray 1, so that the component wafer 204 is adhered to the adhesive layer 3, and then releases the third transport unit 113. The attraction is maintained and the judgment step ST3 is entered.

The determination step ST3 is to use the tray camera unit 120 to capture the identification mark 5 of the transport tray 1 which is placed on the transport tray placement section 90 and accommodates a plurality of component wafers 204, and to determine whether the transport tray 1 is a writable recording medium 4 Kinds of steps. In Embodiment 1, in the determination step ST3, as shown in FIG. 6 , the processing device 210 uses the tray imaging unit 120 to capture the identification mark of the transfer tray 1 placed on the transfer tray mounting portion 90 and accommodating the plurality of component wafers 204. 5. In the processing device 210, the determination means 102 determines whether the image of the identification mark 5 of the transport pallet 1 placed on the transport pallet mounting part 90 photographed by the tray camera unit 120 matches the image of the identification mark 5 stored in the memory means. If it is determined that they match, it is determined that the transport tray 1 placed on the transport tray placement section 90 is of a type capable of writing information on the recording medium 4, and the process proceeds to recording step ST4.

The recording step ST4 is a step of recording the processing content information in the processing step ST1 on the recording medium 4 when the determining means 102 determines that the type of the transport pallet 1 is a type capable of writing information on the recording medium. In the recording step ST4, in the processing device 210, the writing means 103 reads the processing content information indicating the conditions for processing the component wafer 204 placed in the transfer tray 1 of the transfer tray mounting section 90 from the storage means 101, and Output to the recording means 104 connected to the control unit 100. In the recording step ST4, in the processing device 210, the recording means 104 writes the processing content information from the writing means 103 into the recording medium 4 placed on the transport tray 1 of the transport tray placement section 90, and the processing method of the workpiece is completed. .

Furthermore, in the processing method of the workpiece described in Embodiment 1, in the determination step ST3, the determination means 102 determines the identification mark of the transport pallet 1 placed on the transport pallet mounting part 90 photographed by the tray imaging unit 120. 5 is inconsistent with the image of the identification mark 5 stored in the memory means, and it is further determined that the transport tray 1 placed on the transport tray placement section 90 is not of a type that can write information on the recording medium 4, and the process ends.

The component wafer 204 has been pasted on the transport tray 1 of the adhesive layer 3, and is transported to the next step by the operator. The transport tray 1 has been transported to the next step, and is placed in the transport tray mounting part 90 by the operator. New transfer pallet 1. The component chips 204 adhered to the adhesive layer 3 of the transport tray 1 transported to the next step are respectively picked up from the adhesive layer 3 .

The processing device 210 cuts the next workpiece 200 and cuts the workpieces 200 in the cassette 30 sequentially. If all the workpieces 200 in the cassette 30 are cut, the processing operation ends. .

The transport pallet 1 according to Embodiment 1 is provided with an identification mark 5 for identifying whether the type of recording medium 4 can be written with information. Therefore, by obtaining an image of the identification mark 5, it can be determined whether the type of recording medium 4 can be written with information on the processing content. Types of media 4. As a result, when the transport tray 1 is of a specific type, information can be written into the recording medium 4 .

In addition, the transfer tray 1 of Embodiment 1 is provided with the adhesive layer 3, so that the component wafer 204 accommodated in the component support part 6 can be prevented from moving and coming into contact with other component wafers 204 during transport, resulting in chipping on the outer periphery of the component wafer 204. Or the element wafer 204 may fly out from the element support part 6 and be damaged.

The processing method of the workpiece in Embodiment 1 includes a determination step ST3 and a recording step ST4, wherein the determination step ST3 is to use the tray camera unit 120 to photograph the transportation of a plurality of component wafers 204 placed on the transportation tray placement portion 90 The identification mark 5 of the pallet 1 is used to determine whether the transport pallet 1 is of a type in which information can be written on the recording medium 4; in this recording step ST4, when it is determined that the type of the transport pallet 1 is a type in which information can be written, the processing step ST1 The processing content information in is recorded in the recording medium 4; therefore, when the transport pallet 1 is of a specific type, the information can be written into the recording medium 4.

In addition, the present invention is not limited to the above-described embodiment. That is, various modifications can be made without departing from the gist of the present invention. In addition, in Embodiment 1, the transfer tray 1 is a tray in which no partitions are formed on the component support portion 6 to separate the component wafers 204 from each other. However, the present invention is not limited to being held by the adhesive layer 3 without partitions. The tray may also be a tray in which partitions are formed on the component support part 6 to separate the component chips 204 from each other.

1: Transport pallets 2: Tray body 3: Adhesive layer 4: Recording media 5:Identification mark 6:Component support part 6-1:Surface 7:Frame 120: Tray camera unit (camera means) 200: Processed object 204: Component chip (wafer) ST1: Processing steps ST2: Accommodation step ST3: Discrimination step ST4: Record steps

FIG. 1 is a perspective view showing a structural example of a transport pallet according to Embodiment 1. FIG. 2 is a perspective view showing a structural example of the processing device using the transport pallet according to Embodiment 1. FIG. 3 is a perspective view showing an example of a workpiece to be processed by the processing apparatus shown in FIG. 2 . FIG. 4 is a cross-sectional view showing a state in which component wafers are accommodated in the transfer tray shown in FIG. 1 . FIG. 5 is a flowchart showing the flow of the processing method of the workpiece according to the first embodiment. FIG. 6 is a diagram schematically showing, in partial cross-section, the identification steps and recording steps of the processing method of the workpiece shown in FIG. 5 .

1: Transport pallets

2: Tray body

3: Adhesive layer

4: Recording media

5:Identification mark

6:Component support part

6-1:Surface

7:Frame

200: Processed object

204: Component chip (wafer)

Claims (3)

A method of processing a workpiece, which includes accommodating wafers on a transfer pallet. The transfer pallet is provided with: a pallet body having a component support part and a frame body. The component support part has a surface that supports a plurality of wafers. The frame system surrounds the component support part. is formed on the outer periphery of the component support portion; a recording medium is provided on the tray body and can write or read information through wireless communication; and an identification mark identifies whether the transport tray is of a type that can write the recording medium and is provided on The frame and the control unit of the processing device store the image of the identification mark of the transfer pallet in advance. The processing method of the workpiece is characterized by: a processing step of processing the workpiece to form a plurality of wafers; and a storage step. , accommodate the plurality of wafers in the transfer tray; the determination step is to capture the identification mark with a camera, and determine whether the image of the identification mark of the transfer tray captured by the camera is consistent with the stored image of the identification mark ; and a recording step, where the information in the processing step is recorded on the recording medium when the determinations in the discrimination step are consistent. For example, the processing method of the workpiece of item 1, wherein the transfer pallet is provided with an adhesive layer, and the adhesive layer is installed on the surface of the component support part of the pallet body and has adhesive force. The method of processing a workpiece according to Item 1 or Item 2, wherein the imaging means is installed in a transfer unit that transfers the plurality of wafers.