TWI741115B - Surface protection film - Google Patents
Surface protection film Download PDFInfo
- Publication number
- TWI741115B TWI741115B TW106145387A TW106145387A TWI741115B TW I741115 B TWI741115 B TW I741115B TW 106145387 A TW106145387 A TW 106145387A TW 106145387 A TW106145387 A TW 106145387A TW I741115 B TWI741115 B TW I741115B
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- separator
- aforementioned
- acrylate
- film
- Prior art date
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 77
- 230000003287 optical effect Effects 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 229920000728 polyester Polymers 0.000 claims abstract description 43
- 230000001681 protective effect Effects 0.000 claims abstract description 35
- 239000010410 layer Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims description 56
- 239000000853 adhesive Substances 0.000 claims description 54
- 229920000058 polyacrylate Polymers 0.000 claims description 40
- 239000000203 mixture Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 20
- 229920006267 polyester film Polymers 0.000 claims description 5
- 238000000926 separation method Methods 0.000 abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 93
- -1 polyethylene terephthalate Polymers 0.000 description 92
- 239000000178 monomer Substances 0.000 description 75
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 38
- 239000002585 base Substances 0.000 description 31
- 241000208340 Araliaceae Species 0.000 description 30
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 30
- 235000003140 Panax quinquefolius Nutrition 0.000 description 30
- 235000008434 ginseng Nutrition 0.000 description 30
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 26
- 229920000642 polymer Polymers 0.000 description 26
- 239000000243 solution Substances 0.000 description 25
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 21
- 229910052742 iron Inorganic materials 0.000 description 19
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 229920001223 polyethylene glycol Polymers 0.000 description 16
- 239000002202 Polyethylene glycol Substances 0.000 description 15
- 238000004132 cross linking Methods 0.000 description 14
- 239000012948 isocyanate Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 125000005702 oxyalkylene group Chemical group 0.000 description 14
- 239000003522 acrylic cement Substances 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 13
- 239000001301 oxygen Substances 0.000 description 13
- 229910052760 oxygen Inorganic materials 0.000 description 13
- 229920001296 polysiloxane Polymers 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000003431 cross linking reagent Substances 0.000 description 11
- 230000009477 glass transition Effects 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
- 229920001451 polypropylene glycol Polymers 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 8
- 239000002216 antistatic agent Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 238000007689 inspection Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 238000011282 treatment Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 229920001400 block copolymer Polymers 0.000 description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 125000003368 amide group Chemical group 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000004093 cyano group Chemical group *C#N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 3
- 239000002998 adhesive polymer Substances 0.000 description 3
- 238000004873 anchoring Methods 0.000 description 3
- 229920005601 base polymer Polymers 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 239000013522 chelant Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000012766 organic filler Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 2
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 102100033972 Amyloid protein-binding protein 2 Human genes 0.000 description 2
- 101000785279 Dictyostelium discoideum Calcium-transporting ATPase PAT1 Proteins 0.000 description 2
- 101000779309 Homo sapiens Amyloid protein-binding protein 2 Proteins 0.000 description 2
- 101000713296 Homo sapiens Proton-coupled amino acid transporter 1 Proteins 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000464 Poly(propylene glycol)-block-poly(ethylene glycol)-block-poly(propylene glycol) Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000001541 aziridines Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000007765 extrusion coating Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 125000005447 octyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 2
- 125000000466 oxiranyl group Chemical group 0.000 description 2
- 125000006353 oxyethylene group Chemical group 0.000 description 2
- 229920001748 polybutylene Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000007763 reverse roll coating Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 239000012748 slip agent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- KILKGWDYIIJGSP-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-one iron Chemical compound [Fe].FC(C(=O)C(F)(F)F)(F)F KILKGWDYIIJGSP-UHFFFAOYSA-N 0.000 description 1
- ZIZJPRKHEXCVLL-UHFFFAOYSA-N 1,3-bis(6-isocyanatohexyl)-1,3-diazetidine-2,4-dione Chemical compound O=C=NCCCCCCN1C(=O)N(CCCCCCN=C=O)C1=O ZIZJPRKHEXCVLL-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- CGTZMJIMMUNLQD-UHFFFAOYSA-N 2-[(2-ethoxyphenoxy)-phenylmethyl]morpholine;methanesulfonic acid Chemical compound CS(O)(=O)=O.CCOC1=CC=CC=C1OC(C=1C=CC=CC=1)C1OCCNC1 CGTZMJIMMUNLQD-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- ZHCHRKVXJJJZFX-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-phenoxyethanol Chemical compound OCCOCCOCC(O)OC1=CC=CC=C1 ZHCHRKVXJJJZFX-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- IKCQWKJZLSDDSS-UHFFFAOYSA-N 2-formyloxyethyl formate Chemical compound O=COCCOC=O IKCQWKJZLSDDSS-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- JNDVNJWCRZQGFQ-UHFFFAOYSA-N 2-methyl-N,N-bis(methylamino)hex-2-enamide Chemical compound CCCC=C(C)C(=O)N(NC)NC JNDVNJWCRZQGFQ-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- UVRCNEIYXSRHNT-UHFFFAOYSA-N 3-ethylpent-2-enamide Chemical compound CCC(CC)=CC(N)=O UVRCNEIYXSRHNT-UHFFFAOYSA-N 0.000 description 1
- SSMDYRHBKZVGNR-UHFFFAOYSA-N 3-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)C1=CC(=O)NC1=O SSMDYRHBKZVGNR-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920006310 Asahi-Kasei Polymers 0.000 description 1
- ZQPKSFJBYSUVHT-UHFFFAOYSA-M C(CC)[Fe+].C(C)(=O)[O-] Chemical compound C(CC)[Fe+].C(C)(=O)[O-] ZQPKSFJBYSUVHT-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920000463 Poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- KAPCRJOPWXUMSQ-UHFFFAOYSA-N [2,2-bis[3-(aziridin-1-yl)propanoyloxymethyl]-3-hydroxypropyl] 3-(aziridin-1-yl)propanoate Chemical compound C1CN1CCC(=O)OCC(COC(=O)CCN1CC1)(CO)COC(=O)CCN1CC1 KAPCRJOPWXUMSQ-UHFFFAOYSA-N 0.000 description 1
- UIDZKLBCABAXMS-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCC(CO)CC1 UIDZKLBCABAXMS-UHFFFAOYSA-N 0.000 description 1
- SCPORGURKDOZDQ-UHFFFAOYSA-L [Fe+2].C(C)C(C(=O)[O-])(C(=O)[O-])CC Chemical compound [Fe+2].C(C)C(C(=O)[O-])(C(=O)[O-])CC SCPORGURKDOZDQ-UHFFFAOYSA-L 0.000 description 1
- DVSYRYDQLWQTOD-UHFFFAOYSA-N [Fe].CC(C)C(CC(C(C)C)=O)=O Chemical compound [Fe].CC(C)C(CC(C(C)C)=O)=O DVSYRYDQLWQTOD-UHFFFAOYSA-N 0.000 description 1
- ATVNDCGJZAYBJE-UHFFFAOYSA-N [Fe].CC(CC(CCC)=O)=O Chemical compound [Fe].CC(CC(CCC)=O)=O ATVNDCGJZAYBJE-UHFFFAOYSA-N 0.000 description 1
- OSSDLNQRAPYQLC-UHFFFAOYSA-N [Fe].CCC(CC(CC)=O)=O Chemical compound [Fe].CCC(CC(CC)=O)=O OSSDLNQRAPYQLC-UHFFFAOYSA-N 0.000 description 1
- YGCOKJWKWLYHTG-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical compound OCN(CO)C1=NC(N(CO)CO)=NC(N(CO)CO)=N1 YGCOKJWKWLYHTG-UHFFFAOYSA-N 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- YVPAVFZMCRKIMS-UHFFFAOYSA-N acetic acid benzyl acetate Chemical compound CC(O)=O.CC(=O)OCC1=CC=CC=C1 YVPAVFZMCRKIMS-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- YBCVMFKXIKNREZ-UHFFFAOYSA-N acoh acetic acid Chemical compound CC(O)=O.CC(O)=O YBCVMFKXIKNREZ-UHFFFAOYSA-N 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229920005603 alternating copolymer Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 150000007860 aryl ester derivatives Chemical class 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- RNOOHTVUSNIPCJ-UHFFFAOYSA-N butan-2-yl prop-2-enoate Chemical compound CCC(C)OC(=O)C=C RNOOHTVUSNIPCJ-UHFFFAOYSA-N 0.000 description 1
- DSLDCLRWFVOROV-UHFFFAOYSA-L butanoate;iron(2+) Chemical compound [Fe+2].CCCC([O-])=O.CCCC([O-])=O DSLDCLRWFVOROV-UHFFFAOYSA-L 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229920003174 cellulose-based polymer Polymers 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- ZFSQRSOTOXERMJ-UHFFFAOYSA-N ethanol;iron Chemical compound [Fe].CCO.CCO.CCO ZFSQRSOTOXERMJ-UHFFFAOYSA-N 0.000 description 1
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical class C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- AXZQNGYPBAAVRA-UHFFFAOYSA-N iron 1-phenylbutane-1,3-dione Chemical compound [Fe].C(C1=CC=CC=C1)(=O)CC(C)=O AXZQNGYPBAAVRA-UHFFFAOYSA-N 0.000 description 1
- ZWZHJDRBENYHMK-UHFFFAOYSA-L iron(2+);2-methylprop-2-enoate Chemical compound [Fe+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O ZWZHJDRBENYHMK-UHFFFAOYSA-L 0.000 description 1
- JXPNINVGPSRPMR-UHFFFAOYSA-N iron(3+) methanolate Chemical compound [Fe+3].[O-]C.[O-]C.[O-]C JXPNINVGPSRPMR-UHFFFAOYSA-N 0.000 description 1
- GDEWIWRXIRJBRK-UHFFFAOYSA-N iron;2,2,6,6-tetramethylheptane-3,5-dione Chemical compound [Fe].CC(C)(C)C(=O)CC(=O)C(C)(C)C GDEWIWRXIRJBRK-UHFFFAOYSA-N 0.000 description 1
- LYLMAYMDKIKGBR-UHFFFAOYSA-N iron;6-methylheptane-2,4-dione Chemical compound [Fe].CC(C)CC(=O)CC(C)=O LYLMAYMDKIKGBR-UHFFFAOYSA-N 0.000 description 1
- RTQMYJXQIDQHMH-UHFFFAOYSA-N iron;propan-2-one Chemical compound [Fe].CC(C)=O RTQMYJXQIDQHMH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropyl acetate Chemical compound CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
- JMCVCHBBHPFWBF-UHFFFAOYSA-N n,n-diethyl-2-methylprop-2-enamide Chemical compound CCN(CC)C(=O)C(C)=C JMCVCHBBHPFWBF-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- JTHNLKXLWOXOQK-UHFFFAOYSA-N n-propyl vinyl ketone Natural products CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/02—Organic
- B32B2266/0214—Materials belonging to B32B27/00
- B32B2266/0264—Polyester
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polarising Elements (AREA)
Abstract
本發明之課題係提供一種附分離件之光學用表面保護薄膜,其藉由特定構成積層於光學用表面保護薄膜之分離件的聚酯系基材的厚度,並設置孔洞,來抑制分離件對黏著劑層的剝離力,使剝離性及作業性優異,並利用因具有孔洞而緩衝性優異之分離件而可抑制分離件所致的凹痕產生。 The subject of the present invention is to provide a surface protective film for optics with a separator, which is configured to prevent the separation of The peeling force of the adhesive layer makes it excellent in peelability and workability, and the use of a separator with holes and excellent cushioning properties can suppress the generation of dents caused by the separator.
本發明之解決手段為一種附分離件之光學用表面保護薄膜,具有光學用表面保護薄膜及分離件,該光學用表面保護薄膜係於基材薄膜的至少單面具有黏著劑層者,且該分離件位於前述黏著劑層之與基材薄膜接觸之面為相反之面上;該附分離件之光學用表面保護薄膜之特徵在於:前述分離件具有脫模層與聚酯系基材,前述聚酯系基材具有孔洞,前述聚酯系基材之厚度為25~100μm,且前述分離件對前述黏著劑層之180°起始剝離力在0.7N/50mm以下。 The solution of the present invention is a surface protection film for optics with a separator, which has a surface protection film for optics and a separator. The surface protection film for optics is a substrate film with an adhesive layer on at least one side, and The separator is located on the opposite side of the surface of the adhesive layer in contact with the substrate film; the optical surface protection film with separator is characterized in that the separator has a mold release layer and a polyester-based substrate. The polyester-based substrate has holes, the thickness of the polyester-based substrate is 25-100 μm, and the 180° initial peeling force of the separator to the adhesive layer is less than 0.7N/50mm.
Description
本發明是有關於一種附分離件之光學用表面保護薄膜。尤其是對用於保護光學構件(例如使用在液晶顯示器等之偏光板、波長板、相位差板、光學補償薄膜、反射片、增亮薄膜等)表面之光學用表面保護薄膜,藉由貼附(積層)特定分離件,用以保護構成前述光學用表面保護薄膜之黏著劑層表面直到實際使用時為止,可使剝離性或作業性優異,並可預防凹痕的產生,乃屬有用。The present invention relates to a surface protective film for optics with a separator. Especially for optical surface protection films used to protect the surface of optical components (such as polarizing plates, wave plates, phase difference plates, optical compensation films, reflectors, brightness enhancement films, etc. used in liquid crystal displays, etc.) by attaching (Laminated) The specific separator is useful for protecting the surface of the adhesive layer constituting the aforementioned optical surface protection film until it is actually used. It can provide excellent peelability and workability, and can prevent the generation of dents, which is useful.
背景技術 表面保護薄膜一般具有在薄膜狀基材薄膜(支持體)上設置有黏著劑層之構成。所述表面保護薄膜是透過前述黏著劑層貼合在為被附體之光學構件上,藉此以保護光學構件在加工、輸送、檢查時等時其表面不會出現傷痕或髒污為目的而使用。例如,液晶顯示器的面板即是透過黏著劑層將偏光板或波長板等之光學構件貼合在液晶單元而形成。所述黏著劑層直到實際被貼合在光學構件之前,從進行保護以免乾燥等之必要性來說,是藉由經過脫模處理的分離件等來作保護、保管(專利文獻1)。Background Art Surface protection films generally have a configuration in which an adhesive layer is provided on a film-like base film (support). The surface protection film is bonded to the attached optical member through the aforementioned adhesive layer, thereby protecting the surface of the optical member from scratches or dirt during processing, transportation, inspection, etc. use. For example, a liquid crystal display panel is formed by bonding optical members such as a polarizing plate or a wave plate to a liquid crystal cell through an adhesive layer. The pressure-sensitive adhesive layer is protected and stored by a mold release process, etc. from the perspective of the necessity of protection from drying before it is actually bonded to the optical member (Patent Document 1).
之後,實際將前述表面保護薄膜的黏著劑層表面貼附在光學構件並使用時,即會將分離片剝離、去除。After that, when the adhesive layer surface of the aforementioned surface protection film is actually attached to the optical member and used, the release sheet will be peeled and removed.
先行技術文献 專利文獻 專利文獻1:日本特開2012-224811Prior Art Documents Patent Documents Patent Document 1: JP 2012-224811
發明概要Summary of the invention
此外,當分離件較厚時,於進行剝離、去除時分離件對構成表面保護薄膜的黏著劑層之剝離力(黏著力)一旦變高則產生剝離性或作業性差之問題。In addition, when the separator is thick, the peeling force (adhesive force) of the separator to the adhesive layer constituting the surface protection film during peeling and removal becomes high, which may cause problems of poor peelability or workability.
又,若以較薄的分離件取代較厚的分離件使用於黏著劑之塗敷時,會因附著在分離件表面的構成分離件之基材等所含微粒子(例如聚酯系的填料等),而成為形成黏著劑層時致使黏著劑層表面產生凹痕的原因。並且,當在黏著劑層表面產生有凹痕的狀態下將分離件貼合於被附體時,氣泡會進入黏著劑層與被附體之間的凹痕部分(空間),而產生檢查被附體時使檢查性惡化的問題。In addition, if a thinner separator is used instead of a thicker separator for adhesive coating, the particles (such as polyester-based fillers, etc.) contained in the base material of the separator adhered to the surface of the separator. ), which is the cause of dents on the surface of the adhesive layer when the adhesive layer is formed. In addition, when the separator is attached to the attached body with dents on the surface of the adhesive layer, air bubbles will enter the dent portion (space) between the adhesive layer and the attached body, resulting in an inspection substrate. A problem that deteriorates the inspection performance when possessing the body.
因此,本發明人等鑒於上述情事努力研究的結果,其目的在於提供一種附分離件之光學用表面保護薄膜,藉由特定構成積層於光學用表面保護薄膜之分離件的聚酯系基材的厚度並設置孔洞來減弱分離件的勁度(剛性),而可抑制分離件對黏著劑層之剝離力,使剝離性及作業性優異,並藉由具有孔洞使緩衝性優異,而可抑制分離件所致凹痕的發生,使檢查性優異。Therefore, the inventors of the present invention have made diligent studies in view of the above situation, and their object is to provide a surface protective film for optics with a separator, which is composed of a polyester-based substrate laminated on the separator of the optical surface protective film. Thickness and holes are provided to weaken the stiffness (rigidity) of the separator, and the peeling force of the separator to the adhesive layer can be suppressed, so that the peelability and workability are excellent, and the hole has excellent cushioning properties, which can inhibit separation The occurrence of dents caused by the parts makes the inspection excellent.
亦即,本發明之附分離件之光學用表面保護薄膜具有光學用表面保護薄膜及分離件,該光學用表面保護薄膜係在基材薄膜的至少單面具有黏著劑層者,且該分離件位於前述黏著劑層之與基材薄膜接觸之面為相反之面上;該附分離件之光學用表面保護薄膜之特徵在於:前述分離件具有脫模層與聚酯系基材,前述聚酯系基材具有孔洞,前述聚酯系基材之厚度為25~100μm,且前述分離件對前述黏著劑層之180°起始剝離力在0.7N/50mm以下。 That is, the optical surface protective film with a separator of the present invention has an optical surface protective film and a separator, and the optical surface protective film has an adhesive layer on at least one side of the base film, and the separator The surface of the adhesive layer that is in contact with the substrate film is the opposite side; the optical surface protection film with a separator is characterized in that the separator has a mold release layer and a polyester-based substrate, and the polyester The base material has holes, the thickness of the polyester base material is 25-100 μm, and the 180° initial peeling force of the separator to the adhesive layer is less than 0.7N/50mm.
本發明之附分離件之光學用表面保護薄膜中,相對於前述聚酯系基材的體積,該聚酯系基材之孔洞率宜為15%以上。 In the surface protective film for optics with a separator of the present invention, the porosity of the polyester-based substrate is preferably 15% or more relative to the volume of the aforementioned polyester-based substrate.
本發明之附分離件之光學用表面保護薄膜中,前述基材薄膜宜為聚酯薄膜。 In the optical surface protection film with a separator of the present invention, the aforementioned base film is preferably a polyester film.
本發明之附分離件之光學用表面保護薄膜中,前述黏著劑層宜由含有(甲基)丙烯酸系聚合物之黏著劑組成物形成。 In the optical surface protection film with a separator of the present invention, the adhesive layer is preferably formed of an adhesive composition containing a (meth)acrylic polymer.
本發明藉由特定構成積層於光學用表面保護薄膜之分離件的聚酯系基材的厚度並設置孔洞來抑制分離件對構成光學用表面保護薄膜之黏著劑層的剝離力,使剝離性及作業性優異,並利用因具有孔洞而緩衝性優異之分離件,可抑制分離件所致凹痕的發生,而能製得在光學用表面保護薄膜貼合於被附體之狀態下仍具優異檢查性之附分離件之光學用表面保護薄膜,乃屬有用。 In the present invention, by specifying the thickness of the polyester base material constituting the separator layered on the optical surface protection film and providing holes, the release force of the separator on the adhesive layer constituting the optical surface protection film is suppressed, and the releasability is improved. Excellent workability, and the use of separators with holes and excellent cushioning properties can suppress the occurrence of dents caused by the separators, and can produce excellent optical surface protection films in the state where the optical surface protection film is attached to the attached body. The optical surface protective film with separate parts for inspection is useful.
用以實施發明之形態 以下詳細說明本發明的實施形態。Modes for Carrying Out the Invention Hereinafter, embodiments of the present invention will be described in detail.
<附分離件之光學用表面保護薄膜的整體構造> 揭示於此的附分離件之光學用表面保護薄膜(以下,有時僅會稱「表面保護薄膜」),一般而言是稱為黏著膠帶、黏著標籤、黏著薄膜等形態的黏著劑層表面被分離件保護之物,且尤其適用作為在加工、檢查、輸送光學零件(例如偏光板、波長板等之作為液晶顯示面板構成要素使用的光學零件)時保護光學零件表面之表面保護薄膜。前述表面保護薄膜之黏著劑層典型上連續形成,但並非受限於該形態,亦可為例如形成點狀、條紋狀等規則性或無規性圖案之黏著劑層。又,揭示於此的表面保護薄膜亦可為捲狀或單片狀。<The overall structure of the optical surface protective film with a separator> The optical surface protective film with a separator disclosed here (hereinafter, sometimes referred to as "surface protective film") is generally called an adhesive tape , Adhesive labels, adhesive films, etc. The surface of the adhesive layer is protected by a separator, and it is especially suitable as an optical component used as a component of a liquid crystal display panel in the processing, inspection, and transportation of optical parts (such as polarizers, wave plates, etc.) Part) is a surface protective film that protects the surface of optical parts. The adhesive layer of the aforementioned surface protection film is typically formed continuously, but it is not limited to this form. For example, it may be an adhesive layer that forms regular or random patterns such as dots and stripes. In addition, the surface protection film disclosed here may also be in the form of a roll or a single sheet.
<基材薄膜> 構成本發明之附分離件之光學用表面保護薄膜的光學用表面保護薄膜之特徵在於具有基材薄膜。在揭示於此的技術中,構成基材薄膜的樹脂材料雖可無特別限制地使用,但宜使用例如透明性、機械性強度、熱穩定性、防潮性、各向同性、可撓性、尺寸穩定性等之特性優異者。尤其是基材藉由具有可撓性,而可以輥塗機等塗佈黏著劑組成物,並可捲繞成捲狀,乃屬有用。<Substrate film> The optical surface protective film constituting the optical surface protective film with a separator of the present invention is characterized by having a substrate film. In the technique disclosed herein, although the resin material constituting the base film can be used without particular limitation, it is preferable to use such materials as transparency, mechanical strength, thermal stability, moisture resistance, isotropy, flexibility, and size. Those with excellent stability and other characteristics. In particular, since the substrate has flexibility, it can be coated with an adhesive composition by a roll coater or the like, and can be wound into a roll, which is useful.
以前述基材薄膜(支持體)來說,可適宜地將由以下述樹脂材料構成的塑膠薄膜作為前述基材薄膜來使用,該樹脂材料以例如聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯等之聚酯系聚合物;二乙醯纖維素、三乙醯纖維素等之纖維素系聚合物;聚碳酸酯系聚合物;聚甲基丙烯酸甲酯等之丙烯酸系聚合物等為主要樹脂成分(樹脂成分之中的主成分,典型來說為佔有50重量%以上的成分)。前述樹脂材料的其他例可列舉以下述作為樹脂材料者:聚苯乙烯、丙烯腈-苯乙烯共聚物等之苯乙烯系聚合物;聚乙烯、聚丙烯、具有環狀或降莰烯結構之聚烯烴、乙烯-丙烯共聚物等之烯烴系聚合物;氯乙烯聚合物;尼龍6、尼龍6,6、芳香族聚醯胺等之醯胺系聚合物等。前述樹脂材料之又其他例,可列舉醯亞胺系聚合物、碸系聚合物、聚醚碸系聚合物、聚醚醚酮系聚合物、聚苯硫醚系聚合物、乙烯醇系聚合物、偏二氯乙烯系聚合物、乙烯醇縮丁醛系聚合物、芳酯系聚合物、聚甲醛系聚合物、環氧系聚合物等。亦可為由上述聚合物之2種以上混合物構成的基材薄膜。For the aforementioned base film (support), a plastic film composed of the following resin material can be suitably used as the aforementioned base film, such as polyethylene terephthalate (PET), poly Polyester-based polymers such as ethylene naphthalate (PEN) and polybutylene terephthalate; cellulose-based polymers such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based polymerization Materials; acrylic polymers such as polymethyl methacrylate are the main resin component (the main component of the resin component is typically a component that occupies 50% by weight or more). Other examples of the aforementioned resin materials include the following as resin materials: polystyrene, styrene-based polymers such as acrylonitrile-styrene copolymers; polyethylene, polypropylene, polystyrenes having cyclic or norbornene structures Olefin-based polymers such as olefins and ethylene-propylene copolymers; vinyl chloride polymers; amide-based polymers such as
前述基材薄膜可適宜採用由透明的熱可塑性樹脂構成之塑膠薄膜。而在前述塑膠薄膜中較佳態樣係使用聚酯薄膜。在此,聚酯薄膜是指以具有以聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯等酯鍵為基礎的主骨架之聚酯系聚合物材料(聚酯樹脂)作為主要樹脂成分者。所述聚酯薄膜具有優異光學特性及尺寸穩定性等作為表面保護薄膜的基材薄膜之較佳的特性。As the aforementioned base film, a plastic film made of a transparent thermoplastic resin can be suitably used. Among the aforementioned plastic films, a polyester film is preferably used. Here, polyester film refers to a main skeleton based on ester bonds such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate. The polyester-based polymer material (polyester resin) as the main resin component. The polyester film has excellent optical properties, dimensional stability, and other preferable properties as a base film of a surface protection film.
構成前述基材薄膜的樹脂材料也可因應需要摻混抗氧化劑、紫外線吸收劑、塑化劑、著色劑(顏料、染料等)等各種添加劑。可施加例如電暈放電處理、電漿處理、紫外線照射處理、酸處理、鹼處理、塗佈底塗劑等眾所周知或慣用之表面處理。所述表面處理是可用以提高例如基材薄膜與黏著劑層之密著性(黏著劑層之投錨性)之處理。The resin material constituting the aforementioned base film can also be blended with various additives such as antioxidants, ultraviolet absorbers, plasticizers, colorants (pigments, dyes, etc.) as needed. Well-known or customary surface treatments such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, and primer coating can be applied. The surface treatment can be used to improve the adhesion between the substrate film and the adhesive layer (anchoring property of the adhesive layer), for example.
前述基材薄膜也可使用施加有抗靜電處理之塑膠薄膜。藉由使用前述基材薄膜,可在剝離表面保護薄膜時抑制其本身的帶電,故較佳。又,基材薄膜為塑膠薄膜,且藉由在前述塑膠薄膜施加抗靜電處理,可減低表面保護薄膜本身的帶電,而可獲得對被附體之抗靜電能力優異者。另,賦予抗靜電機能之方法並無特別限制,可使用眾所周知之方法,例如可舉塗佈由抗靜電劑與樹脂成分構成之抗靜電性樹脂或含有導電性聚合物、導電性物質之導電性樹脂之方法,或者將導電性物質蒸鍍或電鍍之方法,還可舉出混入抗靜電劑之方法等。The aforementioned base film can also be a plastic film applied with antistatic treatment. By using the aforementioned base film, it is possible to suppress the charging of itself when peeling off the surface protective film, which is preferable. In addition, the base film is a plastic film, and by applying antistatic treatment to the plastic film, the charge of the surface protection film itself can be reduced, and an excellent antistatic ability to the attached body can be obtained. In addition, the method of imparting antistatic function is not particularly limited, and well-known methods can be used, such as coating with antistatic resin composed of antistatic agent and resin component, or conductive polymer containing conductive polymer and conductive material. The method of resin, or the method of vapor deposition or electroplating of conductive material, can also include the method of mixing antistatic agent, etc.
前述基材薄膜之厚度通常為5~200μm,較佳為10~100μm左右。當前述基材薄膜之厚度在前述範圍內時,對被附體的貼合作業性以及從被附體剝離之剝離性或作業性優異,故較佳。The thickness of the aforementioned substrate film is usually 5 to 200 μm, preferably about 10 to 100 μm. When the thickness of the aforementioned base film is within the aforementioned range, the workability for attaching to the attached body and the releasability or workability for peeling from the attached body are excellent, which is preferable.
揭示於此的表面保護薄膜除了基材薄膜、黏著劑層及分離件之外,還可以包含其他層的態樣下實施而獲得。前述其他層可列舉可將抗靜電層或黏著劑層之投錨性提高的底塗層(錨固層)等。The surface protection film disclosed herein can be obtained by implementing in a manner including other layers in addition to the base film, the adhesive layer, and the separator. Examples of the aforementioned other layer include an undercoating layer (anchoring layer) that can improve the anchoring properties of the antistatic layer or the adhesive layer.
<黏著劑層> 本發明所使用之黏著劑只要是由含有具有黏著性的黏著性聚合物之黏著劑組成物形成者,可無特別限制地使用。前述黏著劑組成物例如可使用丙烯酸系黏著劑、胺甲酸乙酯系黏著劑、合成橡膠系黏著劑、天然橡膠系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑等,其中,以使用(含有)選自於由丙烯酸系黏著劑、胺甲酸乙酯系黏著劑及聚矽氧系黏著劑所構成群組中至少1種者為佳,而使用含有屬前述黏著性聚合物的(甲基)丙烯酸系聚合物之黏著劑組成物(丙烯酸系黏著劑)尤為較佳態樣。<Adhesive layer> The adhesive used in the present invention can be used without particular limitation as long as it is formed of an adhesive composition containing an adhesive polymer having adhesiveness. For the aforementioned adhesive composition, for example, acrylic adhesives, urethane adhesives, synthetic rubber adhesives, natural rubber adhesives, silicone adhesives, polyester adhesives, etc. can be used. It is better to use (contain) at least one selected from the group consisting of acrylic adhesives, urethane adhesives and silicone adhesives, and use ( The adhesive composition of the meth)acrylic polymer (acrylic adhesive) is particularly preferred.
前述黏著劑層使用丙烯酸系黏著劑時,構成前述丙烯酸系黏著劑之黏著性聚合物的(甲基)丙烯酸系聚合物可使用以具有碳數1~14烷基之(甲基)丙烯酸系單體作為主單體來做為構成其之原料。前述(甲基)丙烯酸系單體可使用1種或2種以上。藉由使用具有前述碳數為1~14烷基之(甲基)丙烯酸系單體,可容易將對被附體(被保護體)的剝離力(黏著力)控制地較低,而獲得輕剝離性或再剝離性優異之表面保護薄膜。另,在本發明中之(甲基)丙烯酸系聚合物是指丙烯酸系聚合物及/或甲基丙烯酸系聚合物,又,(甲基)丙烯酸酯是指丙烯酸酯及/或甲基丙烯酸酯。When an acrylic adhesive is used for the aforementioned adhesive layer, the (meth)acrylic polymer constituting the adhesive polymer of the aforementioned acrylic adhesive can be used as a (meth)acrylic monomer having a C1-C14 alkyl group. The body is used as the main monomer as its raw material. The aforementioned (meth)acrylic monomers can be used singly or in two or more types. By using the (meth)acrylic monomer with the aforementioned C1-C14 alkyl group, the peeling force (adhesive force) to the attached body (protected body) can be easily controlled to be low, and light weight can be obtained. A surface protective film with excellent peelability or repeelability. In addition, the (meth)acrylic polymer in the present invention refers to acrylic polymer and/or methacrylic polymer, and (meth)acrylate refers to acrylate and/or methacrylate .
作為前述含有碳數1~14烷基之(甲基)丙烯酸系單體之具體例,可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸二級丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二酯、(甲基)丙烯酸正十三酯、(甲基)丙烯酸正十四酯等。Specific examples of the aforementioned (meth)acrylic monomers containing an alkyl group with 1 to 14 carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, (Meth) butyl acrylate, tertiary butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, ( N-octyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, iso-octyl (meth)acrylate Decyl ester, n-dodecyl (meth)acrylate, n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, etc.
其中,在本發明之表面保護薄膜中,尤其可列舉(甲基)丙烯酸正丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二酯、(甲基)丙烯酸正十三酯、(甲基)丙烯酸正十四酯等含有碳數4~14烷基之(甲基)丙烯酸系單體作為較佳者。尤其是藉由使用前述含有碳數4~14烷基之(甲基)丙烯酸系單體,可容易將對被附體的剝離力(黏著力)控制地較低,而為再剝離性優異者。Among them, in the surface protective film of the present invention, especially n-butyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and n-octyl (meth)acrylate can be mentioned. Ester, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, (meth) ) (Meth)acrylic monomers containing an alkyl group with 4 to 14 carbon atoms, such as n-dodecyl acrylate, n-tridecyl (meth)acrylate, and n-tetradecyl (meth)acrylate, are preferred. In particular, by using the aforementioned (meth)acrylic monomer containing an alkyl group with 4 to 14 carbon atoms, the peeling force (adhesive force) to the adherend can be easily controlled to be low, and it is the one with excellent re-peelability .
尤其是相對於構成前述(甲基)丙烯酸系聚合物之單體成分總量100重量%,以含有65重量%以上之碳數1~14烷基之(甲基)丙烯酸系單體為佳,較佳為75重量%以上,更佳為85~99.9重量%,最佳為90~99重量%。當低於50重量%時,黏著劑組成物之適度的潤濕性或黏著劑層的凝聚力會變差,故不佳。In particular, it is preferable to use a (meth)acrylic monomer containing 65% by weight or more of a C1-C14 alkyl group with respect to 100% by weight of the total amount of monomer components constituting the aforementioned (meth)acrylic polymer. It is preferably 75% by weight or more, more preferably 85 to 99.9% by weight, and most preferably 90 to 99% by weight. When it is less than 50% by weight, the appropriate wettability of the adhesive composition or the cohesive force of the adhesive layer will deteriorate, which is not good.
又,前述(甲基)丙烯酸系聚合物可使用含羥基之(甲基)丙烯酸系單體作為原料單體。前述含羥基之(甲基)丙烯酸系單體可使用1種或2種以上。藉由使用前述含羥基之(甲基)丙烯酸系單體,可容易控制黏著劑組成物的交聯等,且更可容易控制利用流動改善潤濕性與剝離時剝離力(黏著力)降低之平衡。In addition, the aforementioned (meth)acrylic polymer can use a hydroxyl group-containing (meth)acrylic monomer as a raw material monomer. The above-mentioned hydroxyl group-containing (meth)acrylic monomer can be used singly or in two or more types. By using the aforementioned hydroxyl-containing (meth)acrylic monomers, it is easy to control the crosslinking of the adhesive composition, and it is easier to control the use of flow to improve the wettability and the peeling force (adhesive force) at the time of peeling. balance.
前述含羥基之(甲基)丙烯酸系單體可列舉例如2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、4-羥基丁基(甲基)丙烯酸酯、6-羥基己基(甲基)丙烯酸酯、8-羥基辛基(甲基)丙烯酸酯、10-羥基癸基(甲基)丙烯酸酯、12-羥基月桂基(甲基)丙烯酸酯、(4-羥基甲基環己基)甲基丙烯酸酯、N-羥甲基(甲基)丙烯醯胺等。The aforementioned hydroxyl-containing (meth)acrylic monomers include, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate , 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4 -Hydroxymethylcyclohexyl)methacrylate, N-hydroxymethyl(meth)acrylamide, etc.
相對於構成前述(甲基)丙烯酸系聚合物之單體成分總量100重量%,以含有25重量%以下之前述含羥基之(甲基)丙烯酸系單體為佳,較佳為15重量%以下,更佳為0.1~10重量%。若在前述範圍內,可容易控制黏著劑組成物之濕潤性與所獲得的黏著劑層之凝聚力的平衡,故較佳。With respect to 100% by weight of the total amount of monomer components constituting the (meth)acrylic polymer, it is preferable to contain 25% by weight or less of the hydroxyl-containing (meth)acrylic monomer, preferably 15% by weight Hereinafter, it is more preferably 0.1 to 10% by weight. If it is within the aforementioned range, the balance between the wettability of the adhesive composition and the cohesive force of the obtained adhesive layer can be easily controlled, which is preferable.
又,作為其他聚合性單體成分,從容易獲得黏著性能平衡之理由來看,為使Tg成為0℃以下(通常為-100℃以上),可在不損及本發明效果的範圍內使用用以調整(甲基)丙烯酸系聚合物的玻璃轉移溫度或剝離性之聚合性單體等。In addition, as other polymerizable monomer components, for the reason that the balance of adhesive properties is easily obtained, in order to make Tg below 0°C (usually above -100°C), it can be used within a range that does not impair the effects of the present invention. To adjust the glass transition temperature of the (meth)acrylic polymer or releasable polymerizable monomers.
又,前述(甲基)丙烯酸系聚合物可使用含羧基之(甲基)丙烯酸系單體作為原料單體。藉由使用含有前述含羧基之(甲基)丙烯酸系單體,可抑制黏著劑層(表面保護薄膜)的黏著力隨時間經過之上升,而使再剝離性、防黏著力上升性及作業性優異。又,除了黏著劑層的凝聚力優異,剪切力也優異,而較佳。In addition, the aforementioned (meth)acrylic polymer can use a carboxyl group-containing (meth)acrylic monomer as a raw material monomer. By using the (meth)acrylic monomer containing the aforementioned carboxyl group, the increase in the adhesive force of the adhesive layer (surface protective film) over time can be suppressed, and re-peelability, increase in adhesion resistance and workability can be achieved Excellent. Moreover, in addition to the excellent cohesive force of the adhesive layer, the shearing force is also excellent, which is preferable.
前述含羧基之(甲基)丙烯酸系單體可列舉例如(甲基)丙烯酸、羧基乙基(甲基)丙烯酸酯、羧基戊基(甲基)丙烯酸酯等。Examples of the aforementioned carboxyl group-containing (meth)acrylic monomer include (meth)acrylic acid, carboxyethyl (meth)acrylate, and carboxypentyl (meth)acrylate.
相對於構成前述(甲基)丙烯酸系聚合物之單體成分總量100重量%,前述含羧基之(甲基)丙烯酸系單體宜為10重量%以下,較宜為0~8重量%,更宜為0~6重量%。若在前述範圍內,可容易控制黏著劑組成物之濕潤性與所獲得的黏著劑層之凝聚力的平衡,故較佳。With respect to 100% by weight of the total amount of monomer components constituting the (meth)acrylic polymer, the carboxyl group-containing (meth)acrylic monomer is preferably 10% by weight or less, more preferably 0-8% by weight, More preferably, it is 0 to 6 wt%. If it is within the aforementioned range, the balance between the wettability of the adhesive composition and the cohesive force of the obtained adhesive layer can be easily controlled, which is preferable.
並且,只要是在不損及本發明特性的範圍內,則前述(甲基)丙烯酸系聚合物可無特別限定地使用前述原料單體以外之其他聚合性單體。例如前述其他聚合性單體可適宜使用含氰基單體、乙烯酯單體、芳香族乙烯單體等提昇凝聚力與耐熱性之成分,或含醯胺基單體、含醯亞胺基單體、含胺基單體、含環氧基單體、N-丙烯醯基嗎福啉、乙烯基醚單體等具有提昇剝離力(黏著力)與可作為交聯化基點發揮作用之官能基之成分。其中,宜使用含氰基單體、含醯胺基單體、含醯亞胺基單體、含胺基單體及N-丙烯醯基嗎福啉等之含氮單體。藉由使用含氮單體,可確保不會產生浮凸或剝落等之適度的剝離力(黏著力),而更可獲得剪切力優異的表面保護薄膜,故屬有用。該等聚合性單體可使用1種或2種以上。Moreover, as long as it is in the range which does not impair the characteristic of this invention, the said (meth)acrylic-type polymer can use the polymerizable monomer other than the said raw material monomer without a restriction|limiting in particular. For example, the aforementioned other polymerizable monomers can be suitably used to improve cohesiveness and heat resistance such as cyano group-containing monomers, vinyl ester monomers, aromatic vinyl monomers, or amide group-containing monomers and amide group-containing monomers. , Amine group-containing monomers, epoxy group-containing monomers, N-acryloyl morpholine, vinyl ether monomers, etc., have functional groups that enhance the peeling force (adhesion) and can act as crosslinking base points. Element. Among them, nitrogen-containing monomers such as cyano group-containing monomers, amide group-containing monomers, amide group-containing monomers, amine group-containing monomers, and N-acrylomorpholine are preferably used. By using a nitrogen-containing monomer, it is possible to ensure a moderate peeling force (adhesive force) that does not produce bumps or peeling, and to obtain a surface protective film with excellent shearing force, which is useful. One type or two or more types of these polymerizable monomers can be used.
前述含氰基單體可列舉例如丙烯腈、甲基丙烯腈。Examples of the aforementioned cyano group-containing monomer include acrylonitrile and methacrylonitrile.
前述含醯胺基單體可列舉例如丙烯醯胺、甲基丙烯醯胺、二乙基丙烯醯胺、N-乙烯基吡咯啶酮、N,N-二甲基丙烯醯胺、N,N-二甲基甲基丙烯醯胺、N,N-二乙基丙烯醯胺、N,N-二乙基甲基丙烯醯胺、N,N'-亞甲基雙丙烯醯胺、N,N-二甲基胺基丙基丙烯醯胺、N,N-二甲基胺基丙基甲基丙烯醯胺、二丙酮丙烯醯胺等。The aforementioned amine group-containing monomers include, for example, acrylamide, methacrylamide, diethylacrylamide, N-vinylpyrrolidone, N,N-dimethylacrylamide, N,N- Dimethylmethacrylamide, N,N-diethylacrylamide, N,N-diethylmethacrylamide, N,N'-methylenebisacrylamide, N,N- Dimethylaminopropyl acrylamide, N,N-dimethylaminopropyl methacrylamide, diacetone acrylamide, etc.
前述含醯亞胺基單體可列舉例如環己基馬來醯亞胺、異丙基馬來醯亞胺、N-環己基馬來醯亞胺、伊康醯亞胺等。Examples of the above-mentioned iminium group-containing monomer include cyclohexylmaleimide, isopropylmaleimide, N-cyclohexylmaleimide, and Iconimide.
前述含胺基單體可列舉例如胺基乙基(甲基)丙烯酸酯、N,N-二甲基胺基乙基(甲基)丙烯酸酯、N,N-二甲基胺基丙基(甲基)丙烯酸酯等。The aforementioned amine group-containing monomers include, for example, aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl ( Meth) acrylate and the like.
前述乙烯酯單體可列舉例如乙酸乙烯酯、丙酸乙烯酯、月桂酸乙烯酯等。Examples of the aforementioned vinyl ester monomer include vinyl acetate, vinyl propionate, and vinyl laurate.
前述芳香族乙烯單體可列舉例如苯乙烯、氯苯乙烯、氯甲基苯乙烯、α-甲基苯乙烯、其他的取代苯乙烯等。Examples of the aforementioned aromatic vinyl monomer include styrene, chlorostyrene, chloromethylstyrene, α-methylstyrene, and other substituted styrenes.
前述含環氧基單體可列舉例如(甲基)丙烯酸環氧丙酯、(甲基)丙烯酸甲基環氧丙酯、烯丙基環氧丙基醚等。Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, and allylglycidyl ether.
前述乙烯基醚單體可列舉例如甲基乙烯基醚、乙基乙烯基醚、異丁基乙烯基醚等。Examples of the aforementioned vinyl ether monomer include methyl vinyl ether, ethyl vinyl ether, and isobutyl vinyl ether.
在本發明中,相對於構成前述(甲基)丙烯酸系聚合物之單體成分總量100重量%,前述其他聚合性單體宜為0~30重量%,較宜為0~10重量%。前述其他聚合性單體為了獲得所期望的特性,可進行適當的調節。In the present invention, the other polymerizable monomer is preferably 0 to 30% by weight, more preferably 0 to 10% by weight, relative to 100% by weight of the total amount of monomer components constituting the (meth)acrylic polymer. The aforementioned other polymerizable monomers can be adjusted appropriately in order to obtain desired characteristics.
前述(甲基)丙烯酸系聚合物亦可更含有含環氧烷基之反應性單體作為單體成分。The aforementioned (meth)acrylic polymer may further contain an epoxy group-containing reactive monomer as a monomer component.
又,從與含氧伸烷基化合物的相溶性之觀點來看,前述含環氧烷基之反應性單體的氧伸烷基單元之平均加成加莫耳數宜為1~40,較宜為3~40,更宜為4~35,尤其宜為5~30。當前述平均加成莫耳數為1以上時,會有可有效率獲得減低被附體(被保護體)污染之效果的傾向。又,前述平均加成莫耳數大於40時,會有與含氧伸烷基化合物之相互作用增大,造成黏著劑組成物的黏度上升而難以塗敷之傾向,故不佳。另,氧伸烷基鏈之末端亦可即為羥基,或者亦可被其他官能基等取代。In addition, from the viewpoint of compatibility with the oxygen-containing alkylene compound, the average number of additions and moles of the oxyalkylene unit of the above-mentioned oxyalkylene-containing reactive monomer is preferably 1-40, which is more It is preferably 3~40, more preferably 4~35, especially 5~30. When the aforementioned average added mole number is 1 or more, there is a tendency that the effect of reducing the pollution of the attached body (protected body) can be obtained efficiently. In addition, when the aforementioned average added molar number is greater than 40, the interaction with the oxygen-containing alkylene compound will increase, which will increase the viscosity of the adhesive composition and make it difficult to apply, which is not preferable. In addition, the end of the oxyalkylene chain may be a hydroxyl group, or may be substituted by other functional groups or the like.
前述含環氧烷基之反應性單體可單獨使用,又,亦可混合2種以上使用,但作為整體之含量,在前述(甲基)丙烯酸系聚合物之單體成分總量中宜為0~20重量%,較宜為0~10重量%。若含環氧烷基之反應性單體之含量超過20重量%,對被附體的污染性會惡化,故不佳。The aforementioned reactive monomer containing alkylene oxide can be used alone or in combination of two or more, but the total content is preferably in the total amount of monomer components of the aforementioned (meth)acrylic polymer 0-20% by weight, preferably 0-10% by weight. If the content of the epoxy alkyl-containing reactive monomer exceeds 20% by weight, the pollution to the attached body will deteriorate, which is not good.
前述含環氧烷基之反應性單體之氧伸烷基單元可列舉具有碳數1~6之伸烷基者,例如可列舉氧亞甲基、氧伸乙基、氧伸丙基、氧伸丁基等。氧伸烷基鏈之烴基可為直鏈,亦可為支鏈。The oxyalkylene unit of the reactive monomer containing an epoxy group may include those having a carbon number of 1 to 6, such as oxymethylene, oxyethylene, oxyethylene, and oxygen. Butylene and so on. The hydrocarbon group of the oxyalkylene chain may be straight or branched.
又,前述含環氧烷基之反應性單體更宜為具有環氧乙基之反應性單體。藉由將具有環氧乙基之含反應性單體之(甲基)丙烯酸系聚合物作為基礎聚合物使用,可提高基礎聚合物與含氧伸烷基化合物之相溶性,適宜抑制對被附體滲出,而獲得低污染性之黏著劑組成物。In addition, the aforementioned reactive monomer containing an epoxy group is more preferably a reactive monomer having an epoxy group. By using a (meth)acrylic polymer containing a reactive monomer with an oxirane group as the base polymer, the compatibility between the base polymer and the oxygen-containing alkylene compound can be improved, and the adhesion to the The body oozes out, and a low-polluting adhesive composition is obtained.
前述含環氧烷基之反應性單體可列舉例如(甲基)丙烯酸環氧烷加成物、或分子中具有丙烯醯基、甲基丙烯醯基、烯丙基等反應性取代基之反應性界面活性劑等。The aforementioned reactive monomers containing alkylene oxide include, for example, (meth)acrylic acid alkylene oxide adducts, or reactions with reactive substituents such as acrylic, methacrylic, and allyl groups in the molecule. Surfactant, etc.
前述(甲基)丙烯酸環氧烷加成物之具體例可列舉例如聚乙二醇(甲基)丙烯酸酯、聚丙二醇(甲基)丙烯酸酯、聚乙二醇-聚丙二醇(甲基)丙烯酸酯、聚乙二醇-聚丁二醇(甲基)丙烯酸酯、聚丙二醇-聚丁二醇(甲基)丙烯酸酯、甲氧基聚乙二醇(甲基)丙烯酸酯、乙氧基聚乙二醇(甲基)丙烯酸酯、丁氧基聚乙二醇(甲基)丙烯酸酯、辛氧基聚乙二醇(甲基)丙烯酸酯、月桂氧基聚乙二醇(甲基)丙烯酸酯、硬脂氧基聚乙二醇(甲基)丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯、甲氧基聚丙二醇(甲基)丙烯酸酯、辛氧基聚乙二醇-聚丙二醇(甲基)丙烯酸酯等。Specific examples of the aforementioned (meth)acrylic acid alkylene oxide adduct include, for example, polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, and polyethylene glycol-polypropylene glycol (meth)acrylic acid. Ester, polyethylene glycol-polybutylene glycol (meth)acrylate, polypropylene glycol-polybutylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, ethoxylated poly Ethylene glycol (meth) acrylate, butoxy polyethylene glycol (meth) acrylate, octyloxy polyethylene glycol (meth) acrylate, lauryloxy polyethylene glycol (meth) acrylic acid Esters, stearyloxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, octyloxy polyethylene glycol -Polypropylene glycol (meth)acrylate and the like.
又,前述反應性界面活性劑之具體例可列舉例如具有(甲基)丙烯醯基或烯丙基之陰離子型反應性界面活性劑、非離子型反應性界面活性劑、陽離子型反應性界面活性劑等。In addition, specific examples of the aforementioned reactive surfactants include, for example, anionic reactive surfactants having (meth)acryloyl or allyl groups, nonionic reactive surfactants, and cationic reactive surfactants.剂 etc.
前述(甲基)丙烯酸系聚合物之重量平均分子量(Mw)以10萬~500萬為佳,以20萬~400萬較佳,以30萬~300萬更佳,最佳為30萬~120萬。重量平均分子量小於10萬時,會有黏著劑層的凝聚力變小以致產生殘膠的傾向。另一方面,重量平均分子量超過500萬時,聚合物的流動性會降低,對被附體(例如偏光板)的濕潤會變得不足,而有造成在被附體與表面保護薄膜的黏著劑層之間產生膨脹之原因的傾向。另,重量平均分子量係指藉由GPC(gel permeation chromatography,凝膠滲透層析法)所測得者。The weight average molecular weight (Mw) of the aforementioned (meth)acrylic polymer is preferably 100,000 to 5 million, preferably 200,000 to 4 million, more preferably 300,000 to 3 million, and most preferably 300,000 to 120 ten thousand. When the weight-average molecular weight is less than 100,000, the cohesive force of the adhesive layer will decrease, which will result in residual glue. On the other hand, when the weight average molecular weight exceeds 5 million, the fluidity of the polymer will decrease, and the wetting of the attached body (such as the polarizing plate) will become insufficient, which may cause the adhesive between the attached body and the surface protective film The tendency to cause expansion between layers. In addition, the weight average molecular weight refers to the one measured by GPC (gel permeation chromatography).
又,前述(甲基)丙烯酸系聚合物之玻璃轉移溫度(Tg)以0℃以下為佳,較宜為10℃以下(通常為-100℃以上)。當玻璃轉移溫度高於0℃時,聚合物不易流動,以致例如對為光學構件之偏光板的濕潤變得不足,而有造成在偏光板與表面保護薄膜的黏著劑層之間產生膨脹之原因的傾向。尤其是藉由將玻璃轉移溫度設定為-70℃以下,可容易獲得對偏光板之濕潤性與輕剝離性優易的黏著劑層。又,(甲基)丙烯酸系聚合物之玻璃轉移溫度可藉由適當改變所使用之單體成分或組成比,來將其調整為前述範圍內。In addition, the glass transition temperature (Tg) of the aforementioned (meth)acrylic polymer is preferably 0°C or lower, and more preferably 10°C or lower (usually -100°C or higher). When the glass transition temperature is higher than 0°C, the polymer is not easy to flow, so that, for example, the wetting of the polarizing plate as an optical member becomes insufficient, which may cause swelling between the polarizing plate and the adhesive layer of the surface protection film Propensity. In particular, by setting the glass transition temperature to -70°C or less, an adhesive layer with excellent wettability and light peelability to the polarizing plate can be easily obtained. In addition, the glass transition temperature of the (meth)acrylic polymer can be adjusted within the aforementioned range by appropriately changing the monomer components or composition ratio used.
前述(甲基)丙烯酸系聚合物的聚合方法並無特限定,可以溶液聚合、乳化聚合、塊狀聚合、懸浮聚合等眾所周知之方法來聚合,但尤從作業性的觀點或對被附體(被保護體)之低污染性等特性面來看,溶液聚合為較佳的態樣。又,所獲得之聚合物可為無規共聚物、嵌段共聚物、交替共聚物、接枝共聚物等之任一種。The polymerization method of the aforementioned (meth)acrylic polymer is not particularly limited. It can be polymerized by well-known methods such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, etc., but especially from the viewpoint of workability or to the attached body ( From the viewpoint of low pollution and other characteristics of the protected body, solution polymerization is the preferred aspect. In addition, the obtained polymer may be any of random copolymers, block copolymers, alternating copolymers, graft copolymers, and the like.
<含氧伸烷基化合物> 本發明所使用的黏著劑組成物亦可含有含氧伸烷基化合物。藉由含有含氧伸烷基化合物,而可進一步展現輕剝離性。作為含氧伸烷基化合物,可列舉具有氧伸烷基鏈之有機聚矽氧烷或不含有機聚矽氧烷之含氧伸烷基化合物。<Oxygen-containing alkylene compound> The adhesive composition used in the present invention may contain an oxygen-containing alkylene compound. By containing an oxygen-containing alkylene compound, it can further exhibit light peeling properties. As the oxygen-containing alkylene compound, an organopolysiloxane having an oxyalkylene chain or an oxygen-containing alkylene compound not containing an organopolysiloxane can be cited.
以前述具有氧伸烷基鏈之有機聚矽氧烷的具體例來說,作為在主鏈具有氧伸烷基鏈之有機聚矽氧烷的具體例可列舉例如市售品之商品名X-22-4952、X-22-4272、X-22-6266、KF-6004、KF-889(以上為信越化學工業公司製)、BY16-201、SF8427(以上為Toray‧Dow Corning公司製)、IM22(旭化成Wacker公司製)等。又,作為在側鏈具有氧伸烷基鏈之有機聚矽氧烷的具體例可列舉例如市售品之商品名KF-351A、KF-352A、KF-353、KF-354L、KF-355A、KF-615A、KF-945、KF-640、KF-642、KF-643、KF-6022、X-22-6191、X-22-4515、KF-6011、KF-6012、KF-6015、KF-6017、X-22-2516(以上為信越化學工業公司製)SF8428、FZ-2162、SH3749、FZ-77、L-7001、FZ-2104、FZ-2110、L-7002、FZ-2122、FZ-2164、FZ-2203、FZ-7001、SH8400、SH8700、SF8410、SF8422(以上為Toray‧Dow Corning公司製)、TSF-4440,TSF-4441、TSF-4445、TSF-4450、TSF-4446、TSF-4452、TSF-4460(以上為Momentive Performance Materials公司製)、BYK-333、BYK-307、BYK-377、BYK-UV3500、BYK-UV3570(BYK-Chemie Japan公司製)等。該等化合物可單獨使用,又亦可混合2種以上使用。Taking the specific example of the aforementioned organopolysiloxane having an oxyalkylene chain, as a specific example of the organopolysiloxane having an oxyalkylene chain in the main chain, for example, a commercial product under the trade name X- 22-4952, X-22-4272, X-22-6266, KF-6004, KF-889 (the above are made by Shin-Etsu Chemical Co., Ltd.), BY16-201, SF8427 (the above are made by Toray Dow Corning), IM22 (Made by Asahi Kasei Wacker Corporation), etc. In addition, specific examples of organopolysiloxanes having an oxyalkylene chain in the side chain include, for example, the trade names of commercially available products KF-351A, KF-352A, KF-353, KF-354L, KF-355A, KF-615A, KF-945, KF-640, KF-642, KF-643, KF-6022, X-22-6191, X-22-4515, KF-6011, KF-6012, KF-6015, KF- 6017, X-22-2516 (manufactured by Shin-Etsu Chemical Co., Ltd. above) SF8428, FZ-2162, SH3749, FZ-77, L-7001, FZ-2104, FZ-2110, L-7002, FZ-2122, FZ- 2164, FZ-2203, FZ-7001, SH8400, SH8700, SF8410, SF8422 (the above are manufactured by Toray‧Dow Corning), TSF-4440, TSF-4441, TSF-4445, TSF-4450, TSF-4446, TSF- 4452, TSF-4460 (manufactured by Momentive Performance Materials), BYK-333, BYK-307, BYK-377, BYK-UV3500, BYK-UV3570 (manufactured by BYK-Chemie Japan), etc. These compounds may be used alone, or two or more of them may be mixed and used.
前述不含有機聚矽氧烷之含氧伸烷基化合物的具體例可列舉例如聚氧伸烷基烷基胺、聚氧伸烷基二胺、聚氧伸烷基脂肪酸酯、聚氧伸烷基山梨醇脂肪酸酯、聚氧伸烷基烷基苯基醚、聚氧伸烷基烷基醚、聚氧伸烷基烷基烯丙基醚、聚氧伸烷基烷基苯基烯丙基醚等非離子性界面活性劑;聚氧伸烷基烷基醚硫酸酯鹽、聚氧伸烷基烷基醚磷酸酯鹽、聚氧伸烷基烷基苯基醚硫酸酯鹽、聚氧伸烷基烷基苯基醚磷酸酯鹽等陰離子性界面活性劑;此外,還有具有聚氧伸烷基鏈(聚環氧烷基鏈)之陽離子性界面活性劑或兩性離子界面活性劑、具有聚氧伸烷基鏈之聚醚系化合物(及包含其衍生物)、具有聚氧伸烷基鏈之丙烯酸化合物(及包含其衍生物)等。又,亦可將含聚氧伸烷基鏈之單體作為含聚氧伸烷基鏈化合物而摻混。所述含聚氧伸烷基鏈化合物可單獨使用,亦可組合2種以上使用。Specific examples of the aforementioned oxygen-containing alkylene compound containing no organopolysiloxane include, for example, polyoxyalkylene alkylamine, polyoxyalkylene diamine, polyoxyalkylene fatty acid ester, and polyoxyalkylene Alkyl sorbitol fatty acid ester, polyoxyalkylene alkyl phenyl ether, polyoxyalkylene alkyl ether, polyoxyalkylene alkyl allyl ether, polyoxyalkylene alkyl phenylene Nonionic surfactants such as propyl ether; polyoxyalkylene alkyl ether sulfate salt, polyoxyalkylene alkyl ether phosphate salt, polyoxyalkylene alkyl phenyl ether sulfate, polyoxyalkylene Anionic surfactants such as oxyalkylene alkylphenyl ether phosphate salt; in addition, there are cationic surfactants or zwitterionic surfactants with polyoxyalkylene chains (polyalkylene oxide chains) , Polyether compounds with polyoxyalkylene chains (and their derivatives), acrylic compounds with polyoxyalkylene chains (and their derivatives), etc. In addition, a polyoxyalkylene chain-containing monomer may be blended as a polyoxyalkylene chain-containing compound. The polyoxyalkylene chain-containing compound may be used alone or in combination of two or more kinds.
前述具有聚氧伸烷基鏈之聚醚系化合物(聚醚成分)之具體例可列舉聚丙二醇(PPG)-聚乙二醇(PEG)之嵌段共聚物、PPG-PEG-PPG之嵌段共聚物、PEG-PPG-PEG之嵌段共聚物等。前述具有聚氧伸烷基鏈之聚醚系化合物之衍生物可列舉末端經醚化之含氧伸丙基化合物(PPG單烷基醚、PEG-PPG單烷基醚等)、末端經乙醯化之含氧伸丙基化合物(末端乙醯化PPG等)等。Specific examples of the aforementioned polyether compound (polyether component) having a polyoxyalkylene chain include polypropylene glycol (PPG)-polyethylene glycol (PEG) block copolymers and PPG-PEG-PPG block copolymers. Copolymers, PEG-PPG-PEG block copolymers, etc. The derivatives of the aforementioned polyether compounds with polyoxyalkylene chains can include oxygen-containing propylene compounds whose ends are etherified (PPG monoalkyl ether, PEG-PPG monoalkyl ether, etc.), The oxygen-containing propylene compounds (terminally acetylated PPG, etc.) and so on.
又,前述具有聚氧伸烷基鏈之丙烯酸化合物可列舉具有氧伸烷基之(甲基)丙烯酸酯聚合物。作為前述氧伸烷基,氧伸烷基單元之加成莫耳數,以1~50為佳,以2~30為較佳,以2~20為更佳。又,前述氧伸烷基鏈之末端亦可即為羥基,或者亦可被烷基、苯基等取代。In addition, examples of the acrylic compound having a polyoxyalkylene chain include (meth)acrylate polymers having an oxyalkylene chain. As the aforementioned oxyalkylene group, the number of added moles of the oxyalkylene unit is preferably 1-50, preferably 2-30, and more preferably 2-20. In addition, the terminal of the aforementioned oxyalkylene chain may be a hydroxyl group, or may be substituted by an alkyl group, a phenyl group, or the like.
前述具有氧伸烷基之(甲基)丙烯酸酯聚合物宜為含(甲基)丙烯酸環氧烷作為單體成分之聚合物,以前述(甲基)丙烯酸環氧烷之具體例來說,作為含乙二醇基之(甲基)丙烯酸酯可列舉例如甲氧基-二乙二醇(甲基)丙烯酸酯、甲氧基-三乙二醇(甲基)丙烯酸酯等之甲氧基-聚乙二醇(甲基)丙烯酸酯型,乙氧基-二乙二醇(甲基)丙烯酸酯、乙氧基-三乙二醇(甲基)丙烯酸酯等之乙氧基-聚乙二醇(甲基)丙烯酸酯型,丁氧基-二乙二醇(甲基)丙烯酸酯、丁氧基-三乙二醇(甲基)丙烯酸酯等之丁氧基-聚乙二醇(甲基)丙烯酸酯型,苯氧基-二乙二醇(甲基)丙烯酸酯、苯氧基-三乙二醇(甲基)丙烯酸酯等之苯氧基-聚乙二醇(甲基)丙烯酸酯型,2-乙基己基-聚乙二醇(甲基)丙烯酸酯、壬基苯基-聚乙二醇(甲基)丙烯酸酯型,甲氧基-二丙二醇(甲基)丙烯酸酯等之甲氧基-聚丙二醇(甲基)丙烯酸酯型等。The aforementioned (meth)acrylate polymer having an oxyalkylene group is preferably a polymer containing (meth)acrylic acid alkylene oxide as a monomer component. Taking the aforementioned (meth)acrylic acid alkylene oxide as a specific example, Examples of ethylene glycol group-containing (meth)acrylates include methoxy-diethylene glycol (meth)acrylate, methoxy-triethylene glycol (meth)acrylate, etc. -Polyethylene glycol (meth)acrylate type, ethoxy-polyethylene such as ethoxy-diethylene glycol (meth)acrylate, ethoxy-triethylene glycol (meth)acrylate, etc. Glycol (meth)acrylate type, butoxy-polyethylene glycol (butoxy-polyethylene glycol) such as butoxy-diethylene glycol (meth)acrylate and butoxy-triethylene glycol (meth)acrylate Meth) acrylate type, phenoxy-polyethylene glycol (meth) such as phenoxy-diethylene glycol (meth)acrylate, phenoxy-triethylene glycol (meth)acrylate, etc. Acrylate type, 2-ethylhexyl-polyethylene glycol (meth)acrylate, nonylphenyl-polyethylene glycol (meth)acrylate type, methoxy-dipropylene glycol (meth)acrylate Methoxy-polypropylene glycol (meth)acrylate type etc.
又,亦可使用前述(甲基)丙烯酸環氧烷以外之其他單體成分作為前述單體成分。其他單體成分之具體例可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸二級丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十三烷基酯、(甲基) 丙烯酸正十四烷基酯等具有碳數1~14之烷基之丙烯酸酯及/或甲基丙烯酸酯。In addition, other monomer components other than the aforementioned (meth)acrylic acid alkylene oxide can also be used as the aforementioned monomer components. Specific examples of other monomer components include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, secondary butyl (meth)acrylate, and tributyl (meth)acrylate. Grade butyl ester, isobutyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate , N-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-dodecyl (meth)acrylate, ( Acrylate and/or methacrylate having an alkyl group with 1 to 14 carbon atoms, such as n-tridecyl meth)acrylate and n-tetradecyl (meth)acrylate.
並且,亦可適當地使用含羧基之(甲基)丙烯酸酯、含磷酸基之(甲基)丙烯酸酯、含氰基之(甲基)丙烯酸酯、乙烯酯類、芳香族乙烯化合物、含酸酐基之(甲基)丙烯酸酯、含羥基之(甲基)丙烯酸酯、含醯胺基之(甲基)丙烯酸酯、含胺基之(甲基)丙烯酸酯、含環氧基之(甲基)丙烯酸酯、N-丙烯醯基嗎福啉、乙烯基醚類等作為前述(甲基)丙烯酸環氧烷以外之其他單體成分。In addition, carboxyl group-containing (meth)acrylates, phosphoric acid group-containing (meth)acrylates, cyano group-containing (meth)acrylates, vinyl esters, aromatic vinyl compounds, and acid anhydrides can also be suitably used. (Meth)acrylate, hydroxyl-containing (meth)acrylate, amino-containing (meth)acrylate, amino-containing (meth)acrylate, epoxy-containing (meth)acrylate ) Acrylates, N-acrylomorpholine, vinyl ethers, etc. are used as monomer components other than the aforementioned (meth)acrylate alkylene oxide.
作為較佳之一態樣,前述不含有機聚矽氧烷之含聚氧伸烷基鏈化合物為至少一部分具有(聚)環氧乙基鏈之化合物。藉由摻混前述含(聚)環氧乙基鏈之化合物,可提高與基礎聚合物之相溶性,良好地抑制對被附體滲出,而可獲得低污染性之黏著劑組成物。其中尤其是在使用了PPG-PEG-PPG之嵌段共聚物時,可獲得低污染性優異之黏著劑。作為前述含聚環氧乙基鏈之化合物,(聚)環氧乙基鏈佔前述不含有機聚矽氧烷之含聚氧伸烷基鏈化合物的重量宜為5~90重量%,較宜為5~85重量%,更宜為5~80重量%,最宜為5~75重量%。As a preferred aspect, the aforementioned polyoxyalkylene chain compound containing no organopolysiloxane is a compound having at least a part of (poly)oxirane chain. By blending the aforementioned (poly)oxyethylene chain-containing compound, the compatibility with the base polymer can be improved, the exudation to the adherend can be well suppressed, and a low-polluting adhesive composition can be obtained. Among them, especially when a block copolymer of PPG-PEG-PPG is used, an adhesive with excellent low pollution properties can be obtained. As the aforementioned polyoxyethylene chain-containing compound, the (poly)oxyethylene chain accounts for 5 to 90% by weight of the weight of the aforementioned polyoxyalkylene chain-containing compound without organopolysiloxane, preferably It is 5 to 85% by weight, more preferably 5 to 80% by weight, and most preferably 5 to 75% by weight.
又,前述不含有機聚矽氧烷之含聚氧伸烷基鏈化合物的市售品可列舉例如Adeka Pluonic 17R-4、Adeka Pluonic 25R-2(以上皆為ADEKA公司製);Latemul PD-420、Latemul PD-420、Latemul PD-450、Emulgen 120(花王公司製);Aqualon HS-10、KH-10、Noigen EA-87、EA-137、EA-157、EA-167、EA-177(以上為第一工業製藥公司製)等。In addition, the commercially available products of the aforementioned polyoxyalkylene chain compound containing no organopolysiloxane include, for example, Adeka Pluonic 17R-4, Adeka Pluonic 25R-2 (all made by ADEKA); Latemul PD-420 , Latemul PD-420, Latemul PD-450, Emulgen 120 (manufactured by Kao); Aqualon HS-10, KH-10, Noigen EA-87, EA-137, EA-157, EA-167, EA-177 (above It is manufactured by Daiichi Industrial Pharmaceutical Co., Ltd.) and so on.
前述含氧伸烷基化合物之含量,相對於構成前述黏著劑組成物之黏著性聚合物(係主聚合物,例如(甲基)丙烯酸系聚合物)100重量份,宜為0.01~5.0重量份,且宜為0.02~2重量份,更宜為0.03~1.6重量份,最佳為0.1~0.8重量份。若在前述範圍內,可易展現本發明所使用的黏著劑層(表面保護薄膜)之輕剝離性(再剝離性),而較佳。The content of the aforementioned oxygen-containing alkylene compound is preferably 0.01 to 5.0 parts by weight relative to 100 parts by weight of the adhesive polymer (main polymer, such as (meth)acrylic polymer) constituting the aforementioned adhesive composition , And it is preferably 0.02 to 2 parts by weight, more preferably 0.03 to 1.6 parts by weight, and most preferably 0.1 to 0.8 parts by weight. If it is in the aforementioned range, the light releasability (re-peelability) of the adhesive layer (surface protective film) used in the present invention can be easily exhibited, which is preferable.
<交聯劑> 本發明之表面保護薄膜中,前述黏著劑組成物宜含有交聯劑。又,在本發明中,可使用前述黏著劑組成物製成黏著劑層。例如,當前述黏著劑組成物為含有前述(甲基)丙烯酸系聚合物之丙烯酸系黏著劑時,藉由適當調節前述(甲基)丙烯酸系聚合物之構成單元、構成比率、交聯劑的選擇及添加比率等來進行交聯,可獲得耐熱性更優異的黏著劑層(表面保護薄膜)。<Crosslinking agent> In the surface protection film of the present invention, the aforementioned adhesive composition preferably contains a crosslinking agent. Furthermore, in the present invention, the aforementioned adhesive composition can be used to form an adhesive layer. For example, when the adhesive composition is an acrylic adhesive containing the (meth)acrylic polymer, by appropriately adjusting the constituent units, composition ratio, and crosslinking agent of the (meth)acrylic polymer Cross-linking by selecting and adding ratio, etc., can obtain an adhesive layer (surface protective film) with more excellent heat resistance.
本發明所使用之交聯劑可使用異氰酸酯化合物、環氧化合物、三聚氰胺系樹脂、吖丙啶衍生物及金屬螯合化合物等,尤其是使用異氰酸酯化合物或環氧化合物為較佳的態樣。又,該等化合物可單獨使用,亦可混合2種以上使用。As the crosslinking agent used in the present invention, isocyanate compounds, epoxy compounds, melamine-based resins, aziridine derivatives, metal chelate compounds, etc. can be used. In particular, isocyanate compounds or epoxy compounds are preferred. Moreover, these compounds may be used individually, and 2 or more types may be mixed and used for it.
前述異氰酸酯化合物可列舉例如二異氰酸三亞甲酯、二異氰酸伸丁酯、二異氰酸六亞甲酯(HDI)、二體酸二異氰酸酯等之脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛酮二異氰酸酯(IPDI)、1,3-雙(異氰酸基甲基)環己烷等之脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、伸茬基二異氰酸酯(XDI)等芳香族異氰酸酯類;藉由脲甲酸酯鍵、縮二脲鍵、三聚異氰酸酯鍵、脲二酮鍵、脲鍵、碳二醯亞胺鍵、脲酮亞胺鍵及二三酮鍵等將前述異氰酸酯化合物進行改質所得之聚異氰酸酯改質體。市售品可列舉例如商品名Takenate 300S、Takenate 500、Takenate 600、Takenate D165N、Takenate D178N(以上為武田藥品工業公司製);Sumidur T80、Sumidur L、Desmodur N3400 (以上為住化Bayer Urethane公司製);Millionate MR、Millionate MT、Coronate L、Coronate HL、Coronate HX(以上為日本聚胺甲酸乙酯工業公司製)等。該等異氰酸酯化合物可單獨使用,亦可混合2種以上使用,亦可將雙官能之異氰酸酯化合物與三官能以上之異氰酸酯化合物併用來使用。藉由併用交聯劑來使用可使黏著性與耐反彈性(對於曲面的接著性)並存,而可獲得接著信耐性更優異的黏著劑層(表面保護薄膜)。Examples of the aforementioned isocyanate compounds include aliphatic polyisocyanates such as trimethylene diisocyanate, butylene diisocyanate, hexamethylene diisocyanate (HDI), and diisocyanate; Diisocyanate, cyclohexyl diisocyanate, isophorone diisocyanate (IPDI), 1,3-bis(isocyanatomethyl)cyclohexane and other alicyclic isocyanates; 2,4-toluene diisocyanate , 4,4'-Diphenylmethane diisocyanate, XDI and other aromatic isocyanates; through allophanate bond, biuret bond, trimeric isocyanate bond, uretdione bond, urea Bond, carbodiimide bond, uretonimine bond and two A polyisocyanate modified body obtained by modifying the aforementioned isocyanate compound with a three-ketone bond. Commercial products include, for example, the trade names Takenate 300S, Takenate 500, Takenate 600, Takenate D165N, Takenate D178N (the above are manufactured by Takeda Pharmaceutical Co., Ltd.); Sumidur T80, Sumidur L, and Desmodur N3400 (the above are manufactured by Sumika Bayer Urethane) ; Millionate MR, Millionate MT, Coronate L, Coronate HL, Coronate HX (the above are made by Japan Polyurethane Industry Co.), etc. These isocyanate compounds may be used alone, or two or more of them may be mixed for use, or a difunctional isocyanate compound and a trifunctional or higher isocyanate compound may be used together. By using a crosslinking agent in combination, adhesiveness and repulsion resistance (adhesion to curved surfaces) can be coexisted, and an adhesive layer (surface protective film) with more excellent adhesion resistance can be obtained.
前述環氧化合物可列舉例如N,N,N',N'-四環氧丙基-間茬二胺(商品名TETRAD-X,三菱瓦斯化學公司製)或1,3-雙(N,N-二環氧丙基胺基甲基)環己烷(商品名TETRAD-C,三菱瓦斯化學公司製)等。Examples of the aforementioned epoxy compound include N,N,N',N'-tetraepoxypropyl-stubble diamine (trade name TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.) or 1,3-bis(N,N -Diglycidylaminomethyl) cyclohexane (trade name TETRAD-C, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and the like.
前述三聚氰胺系樹脂可列舉六羥甲基三聚氰胺等。作為吖丙啶衍生物可列舉例如市售品之商品名 HDU、TAZM、TAZO (以上為相互藥工公司製)等。Examples of the melamine-based resin include hexamethylol melamine and the like. Examples of the aziridine derivatives include HDU, TAZM, TAZO (manufactured by Hutong Pharmaceutical Co., Ltd.) and the like, which are commercially available products.
以前述金屬螯合化合物來說,作為金屬成分可列舉鋁、鐵、錫、鈦、鎳等,作為螯合成分可列舉乙炔、乙醯乙酸甲酯、乳酸乙酯等。In the aforementioned metal chelate compound, aluminum, iron, tin, titanium, nickel, etc. can be mentioned as the metal component, and acetylene, methyl acetylacetate, ethyl lactate, etc. can be mentioned as the chelate component.
本發明所使用之交聯劑之含量相對於例如前述(甲基)丙烯酸系聚合物100重量份,宜為0.01~20重量份,較宜為0.1~15重量份,更宜為0.5~10重量份,最宜為1~8重量份。當前述含量比0.01重量份還少時,會有利用交聯劑之交聯形成並不充分,造成所獲得之黏著劑層之凝聚力變小,而無法獲得充分之耐熱性的情況,並有造成殘膠之原因之傾向。另一方面,當含量超過20重量份時,聚合物之凝聚力會變大而流動性降低,對被附體(例如偏光板)之潤濕會不充分,而有造成在被附體與黏著劑層(黏著劑組成物層)之間產生膨脹之原因之傾向。又,該等交聯劑可單獨使用,亦可混合2種以上使用。The content of the crosslinking agent used in the present invention is preferably 0.01-20 parts by weight, more preferably 0.1-15 parts by weight, and more preferably 0.5-10 parts by weight relative to 100 parts by weight of the aforementioned (meth)acrylic polymer. Parts, most preferably 1~8 parts by weight. When the aforementioned content is less than 0.01 parts by weight, the formation of cross-linking by the cross-linking agent may not be sufficient, resulting in a decrease in the cohesive force of the obtained adhesive layer, and insufficient heat resistance may not be obtained. The tendency of the cause of residual glue. On the other hand, when the content exceeds 20 parts by weight, the cohesive force of the polymer will increase and the fluidity will decrease, and the wetting of the attached body (such as the polarizing plate) will be insufficient, which may cause the adhesion between the attached body and the adhesive. The tendency to cause swelling between layers (adhesive composition layers). Moreover, these crosslinking agents may be used individually, and 2 or more types may be mixed and used for it.
<交聯觸媒> 前述黏著劑組成物中,還可含有用以使上述任一種交聯反應更有效進行之交聯觸媒。所述交聯觸媒可使用例如二月桂酸二丁錫、二月桂酸二辛錫等之錫系觸媒;參(乙醯丙酮)鐵、參(己-2,4-二酮)鐵、參(庚-2,4-二酮)鐵、參(庚-3,5-二酮)鐵、參(5-甲基己-2,4-二酮)鐵、參(辛-2,4-二酮)鐵、參(6-甲基庚-2,4-二酮)鐵、參(2,6-二甲基庚-3,5-二酮)鐵、參(壬-2,4-二酮)鐵、參(壬-4,6-二酮)鐵、參(2,2,6,6-四甲基庚-3,5-二酮)鐵、參(十三烷-6,8-二酮)鐵、參(1-苯基丁-1,3-二酮)鐵、參(六氟乙醯丙酮)鐵、參(乙醯乙酸乙酯)鐵、參(乙醯乙酸-正丙酯)鐵、參(乙醯乙酸異丙酯)鐵、參(乙醯乙酸-正丁酯)鐵、參(乙醯乙酸-二級丁酯)鐵、參(乙醯乙酸-三級丁酯)鐵、參(丙醯乙酸甲酯)鐵、參(丙醯乙酸乙酯)鐵、參(丙醯乙酸-正丙酯)鐵、參(丙醯乙酸異丙酯)鐵、參(丙醯乙酸-正丁酯)鐵、參(丙醯乙酸-二級丁酯)鐵、參(丙醯乙酸-三級丁酯)鐵、參(乙醯乙酸苄酯)鐵、參(丙二酸二甲酯)鐵、參(丙二酸二乙酯)鐵、三甲氧基鐵、三乙氧基鐵、三異丙氧基鐵、氯化鐵(III)等之鐵系觸媒。該等觸媒可使用1種,亦可將2種以上併用。<Cross-linking catalyst> The aforementioned adhesive composition may contain a cross-linking catalyst for making any of the above-mentioned cross-linking reactions more effectively proceed. The crosslinking catalyst can use tin-based catalysts such as dibutyl tin dilaurate, dioctyl tin dilaurate, etc.; ginseng (acetone) iron, ginseng (hexa-2,4-diketone) iron, Ginseng (heptane-2,4-dione) iron, ginseng (heptan-3,5-dione) iron, ginseng (5-methylhexa-2,4-dione) iron, ginseng (oct-2,4 -Diketone) iron, ginseng (6-methylheptan-2,4-dione) iron, ginseng (2,6-dimethylheptan-3,5-dione) iron, ginseng (non-2,4 -Diketone) iron, ginseng (non-4,6-dione) iron, ginseng (2,2,6,6-tetramethylheptan-3,5-dione) iron, ginseng (tridecane-6) ,8-diketone) iron, ginseng (1-phenylbutan-1,3-dione) iron, ginseng (hexafluoroacetone) iron, ginseng (ethyl acetate) iron, ginseng (acetate acetic acid) -N-propyl ester) iron, ginseng (acetate isopropyl ester) iron, ginseng (acetate-n-butyl ester) iron, ginseng (acetate-second butyl ester) iron, ginseng (acetate-tri Grade butyl ester) iron, ginseng (methyl acrylate) iron, ginseng (ethyl acrylate) iron, ginseng (acetate-n-propyl) iron, ginseng (isopropyl acrylate) iron, ginseng (Acrylic acetic acid-n-butyl ester) iron, ginseng (acrylic acid-secondary butyl ester) iron, ginseng (acrylic acid-tertiary butyl ester) iron, ginseng (acetate benzyl acetate) iron, ginseng (propyl acetate) Dimethyl diacid) iron, ginseng (diethyl malonate) iron, trimethoxy iron, triethoxy iron, triisopropoxy iron, iron (III) chloride and other iron-based catalysts. One type of these catalysts may be used, or two or more types may be used in combination.
前述交聯觸媒之含量並無特別限制,但例如相對於前述(甲基)丙烯酸系聚合物100重量份,宜設為約0.0001~1重量份,較宜為0.001~0.5質量份。若在前述範圍內,則形成黏著劑層時的交聯反應之速度快,黏著劑組成物之可使用期限也會變長,而為較佳態樣。The content of the aforementioned crosslinking catalyst is not particularly limited, but for example, relative to 100 parts by weight of the aforementioned (meth)acrylic polymer, it is preferably about 0.0001 to 1 part by weight, more preferably 0.001 to 0.5 part by weight. If it is within the aforementioned range, the speed of the crosslinking reaction when the adhesive layer is formed is high, and the usable life of the adhesive composition becomes longer, which is a preferred aspect.
並且,在前述黏著劑組成物中亦可含有其他眾所周知之添加劑,例如可根據使用之用途適當添加滑劑、著色劑、顏料等之粉體;塑化劑、黏著賦予劑、低分子量聚合物、表面潤滑劑、調平劑、抗氧化劑、防腐蝕劑、光穩定劑、紫外線吸收劑、聚合抑制劑、矽烷耦合劑、抗靜電劑、無機或有機充填劑、金屬粉、粒子狀、箔狀物等。In addition, the aforementioned adhesive composition may also contain other well-known additives, such as powders such as slip agents, colorants, and pigments; plasticizers, adhesive imparting agents, low molecular weight polymers, etc., according to the intended use. Surface lubricants, leveling agents, antioxidants, corrosion inhibitors, light stabilizers, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, antistatic agents, inorganic or organic fillers, metal powders, particles, foils, etc. .
<附分離件之光學用表面保護薄膜> 本發明之附分離件之光學用表面保護薄膜(表面保護薄膜)是將前述黏著劑層形成在基材薄膜之至少單面而成者,此時,一般來說黏著劑組成物之交聯是在塗佈黏著劑組成物後進行,但亦可將由交聯後的黏著劑組成物所構成之黏著劑層轉印至基材薄膜等。<Surface protection film for optics with a separator> The surface protection film for optics (surface protection film) with a separator of the present invention is formed by forming the aforementioned adhesive layer on at least one side of the base film. In this case, Generally, the cross-linking of the adhesive composition is performed after the adhesive composition is applied, but the adhesive layer composed of the cross-linked adhesive composition can also be transferred to a substrate film or the like.
又,在基材薄膜上形成黏著劑層之方法並無特別限制,例如可藉由將前述黏著劑組成物(溶液)塗佈在基材薄膜上,並將聚合溶劑等乾燥去除而於基材薄膜上形成黏著劑層來製作。其後,亦可為了黏著劑層成分移轉之調整或交聯反應之調整等而進行養護。又,將黏著劑組成物塗佈在基材薄膜上以製作表面保護薄膜時,亦可在前述黏著劑組成物中新添加聚合溶劑以外之1種以上的溶劑,使其能均勻地塗佈在基材薄膜上。In addition, the method of forming the adhesive layer on the substrate film is not particularly limited. For example, the adhesive composition (solution) can be applied to the substrate film and the polymerization solvent is dried to remove it. It is made by forming an adhesive layer on the film. Thereafter, curing may be performed for the adjustment of the transfer of the components of the adhesive layer or the adjustment of the crosslinking reaction. In addition, when the adhesive composition is coated on the base film to produce a surface protective film, one or more solvents other than the polymerization solvent may be newly added to the adhesive composition to make it uniformly coated On the substrate film.
又,作為製造本發明之表面保護薄膜時之黏著劑層形成方法,可使用眾所周知之用於製造黏著膠帶類的方法。具體來說,可列舉例如輥塗、凹版塗佈、逆輥式塗佈、輥刷、噴塗、氣刀式塗佈法、利用模塗機等之擠製塗佈法等。 In addition, as a method for forming the adhesive layer when manufacturing the surface protection film of the present invention, a well-known method for manufacturing adhesive tapes can be used. Specifically, examples thereof include roll coating, gravure coating, reverse roll coating, roll brushing, spray coating, air knife coating, and extrusion coating using a die coater.
本發明之表面保護薄膜中,通常前述黏著劑層之厚度為3~100μm,而以製作成5~50μm左右為佳。黏著劑層之厚度若在前述範圍內,可容易取得適當的再剝離性與接著性之平衡,故較佳。 In the surface protection film of the present invention, the thickness of the aforementioned adhesive layer is usually 3-100 μm , and it is better to make it about 5-50 μm. If the thickness of the adhesive layer is within the aforementioned range, an appropriate balance of re-peelability and adhesiveness can be easily achieved, which is preferable.
又,本發明之表面保護薄膜之總厚度宜為8~300μm,較宜為10~200μm,最宜為20~100μm。若為前述範圍內,則黏著特性(再剝離性、接著性等)、作業性、外觀特性優異,而為較佳態樣。另,前述總厚度是指包含基材薄膜、黏著劑層、分離件及其他層等之全部的層之厚度的合計。 In addition, the total thickness of the surface protection film of the present invention is preferably 8 to 300 μm , more preferably 10 to 200 μm , and most preferably 20 to 100 μm . If it is in the aforementioned range, the adhesive properties (repeelability, adhesiveness, etc.), workability, and appearance properties are excellent, which is a preferred aspect. In addition, the aforementioned total thickness refers to the total thickness of all layers including the base film, the adhesive layer, the separator, and other layers.
<分離件> <Separated Piece>
本發明表面保護薄膜係一於基材薄膜的至少單面具有黏著劑層、且於前述黏著劑層之與基材薄膜接觸之面為相反之面具有分離件者;該表面保護薄膜之特徵在於:前述分離件具有脫模層與聚酯系基材,前述聚酯系基材具有孔洞,前述聚酯系基材之厚度為25~100μm,且前述分離件對前述黏著劑層之180°起始剝離力在0.7N/50mm以下。前述分離件係為了保護黏著劑層之黏著面而於黏著劑層表面貼合分離件,尤因具有特定厚度及具有孔洞,故可將分離件本身的勁度(剛性)抑制地較低,使得從黏著劑層表面剝離分離件時之剝離性及作業性優異,並可藉由孔洞賦予緩衝性,從而可防止恐於塗敷黏著劑後產生之黏著凹痕等,而為較佳態樣。The surface protection film of the present invention has an adhesive layer on at least one side of the substrate film, and has a separator on the opposite surface of the adhesive layer that is in contact with the substrate film; the characteristics of the surface protection film are : The aforementioned separator has a release layer and a polyester-based substrate, the aforementioned polyester-based substrate has holes, the thickness of the aforementioned polyester-based substrate is 25 to 100 μm , and the aforementioned separator is 180° to the adhesive layer. °The initial peel force is below 0.7N/50mm. In order to protect the adhesive surface of the adhesive layer, the aforementioned separator is attached to the surface of the adhesive layer. Especially because it has a specific thickness and has holes, the stiffness (rigidity) of the separator itself can be suppressed to be low, so that When the separator is peeled from the surface of the adhesive layer, it has excellent releasability and workability, and cushioning properties can be provided by the holes, so that it can prevent the adhesive dents that may be generated after the adhesive is applied, which is a preferred aspect.
<聚酯系基材> 前述聚酯系基材(有時僅會稱「基材」)只要為可保護前述黏著劑層,且具有孔洞之聚酯系薄膜,則無特別限定,可列舉如聚對苯二甲酸乙二酯薄膜、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯等。<Polyester-based substrate> The aforementioned polyester-based substrate (sometimes simply referred to as "substrate") is not particularly limited as long as it is a polyester-based film that can protect the adhesive layer and has pores, and examples thereof include Polyethylene terephthalate film, polyethylene naphthalate, polybutylene terephthalate, etc.
前述聚酯系基材之厚度為25~100μm,宜為30~80μm,且較佳為40~70μm。若在前述範圍內,則對黏著劑層之貼合作業性與對黏著劑層之剝離性或作業性優異,故較佳。此外,若基材厚度大於100μm,則分離件本身的勁度(剛性)會變強,使剝離性或作業性變差而不佳。The thickness of the aforementioned polyester-based substrate is 25-100 μm, preferably 30-80 μm, and preferably 40-70 μm. If it is in the aforementioned range, the workability of sticking to the adhesive layer and the releasability or workability of the adhesive layer are excellent, and therefore it is preferable. In addition, if the thickness of the base material is greater than 100 μm, the stiffness (rigidity) of the separator itself will increase, and the peelability or workability will be poor.
前述聚酯系基材可因應需要在其表面施加電暈放電處理等之各種表面處理,或施加壓紋加工等之各種表面加工。還可因應需要摻混充填劑(無機充填劑、有機充填劑等)、抗老化劑、抗氧化劑、紫外線吸收劑、抗靜電劑、滑劑、塑化劑、著色劑(顏料、染料等)等各種添加劑。The aforementioned polyester-based substrate can be subjected to various surface treatments such as corona discharge treatment, or various surface treatments such as embossing, as required. It can also be blended with fillers (inorganic fillers, organic fillers, etc.), anti-aging agents, antioxidants, ultraviolet absorbers, antistatic agents, slip agents, plasticizers, colorants (pigments, dyes, etc.), etc. Various additives.
相對於前述聚酯系基材的體積,該聚酯系基材之孔洞率宜為15%(體積%)以上,以18%以上為較佳,以20%以上為更佳。藉由孔洞率為15%以上,可提高分離件的緩衝性,而可吸收因構成光學用表面保護薄膜之基材薄膜或構成分離件之聚酯系基材所含填料(例如聚對苯二甲酸乙二酯(PET)填料)所致之凹凸,並可抑制因分離件等所致之黏著凹痕等之產生。並且,因分離件的勁度(剛性)低故可提升分離件的剝離性。另,從分離件的強度等之觀點來看,孔洞率宜為40%以下,以30%以下為較佳。Relative to the volume of the aforementioned polyester-based substrate, the porosity of the polyester-based substrate is preferably 15% (vol%) or more, preferably 18% or more, and more preferably 20% or more. With a porosity of 15% or more, the cushioning properties of the separator can be improved, and the fillers (such as polyterephthalene) contained in the base film constituting the optical surface protection film or the polyester base material constituting the separator can be absorbed. Concave and convex caused by ethylene formate (PET) filler, and can suppress the generation of adhesion dents caused by separation parts, etc. In addition, since the stiffness (rigidity) of the separator is low, the peelability of the separator can be improved. In addition, from the viewpoint of the strength of the separator, etc., the porosity is preferably 40% or less, and more preferably 30% or less.
前述聚酯系基材的孔洞的形狀是球狀、橢圓球狀或細線狀等,且以採分散形態為佳。前述分散徑以0.01~100μm為佳,以0.05~30μm為較佳。若在前述範圍內,則具有分離件之強度,且緩衝性優異,並且分離件之剝離性優異,而為較佳態樣。此外,前述孔洞的形狀可利用掃描型電子顯微鏡觀察基材截面進行觀察。The shape of the pores of the aforementioned polyester-based base material is spherical, elliptical, or thin line-like, and it is preferable to adopt a dispersed form. The aforementioned dispersion diameter is preferably 0.01-100 μm, preferably 0.05-30 μm. If it is in the aforementioned range, it has the strength of the separator, excellent cushioning properties, and the peelability of the separator, which is a preferred aspect. In addition, the shape of the aforementioned hole can be observed by observing the cross section of the substrate with a scanning electron microscope.
<脫模層> 前述脫模層對前述聚酯系基材具有密著性,並且對前述黏著劑層具有剝離性,可由脫模劑組成物形成。前述脫模劑組成物並無特別限制,可使用例如二甲基矽氧烷或二苯基矽氧烷等之聚矽氧化合物;聚矽氧樹脂、氟樹脂、ASHIO RESIN等之長鏈烷基系化合物等。<The mold release layer> The mold release layer has adhesiveness to the polyester-based base material and releasability to the adhesive layer, and may be formed of a mold release agent composition. The aforementioned release agent composition is not particularly limited. Polysiloxane compounds such as dimethylsiloxane or diphenylsiloxane; long-chain alkyl groups such as polysiloxane resin, fluororesin, ASHIO RESIN, etc. can be used. Department of compounds and so on.
並且,在前述脫模劑組成物中亦可含有其他眾所周知之添加劑,例如可因應使用之用途適當添加抗靜電劑、著色劑、顏料等之粉體;界面活性劑、塑化劑、黏著賦予劑、低分子量聚合物、表面潤滑劑、調平劑、抗氧化劑、防腐蝕劑、光穩定劑、紫外線吸收劑、聚合抑制劑、矽烷耦合劑、無機或有機充填劑、金屬粉、粒子狀等。In addition, the aforementioned release agent composition may also contain other well-known additives, for example, powders such as antistatic agents, colorants, and pigments can be appropriately added according to the intended use; surfactants, plasticizers, and adhesion-imparting agents , Low molecular weight polymers, surface lubricants, leveling agents, antioxidants, corrosion inhibitors, light stabilizers, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, inorganic or organic fillers, metal powders, particles, etc.
<分離件之製作> 前述分離件是在前述聚酯系基材上使用前述脫模劑組成物而形成之物。<Production of the separator> The separator is formed by using the release agent composition on the polyester base material.
在前述聚酯系基材上形成脫模層之方法並無特別限制,例如藉由將前述脫模劑組成物之溶液塗佈於基材,並將聚合溶劑等乾燥去除而於基材上形成脫模層來製作。其後,亦可為了脫模層成分移轉之調整等而進行養護。又,將脫模劑組成物塗佈於基材上以製作脫模層時,亦可於前述脫模劑組成物中新添加聚合溶劑以外之1種以上的溶劑,使其能均勻地塗佈於基材上。The method of forming a release layer on the aforementioned polyester-based substrate is not particularly limited. For example, it can be formed on the substrate by applying a solution of the aforementioned release agent composition to the substrate and drying and removing the polymerization solvent. The release layer is made. After that, it is also possible to perform curing for the adjustment of the transfer of the components of the release layer, etc. In addition, when the release agent composition is applied to the substrate to produce a release layer, one or more solvents other than the polymerization solvent may be newly added to the release agent composition to enable uniform coating On the substrate.
又,前述脫模層之形成方法可使用眾所周知之用於脫模層製造之方法。具體來說,可列舉例如輥塗、凹版塗佈、逆輥式塗佈、輥刷、噴塗、氣刀式塗佈法、利用模塗機等之擠製塗佈法等。In addition, as the method for forming the aforementioned release layer, a well-known method for producing the release layer can be used. Specifically, examples thereof include roll coating, gravure coating, reverse roll coating, roll brushing, spray coating, air knife coating, and extrusion coating using a die coater.
前述脫模層之厚度,典型上為1~200nm,宜為5~100nm,較宜為10~50nm。若脫模層的厚度過小,脫模層的脫模效果弱而難以剝離分離件,因此會有致使難以進行貼合光學用表面保護薄膜之作業的情事。另一方面,若過厚,會有影響到光學用表面保護薄膜之黏著劑層的污染性之情況。The thickness of the aforementioned release layer is typically 1 to 200 nm, preferably 5 to 100 nm, and more preferably 10 to 50 nm. If the thickness of the release layer is too small, the release effect of the release layer is weak and it is difficult to peel the separator. Therefore, it may be difficult to perform the work of bonding the optical surface protection film. On the other hand, if it is too thick, it may affect the contamination of the adhesive layer of the optical surface protection film.
前述分離件之市售品可列舉例如Crisper K7211-50μm、Crisper K7211-38μm(以上為東洋紡公司製);PET50(K2411)PAT1 8LK、PET50(K2411)PAT1 9K(以上為Lintec公司製)等。Examples of commercially available products of the aforementioned separator include Crisper K7211-50 μm, Crisper K7211-38 μm (manufactured by Toyobo Co., Ltd. above); PET50 (K2411) PAT1 8LK, PET50 (K2411) PAT1 9K (manufactured by Lintec Co., Ltd. above) and the like.
<光學用表面保護薄膜與分離件之貼合> 本發明之附分離件之光學用表面保護薄膜之形態為於前述光學用表面保護薄膜之黏著劑層表面貼合前述分離件之脫模層而成。貼合作業可使用眾所周知之製造方法。<Lamination of optical surface protection film and separator> The form of the optical surface protection film with a separator of the present invention is to bond the release layer of the separator on the surface of the adhesive layer of the optical surface protection film. become. The pasting industry can use well-known manufacturing methods.
<光學構件> 在本發明中,可將從前述附分離件之光學用表面保護薄膜的黏著劑層表面剝離前述分離件後之光學用表面保護薄膜貼附至光學構件,以保護光學構件。前述分離件因具優異緩衝性故不易產生凹痕,並且剝離性良好,又前述光學用表面保護薄膜因外觀等級(外觀性)優異,故可使用於加工、輸送、出貨時等之表面保護用途(表面保護薄膜),而為有用於保護前述光學構件(偏光板等)的表面者。 實施例<Optical member> In the present invention, the surface protective film for optics after peeling off the surface of the adhesive layer of the above-mentioned separator-attached optical surface protection film can be attached to the optical member to protect the optical member. The aforementioned separator has excellent cushioning properties so that it is not easy to produce dents and has good peelability. Also, the aforementioned optical surface protection film has excellent appearance grade (appearance), so it can be used for surface protection during processing, transportation, and shipping. Use (surface protection film), and is useful for protecting the surface of the aforementioned optical member (polarizing plate, etc.). Example
以下說明與本發明有關的數個實施例,但並非意圖將本發明限定在相關具體例所示者。另,以下說明中的「份」及「%」只要無特別表明,即為重量基準。並已於表中顯示摻混量(添加量)。The following describes several embodiments related to the present invention, but it is not intended to limit the present invention to those shown in related specific examples. In addition, "parts" and "%" in the following description are based on weight unless otherwise specified. And the blending amount (addition amount) has been shown in the table.
又,以下說明中的各特性分別如下所述進行測定或評估。In addition, each characteristic in the following description was measured or evaluated as follows, respectively.
<構成分離件之聚酯系基材的孔洞率之測定> 以掃描型電子顯微鏡拍攝聚酯系基材的截面相片後,將截面區域的孔洞描繪於描圖膜,並將整面塗滿的圖以影像解析裝置進行影像處理,將孔洞率(%)以面積率求出後,而將其值直接作為孔洞率(體積%)來表示。 ・所使用的掃描型電子顯微鏡:日立製作所製之S-510型之掃描型電子顯微鏡 ・所使用的影像解析裝置: Nireco股份有限公司製之Luzex IID<Measurement of the porosity of the polyester-based substrate constituting the separator> After taking a cross-sectional photograph of the polyester-based substrate with a scanning electron microscope, the pores in the cross-sectional area are drawn on the tracing film, and the entire surface is painted. After performing image processing with an image analysis device, the porosity (%) is calculated as the area ratio, and the value is directly expressed as the porosity (vol%).・Scanning electron microscope used: S-510 scanning electron microscope manufactured by Hitachi, Ltd. ・Image analysis device used: Luzex IID manufactured by Nireco Co., Ltd.
<分離件厚度之測定> 分離件之厚度(分離件厚度)是聚酯系基材及脫模層的合計厚度,使用股份公司尾崎製作所公司製之R1-205進行測定。<Measurement of the thickness of the separator> The thickness of the separator (the thickness of the separator) is the total thickness of the polyester-based base material and the release layer, and is measured using R1-205 manufactured by Ozaki Manufacturing Co., Ltd.
<(甲基)丙烯酸系聚合物之玻璃轉移溫度(Tg)之測定> 玻璃轉移溫度Tg(℃)是使用下述文獻值作為由各單體形成之均聚物的玻璃轉移溫度Tgn(℃),並由下述式求出。 式:1/(Tg+273)=Σ[Wn/(Tgn+273)] (式中,Tg(℃)表示共聚物之玻璃轉移溫度,Wn(-)表示各單體之重量分率,Tgn(℃)表示各單體之均聚物的玻璃轉移溫度,n表示各單體之種類)。 文獻值: 丙烯酸2-乙基己酯(2EHA):-70℃ 丙烯酸丁酯(BA):-55℃ 丙烯酸2-羥乙酯(HEA):-15℃ 丙烯酸(AA):106℃ 另,文獻值是參照了「丙烯酸樹脂之合成·設計與新用途開發」(中央經營開發中心出版部發行)。<Measurement of the glass transition temperature (Tg) of (meth)acrylic polymers> The glass transition temperature Tg (℃) is the value of the following literature as the glass transition temperature Tgn (℃) of the homopolymer formed from each monomer , And calculated by the following formula. Formula: 1/(Tg+273)=Σ[Wn/(Tgn+273)] (where Tg(℃) represents the glass transition temperature of the copolymer, Wn(-) represents the weight fraction of each monomer, Tgn (°C) represents the glass transition temperature of the homopolymer of each monomer, n represents the type of each monomer). Literature value: 2-Ethylhexyl acrylate (2EHA): -70℃ Butyl acrylate (BA): -55℃ 2-Hydroxyethyl acrylate (HEA): -15℃ Acrylic acid (AA): 106℃ In addition, literature The value is based on the "Synthesis, Design and New Use Development of Acrylic Resin" (published by the Publishing Department of the Central Management Development Center).
<(甲基)丙烯酸系聚合物之重量平均分子量(Mw)之測定> 所使用的(甲基)丙烯酸系聚合物之重量平均分子量(Mw)使用東曹股份有限公司製之GPC裝置(HLC-8220GPC)進行測定。測定條件如下: 樣品濃度:0.2重量%(THF溶液) 樣品注入量:10μl 溶離液:THF 流速:0.6ml/min 測定溫度:40℃ 管柱: 樣品管柱:TSKguardcolumn SuperHZ-H(1支)+TSKgel SuperHZM-H(2支) 參考管柱:TSKgel SuperH-RC(1支) 檢測器:示差折射計(RI) 另,重量平均分子量是以聚苯乙烯換算值求出。<Measurement of the weight average molecular weight (Mw) of the (meth)acrylic polymer> The weight average molecular weight (Mw) of the (meth)acrylic polymer used uses the GPC device (HLC- 8220GPC) for measurement. The measurement conditions are as follows: Sample concentration: 0.2% by weight (THF solution) Sample injection volume: 10μl Eluent: THF Flow rate: 0.6ml/min Measurement temperature: 40℃ Column: Sample column: TSKguardcolumn SuperHZ-H (1 piece)+ TSKgel SuperHZM-H (2 units) Reference column: TSKgel SuperH-RC (1 unit) Detector: Differential Refractometer (RI) In addition, the weight average molecular weight is calculated in terms of polystyrene.
<有無對黏著劑層表面產生凹痕> 在暗室螢光燈下,將分離件從光學用表面保護薄膜的黏著劑層表面剝離,且使光線反射在黏著劑層表面,以目視確認了有無凹痕。無凹痕時標示為○、有凹痕時標示為×。<Whether there are dents on the surface of the adhesive layer> Under a fluorescent lamp in a darkroom, the separator is peeled off from the surface of the adhesive layer of the optical surface protection film, and light is reflected on the surface of the adhesive layer, and the presence or absence of dents is visually confirmed mark. When there is no dent, it is marked as ○, and when there is a dent, it is marked as ×.
<分離件之起始剝離力的測定> 如圖2所示,將附分離件之光學用表面保護薄膜3裁成寬50mm、長100mm之大小,並於貼合有雙面膠帶4(日東電工公司製、No.500)之玻璃5(S9213、松浪硝子工業公司製)上以0.25MPa之壓力、0.3m/分鐘之速度壓附構成附分離件之光學用表面保護薄膜3之基材薄膜22的表面。 然後將單面黏著膠帶6(No.720、日東電工公司製、寬50mm)裁成50mm之長度。並將該單面黏著膠帶6之黏著面用手動輥壓附於附分離件之光學用表面保護薄膜3之寬50mm的分離件1上,使其端部超出1mm。將其以23℃、50%RH之條件下放置10秒鐘。之後,用萬能試驗機於180°方向以0.3m/分鐘之速度剝離單面黏著膠帶6,並將剝離時之剝離初始時施加的最大應力當作起始剝離力(N/50mm)。<Measurement of the initial peel force of the separator> As shown in Figure 2, the optical
前述起始剝離力(剝除力)為0.7N/50mm以下,宜為0.68N/50mm以下,且較佳為0.65N/50mm以下。前述起始剝離力若大於0.7N/50mm,則於使用較厚的分離件時,從光學用表面保護薄膜之黏著劑層表面剝離分離件時耗費時間,故剝離性及作業性差而不佳。另一方面,若起始剝離力過低,恐有無法充分保護光學用表面保護薄膜之黏著劑層表面,故宜為0.2N/50mm以上。The aforementioned initial peeling force (peeling force) is 0.7N/50mm or less, preferably 0.68N/50mm or less, and preferably 0.65N/50mm or less. If the aforementioned initial peeling force is greater than 0.7N/50mm, when using a thick separator, it takes time to peel the separator from the surface of the adhesive layer of the optical surface protection film, so the peelability and workability are poor. On the other hand, if the initial peeling force is too low, it may not fully protect the surface of the adhesive layer of the optical surface protection film, so it is preferably 0.2N/50mm or more.
<(甲基)丙烯酸系聚合物(A)之調製> 將丙烯酸2-乙基己酯(2EHA)100重量份、丙烯酸2-羥基乙酯(HEA)4重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈(AIBN)0.2重量份、乙酸乙酯205重量份饋入具備攪拌葉片、溫度計、氮氣導入管、冷卻器的4口燒瓶中,一邊緩慢地攪拌一邊導入氮氣,將燒瓶內之液溫維持在63℃附近並進行約4小時聚合反應,而調製成(甲基)丙烯酸系聚合物(A)溶液(約35重量%)。前述(甲基)丙烯酸系聚合物(A)之重量平均分子量為65萬,Tg為-68℃。<Preparation of (meth)acrylic polymer (A)> 100 parts by weight of 2-ethylhexyl acrylate (2EHA) and 4 parts by weight of 2-hydroxyethyl acrylate (HEA) were used as
<(甲基)丙烯酸系聚合物(B)之調製> 將丙烯酸丁酯(BA)95重量份、丙烯酸(AA)5重量份、作為聚合起始劑之2,2'-偶氮雙異丁腈0.1重量份、乙酸乙酯234重量份饋入具備攪拌葉片、溫度計、氮氣導入管、冷卻器的4口燒瓶中,一邊緩慢地攪拌一邊導入氮氣,將燒瓶內之液溫維持在65℃附近並進行6小時聚合反應,而調製成(甲基)丙烯酸系聚合物(B)溶液(30重量%)。前述(甲基)丙烯酸系聚合物(B)之重量平均分子量(Mw)為110萬,玻璃轉移溫度(Tg)為-47℃。<Preparation of (meth)acrylic polymer (B)> 95 parts by weight of butyl acrylate (BA), 5 parts by weight of acrylic acid (AA), and 2,2'-azobisisobutyl as a polymerization initiator 0.1 part by weight of nitrile and 234 parts by weight of ethyl acetate were fed into a 4-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet tube, and a cooler. Nitrogen was introduced while stirring slowly, and the liquid temperature in the flask was maintained at around 65°C. The polymerization reaction was carried out for 6 hours to prepare a (meth)acrylic polymer (B) solution (30% by weight). The weight average molecular weight (Mw) of the aforementioned (meth)acrylic polymer (B) was 1.1 million, and the glass transition temperature (Tg) was -47°C.
[丙烯酸系黏著劑(1)溶液之調製] 將上述(甲基)丙烯酸系聚合物(A)溶液(35重量%)以乙酸乙酯稀釋成29重量%,並在此溶液500重量份(固體成分100重量份)中,添加作為交聯劑之3官能異氰酸酯化合物之二異氰酸六亞甲酯之三聚異氰酸酯體(Coronate HX:C/HX,日本聚胺甲酸乙酯公司製)4重量份(固體成分4重量份)、作為交聯觸媒之二月桂酸二丁錫(表2中之「Sn」,1重量%乙酸乙酯溶液)1.5重量份(固體成分0.015重量份)後,維持在25℃附近並進行約1分鐘混合攪拌,而調製成丙烯酸系黏著劑(1)溶液。[Preparation of Acrylic Adhesive (1) Solution] The above-mentioned (meth)acrylic polymer (A) solution (35% by weight) was diluted with ethyl acetate to 29% by weight, and 500 parts by weight of the solution (solid (Component 100 parts by weight), a tri-functional isocyanate compound as a crosslinking agent, a trimer isocyanate of hexamethylene diisocyanate (Coronate HX: C/HX, manufactured by Japan Polyurethane Co.) 4 weight Parts (
[丙烯酸系黏著劑(2)溶液之調製] 將上述(甲基)丙烯酸系聚合物(B)溶液(30重量%)以乙酸乙酯稀釋成29重量%,並在此溶液500重量份(固體成分100重量份)中,添加作為交聯劑之環氧系交聯劑(1,3-雙(N,N-二環氧丙基胺基甲基)環己烷、環氧當量:110、官能基数:4、商品名「TETRAD-C」:T/C、三菱瓦斯化學公司製)6重量份(固體成分6重量份)後,進行混合攪拌,而調製成丙烯酸系黏著劑(2)溶液。[Preparation of acrylic adhesive (2) solution] The above-mentioned (meth)acrylic polymer (B) solution (30% by weight) was diluted with ethyl acetate to 29% by weight, and 500 parts by weight of the solution (solid 100 parts by weight of ingredients), add epoxy-based crosslinking agent (1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, epoxy equivalent: 110, Number of functional groups: 4. Trade name "TETRAD-C": T/C, manufactured by Mitsubishi Gas Chemical Corporation) 6 parts by weight (6 parts by weight of solid content), then mixed and stirred to prepare an acrylic adhesive (2) solution .
[丙烯酸系黏著劑(3)溶液之調製] 將上述(甲基)丙烯酸系聚合物(A)溶液(35重量%)以乙酸乙酯稀釋成29重量%,並在此溶液500重量份(固體成分100重量份)中,添加作為交聯劑之異氰酸酯系交聯劑(二異氰酸六亞甲酯之三聚異氰酸酯體(商品名「Coronate HX」:C/HX、日本聚胺甲酸乙酯公司製)5重量份(固體成分5重量份)、作為交聯觸媒之二月桂酸二丁錫(1重量%乙酸乙酯溶液)3重量份(固體成分0.03重量份)、添加劑之不含有機聚矽氧烷之含聚氧伸烷基鏈化合物(Aqualon HS-10、第一工業製藥公司製)0.3重量份(固體成分0.3量份)後,進行混合攪拌,而調製成丙烯酸系黏著劑(3)溶液。[Preparation of acrylic adhesive (3) solution] The (meth)acrylic polymer (A) solution (35% by weight) was diluted with ethyl acetate to 29% by weight, and 500 parts by weight of the solution (solid 100 parts by weight of ingredients), add an isocyanate-based crosslinking agent (hexamethylene diisocyanate trimeric isocyanate body (trade name "Coronate HX": C/HX, Japanese polyurethane) Company made) 5 parts by weight (5 parts by weight of solid content), 3 parts by weight of dibutyltin dilaurate (1% by weight ethyl acetate solution) as a crosslinking catalyst (0.03 parts by weight of solid content), no additives After 0.3 parts by weight (0.3 parts by solid content) of organopolysiloxane containing polyoxyalkylene chain compound (Aqualon HS-10, manufactured by Daiichi Industrial Pharmaceutical Co., Ltd.), it was mixed and stirred to prepare an acrylic adhesive (3) Solution.
<實施例1> [抗靜電處理薄膜之製作] 將抗靜電劑(Solvex公司製,Micro-Solver RMd-142,以氧化錫與聚酯樹脂為主成分)10重量份,以由水30重量份與甲醇70重量份構成之混合溶劑稀釋,藉此調製成抗靜電劑溶液。 使用繞線棒(meyer bar)將製得之抗靜電劑溶液塗佈在基材薄膜之聚對苯二甲酸乙二酯 (PET)薄膜(厚度:38μm)上後,以130℃乾燥1分鐘去除溶劑,藉此形成抗靜電層(厚度:0.2μm),而製成抗靜電處理薄膜。<Example 1> [Production of antistatic treatment film] 10 parts by weight of antistatic agent (manufactured by Solvex, Micro-Solver RMd-142, mainly composed of tin oxide and polyester resin), and 30 parts by weight of water It is diluted with a mixed solvent composed of 70 parts by weight of methanol to prepare an antistatic agent solution. Use a meyer bar to coat the prepared antistatic agent solution on the base film of a polyethylene terephthalate (PET) film (thickness: 38μm), then dry at 130°C for 1 minute to remove The solvent forms an antistatic layer (thickness: 0.2 μm) to form an antistatic treatment film.
[附分離件之光學用表面保護薄膜之製作] 將上述丙烯酸系黏著劑(1)溶液塗佈在與上述抗靜電處理薄膜之抗靜電處理面相反之面上,並以130℃加熱2分鐘而形成厚度15μm的黏著劑層。接著,將單面經聚矽氧處理之分離件Crisper K7211-50μm(東洋紡公司製、聚酯系基材之比重:1.1g/cm3 、聚酯系基材之孔洞率:20%、厚度50μm)之聚矽氧處理面貼合於上述黏著劑層表面,而製成附分離件之光學用表面保護薄膜。[Production of optical surface protective film with separate parts] Coat the above-mentioned acrylic adhesive (1) solution on the surface opposite to the anti-static treatment surface of the above-mentioned anti-static treatment film, and heat it at 130°C for 2 minutes. An adhesive layer with a thickness of 15 μm is formed. Next, separate Crisper K7211-50μm (manufactured by Toyobo Co., Ltd., specific gravity of polyester-based substrate: 1.1g/cm 3 , porosity of polyester-based substrate: 20%, thickness of 50μm). ) The polysiloxane-treated surface is attached to the surface of the adhesive layer to form an optical surface protection film with separate parts.
<實施例2~5、比較例1~4> 如表2所示,使用實施例1所用之丙烯酸系黏著劑(1)溶液、或是取代其而使用丙烯酸系黏著劑(2)溶液或丙烯酸系黏著劑(3)溶液,並使用表3所記載之分離件外,依與實施例1相同方法而製出附分離件之光學用表面保護薄膜。<Examples 2 to 5, Comparative Examples 1 to 4> As shown in Table 2, the acrylic adhesive (1) solution used in Example 1 was used, or instead of it, an acrylic adhesive (2) solution or acrylic was used The adhesive (3) solution was used, and the separator described in Table 3 was used, and the optical surface protective film with the separator was produced in the same manner as in Example 1.
關於實施例及比較例之附分離件之光學用表面保護薄膜,將上述摻混內容、所進行之各種測定及評估結果顯示於表1~表3。另,表中的摻混量表示有效成分。Regarding the optical surface protection films with separate parts of the Examples and Comparative Examples, the contents of the above blending, various measurements and evaluation results performed are shown in Tables 1 to 3. In addition, the blending amount in the table represents the effective ingredient.
[表1] [Table 1]
[表2] [Table 2]
[表3] [table 3]
從上述表3可確認到,全部實施例藉由將構成分離件之聚酯系基材的孔洞率及厚度設為所期望之範圍,故具優異剝離性及作業性,並可防止產生凹痕。又,實施例中因黏著劑層表面未產生凹痕,故貼合於被附體時,不會夾帶氣泡,而在將光學用表面保護薄膜貼合於被附體之狀態下進行檢查時,可提供檢查性優異之光學用表面保護薄膜。另一方面,確認到比較例1~3因構成分離件之聚酯系基材的孔洞率不在所期望之範圍,故分離件之勁度(剛性)強,而剝離性及作業性差;比較例4則確認到因聚酯系基材之厚度不在所期望之範圍,故無法展現緩衝性,而產生分離件所致之凹痕。From Table 3 above, it can be confirmed that all the examples have excellent peelability and workability by setting the porosity and thickness of the polyester base material constituting the separator within the desired range, and can prevent the generation of sink marks. . In addition, since no dents are formed on the surface of the adhesive layer in the examples, air bubbles will not be entrained when it is attached to the attached body. However, when the optical surface protection film is attached to the attached body for inspection, Can provide optical surface protection film with excellent inspection properties. On the other hand, it was confirmed that in Comparative Examples 1 to 3, since the porosity of the polyester-based substrate constituting the separator is not in the expected range, the separator has strong stiffness (rigidity), but poor peelability and workability; Comparative Example 4 It was confirmed that because the thickness of the polyester-based substrate was not in the expected range, it was unable to exhibit cushioning properties, resulting in dents caused by separation parts.
產業上之可利用性 揭示於此之附分離件之光學用表面保護薄膜,適合在製造、輸送作為液晶顯示面板、電漿顯示面板(PDP)、有機電致發光(EL)顯示器等之構成要素使用的光學構件時等,當作用以保護該光學構件之表面保護薄膜。尤有用於作為適用於液晶顯示面板用之偏光板(偏光薄膜)、波長板、相位差板、光學補償薄膜、增亮薄膜、光擴散片、反射片等光學構件的光學用表面保護薄膜。Industrial Applicability The optical surface protection film with separate parts disclosed here is suitable for manufacturing and transporting as a component of liquid crystal display panels, plasma display panels (PDP), organic electroluminescence (EL) displays, etc. When the used optical member is used, it is used as a surface protection film for protecting the optical member. It is particularly useful as an optical surface protection film for optical components such as polarizing plates (polarizing films), wave plates, retardation plates, optical compensation films, brightness enhancement films, light diffusion sheets, and reflective sheets for liquid crystal display panels.
1‧‧‧分離件2‧‧‧光學用表面保護薄膜3‧‧‧附分離件之光學用表面保護薄膜4‧‧‧雙面黏著膠帶5‧‧‧玻璃6‧‧‧單面黏著膠帶11‧‧‧聚酯系基材12‧‧‧脫模層21‧‧‧黏著劑層22‧‧‧基材薄膜1‧‧‧Separation piece 2.‧‧‧Optical
圖1是顯示本發明之附分離件之光學用表面保護薄膜之一構成例的示意截面圖。 圖2是顯示從本發明之附分離件之光學用表面保護薄膜剝離分離件時之一構成例的示意截面圖。Fig. 1 is a schematic cross-sectional view showing a configuration example of a surface protective film for optics with a separator of the present invention. Fig. 2 is a schematic cross-sectional view showing a configuration example when the separator is peeled off from the optical surface protective film with separator of the present invention.
Claims (4)
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| JP2016256374A JP6895250B2 (en) | 2016-12-28 | 2016-12-28 | Surface protective film |
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| TWI741115B true TWI741115B (en) | 2021-10-01 |
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| EP2694463B8 (en) | 2011-04-04 | 2019-10-09 | Berg LLC | Treating central nervous system tumors with coenzyme q10 |
| SG10201907816RA (en) | 2013-09-04 | 2019-09-27 | Berg Llc | Methods of treatment of cancer by continuous infusion of coenzyme q10 |
| US20170189350A1 (en) | 2015-11-16 | 2017-07-06 | Berg Llc | Methods of treatment of temozolomide-resistant glioma using coenzyme q10 |
| KR102315065B1 (en) * | 2019-12-20 | 2021-10-20 | (주)이녹스첨단소재 | Adhesion variable adhesive composition for display and Adhesive sheet for display comprising the same |
| CN118265759A (en) * | 2021-11-26 | 2024-06-28 | 日东电工株式会社 | Covered optical adhesive sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10278203A (en) * | 1997-04-01 | 1998-10-20 | Diafoil Co Ltd | Release film |
| WO2016043275A1 (en) * | 2014-09-19 | 2016-03-24 | リンテック株式会社 | Surface-protective film |
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| JPH10286922A (en) * | 1997-04-15 | 1998-10-27 | Diafoil Co Ltd | Release film |
| JP4577540B2 (en) * | 2000-06-06 | 2010-11-10 | 東洋紡績株式会社 | Cavity-containing polyester release film |
| JP2002173650A (en) * | 2000-12-04 | 2002-06-21 | Hitachi Chem Co Ltd | Pressure-sensitive adhesive film for protecting optical sheet |
| JP4279118B2 (en) * | 2003-10-30 | 2009-06-17 | 藤森工業株式会社 | Surface protective film and optical component on which it is adhered |
| JP2006346899A (en) * | 2005-06-13 | 2006-12-28 | Sumitomo Electric Ind Ltd | Release film and adhesive film using it |
| JP5137319B2 (en) * | 2006-04-11 | 2013-02-06 | 日東電工株式会社 | Adhesive composition, adhesive sheet and surface protective film |
| JP2008266473A (en) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corp | Transparent adhesive sheet and flat panel display |
| JP2011252109A (en) * | 2010-06-03 | 2011-12-15 | Nitto Denko Corp | Sheet products |
| JP5683369B2 (en) | 2011-04-22 | 2015-03-11 | 藤森工業株式会社 | Adhesive composition and surface protective film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10278203A (en) * | 1997-04-01 | 1998-10-20 | Diafoil Co Ltd | Release film |
| WO2016043275A1 (en) * | 2014-09-19 | 2016-03-24 | リンテック株式会社 | Surface-protective film |
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| JP6895250B2 (en) | 2021-06-30 |
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| KR102364205B1 (en) | 2022-02-17 |
| CN110168036A (en) | 2019-08-23 |
| KR20190100310A (en) | 2019-08-28 |
| TW201832915A (en) | 2018-09-16 |
| JP2018109093A (en) | 2018-07-12 |
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