TWI515464B - Three - dimensional structure of high - speed miniaturized ceramic substrate optical device - Google Patents

Description

High-speed miniaturized ceramic substrate optical front-end device

The high-speed miniaturized ceramic substrate optical front-end device of the three-dimensional structure proposed by the invention is convenient for fabricating a high-stability low-cost high-speed miniaturized active optical fiber electrical connector, mainly derived from broadband optical fiber network technology. With the popularity of broadband applications, cloud services, coupled with the continuous innovation of consumer electronics, pushing the internal and external high-speed transmission interface to a higher transmission rate, the trend of high-speed transmission interface fiberization has formed, the optical engine of photoelectric conversion, Built-in connector plug, with the advantage of plug-and-play, users only need to face the interface, do not need to deal with the optical interface AOC (active optical cable, Active Optical Cable), currently on the market Actively promoted in various types, only the production methods are patented. Different from the production method of active optical cable in the existing market, the present invention mainly proposes a light engine device that subverts the thinking of traditional optical communication products, and realizes the optical front-end device stereo structure device of the ceramic substrate at high speed, so that it can be easily and quickly mass-produced. Produce high-stability, low-cost, high-speed miniaturized active fiber optic connector, enabling broadband fiber optic networks to continue to expand to the general internal and external high-speed transmission interface.

Due to the rise of Cloud Computing and the continuous innovation of consumer electronics products, the internal and external high-speed transmission interfaces continue to move toward higher transmission rates. Under this industry trend, the trend of high-speed transmission interface fiberization has taken shape. There will be in the future More and more external transmission interfaces are introduced into the optical connection technology; at the same time, the optical fibers are gradually introduced into the casing to become a data transmission medium between the various boards and components. In the future, optical connections can even become the main way for different signal blocks within the chip to communicate with each other.

Generally, optical transceivers require optical interface insertion and removal, which is far more difficult to manufacture than AOC, and the test production cost is also greatly increased. As for the optical transceiver and AOC, the main difference is a set of optical connectors, but the volume is still too large in use, and it is not suitable for small consumer products. At present, there are a small number of small-sized products on the market, mainly produced by international manufacturers, such as The 10G_XFP module led by Finisar, the world's leading optical module leader, is based on traditional TOSA (Transmit Optical Sub-Assemblies), ROSA (Receive Optical Sub-Assemblies), and 40GBASE QSFP+ (Quad Small Form-Factor Pluggable Plus) led by Avago. ), the surface-emitting laser die, the detector die, the driving chip and the transimpedance amplifying chip are directly disposed on the circuit board by die bonding and wire bonding, and 2 The 45-degree angle of rotation and the Lens Array (Lens Array) with a diameter of 250um introduce light into the fiber, both of which are the norm in the market. Recently, the optical fiber SiOB (Silicon Optical Bench) optical engine proposed by Yuanjie Technology is small and With streamlined processing procedures, but with expensive equipment and high-end technology, and patent-related issues, although it is a valuable niche product, it can only be used by a few manufacturers. .

In view of the above-mentioned conventional technology, the inventors of the present invention have made improvements and innovations in terms of production costs, technical thresholds and patents. After many years of painstaking research, they finally succeeded in research and development of this high-speed miniaturized ceramic substrate. The stereoscopic architecture device was developed to replace the light engine of the market active optical cable.

The object of the present invention is to provide a high-speed miniaturized ceramic substrate optical front-end device with a three-dimensional structure. With the popularization of broadband applications, the emergence of cloud services, and the continuous innovation of consumer electronic products, the trend of high-speed transmission interface fiberization. Formed. The invention is to extend the application of the transmission interface fiber to the general internal and external high-speed transmission interface, such as several main specifications of the consumer electronic external transmission interface SAS-3, PCIe 3.0, HDMI, Thunderbolt, Thunderbolt2, USB 3.0 It is connected to the internal and external systems such as USB 3.0 Plus to support plug and play, and is suitable for mobile storage and other areas that require frequent plugging and unplugging.遂Invented this high-speed miniaturized ceramic substrate optical front-end device stereo architecture device, enabling simple and rapid mass production to produce high stability and low-cost high-speed miniaturized active optical fiber connector, which is the purpose and necessity of the present invention. Sex.

The present invention has been made in view of the foregoing objects to provide a ceramic package high speed miniaturized optical front end architecture device having a three-dimensional structure. At present, active optical fiber patch cords for short-distance electrical connectors are mainly made of traditional TOSA, ROSA, SiOB and circuit board AOC. There is no three-dimensional substrate structure device made of precision ceramic materials. This is a subversion of traditional optical communication products. The biggest difference between the products in the existing market is that the package substrate fabricated by the precision ceramic method of the present invention can be designed as a device having a three-dimensional structure effect, and it is not necessary to rotate the beam at an angle like the SiOB and the AOC circuit board in order to avoid reflection and match the fiber coupling. In this paper, the main structure of the optical micro-ceramic substrate optical front-end device stereo structure device is improved. The miniaturized ceramic substrate is a three-dimensional space H-dimensional structure, which has a three-dimensional effect, so that all the surface-emitting laser light sources can be directly emitted. The light is directly coupled to the optical fiber, and the path is maintained in the environment of the optically-transmissive optical glue to reduce the light reflection interference while maintaining sufficient optical coupling space to achieve true volume miniaturization and effective control to make almost dull The purpose of the coupled light coupling is to design the fiber-coupled pedestal in the traditional production mode. In contrast, the high-speed miniaturized ceramic substrate optical front-end device stereo structure device does not need to be equipped with any optical lens and corner design, and can modify the circuit pin output of the high-speed miniaturized optical front-end device stereo structure device according to different product application requirements. Application interface board bonding is sufficient, so the risk of production can be reduced.

1‧‧‧Miniature ceramic substrate

2‧‧‧First anchor point

3‧‧‧Second anchor point

4‧‧‧Surface-emitting laser grains

5‧‧‧Detector grain

6‧‧‧Drive chip

7‧‧‧Transfer amplification chip

11‧‧‧Concentrated optical fiber jumper connector

12‧‧‧First positioning rod

13‧‧‧Second positioning rod

14‧‧‧First fiber

15‧‧‧second fiber

16‧‧‧Application interface board

17‧‧‧Remote detector grain

18‧‧‧Remote surface-emitting laser grains

The following is a detailed description of the present invention and its accompanying drawings, and the technical contents of the present invention and its effects can be further understood. The related drawings are: FIG. 1 , the high-speed miniaturized ceramic substrate structure including the three-dimensional structure of the present invention. 2 is a schematic view of a high-speed miniaturized ceramic substrate optical front-end device according to the three-dimensional structure of the present invention; and FIG. 3 is a top view of the high-speed miniaturized active optical fiber electrical connector.

The technical features, contents, and advantages of the present invention, as well as the advantages thereof, can be understood by the reviewing committee, and the present invention will be described in detail with reference to the accompanying drawings. The subject matter is only for the purpose of illustration and description. It is not intended to be a true proportion and precise configuration after the implementation of the present invention. Therefore, the scope and configuration relationship of the attached drawings should not be construed as limiting the scope of the invention in the actual implementation. First described.

1 is a schematic structural view of a high-speed miniaturized ceramic substrate including a three-dimensional structure of the present invention, and FIG. 2 is a schematic diagram of a high-speed miniaturized ceramic substrate optical front-end device of a complete three-dimensional structure, and FIG. 3 is a structural application of the foregoing structure. High-speed miniaturized active fiber optic connector Schematic diagram of the connector. The device composition of the present invention comprises: a miniaturized ceramic substrate 1, a first positioning point 2, a second positioning point 3, a surface-emitting laser die 4, a photodetector die 5, a driving wafer 6, and a transimpedance amplifying chip 7, This will be further explained below.

As shown in FIG. 1 and FIG. 2, the main structure of the present invention is a high-speed miniaturized ceramic substrate 1 having a three-dimensional structure, and the miniaturized ceramic substrate 1 has a three-dimensional space H-dimensional structure for integrating and connecting other components. The front surface of the laser crystal 4 and the photodetector die 5 are disposed on the front surface thereof, and have the first positioning point 2 and the second positioning point 3, and the reverse side of the miniaturized ceramic substrate 1 is disposed. The driving chip 6 and the transimpedance amplifying chip 7 are combined to form a high-speed miniaturized ceramic substrate optical front-end device of the invention.

The surface-emitting laser die 4 is used as an optical source and coupled to the external first fiber 14 and the second fiber 15; the photodetector die 5 serves as an optical receiving source, and the first optical fiber 14 The second optical fiber 15 is coupled; the driving chip 6 is for driving the surface-emitting laser die 4 and is connected to the external application interface circuit board 16; the transimpedance amplifying chip 7 is for amplifying the light of the photodetector die 5. The receiving signal is connected to the application interface circuit board 16; the first positioning point is the insertion point of the first positioning rod 12 of the external concentrating optical fiber patch cord connector 11, please refer to FIG. 3; the second positioning point is the concentrating The second positioning rod 13 insertion point of the fiber jumper connector 11 is detailed in FIG. 3; the surface-emitting laser die 4, the detector die 5, the driving chip 6 and The transimpedance amplifying chip 7 is disposed on the front and back sides of the miniaturized ceramic substrate 1 by chip bonding and wire bonding, and the metal wires are electrically connected to each other on both the front and the back sides, and the surface type can be connected. The surface of the laser die 4 and the driving chip 6 and the surface of the photodetector die 5 and the transimpedance amplifier wafer 7 are obtained to obtain the surface-emitting laser die 4 and the photodetector crystal. The pellets 5 are high speed miniaturized ceramic substrate optical front-end devices in a three-dimensional architecture of the present invention perpendicular to the application interface circuit board 16.

The signal and the power pin of the driving chip 6 and the transimpedance amplifier chip 7 are taken out from the bottom of the miniaturized ceramic substrate 1 and can be directly connected to the application interface circuit board 16, thereby directly providing appropriate power and signal transmission, belonging to the light engine. Architecture.

The detailed structure is as follows: 1) First, the surface-emitting laser crystal 4 is bonded by chip bonding and wire bonding, and the photodetector die 5 is disposed on the front surface of the high-speed miniaturized ceramic substrate 1, and the The driving wafer 6 and the transimpedance amplifying wafer 7 are disposed on the reverse side of the miniaturized ceramic substrate 1, please refer to the relative position of FIG. 2; 2) the metal wires are embedded in the front and back sides of the miniaturized ceramic substrate 1 Turning on, the surface of the surface-emitting laser die 4 and the pad side of the driving chip 6 and the surface of the photodetector die 5 and the transimpedance amplifier wafer 7 can be connected. The signal and the power pin of the driving chip 6 and the transimpedance amplifier chip 7 are taken out from the bottom of the miniaturized ceramic substrate 1 and can be directly connected to the application interface circuit board 16 to provide appropriate power and signal transmission; 3) For the mode of the source optical cable, please refer to FIG. 3, and the first optical fiber 14 and the second optical fiber 15 are fixed by the mold to form a concentrating optical fiber jumper connector 11 as shown in FIG. 3, and then the first The positioning rod 12 and the second positioning rod 13 are respectively inserted into the first positioning point 2 and the second positioning point 3, May be directly mounted to the framework of high-speed three-dimensional micro optical pre-ceramic substrate is The positioning and coupling are integrally formed, and then fixed by glue; 4) Compared with the traditional fiber-coupled pedestal design of the production mode, the invention does not need to be equipped with any optical lens and corner design, and can be modified according to different product application requirements. The circuit pin output of the ceramic substrate 1 can be bonded to the application interface circuit board 16.

The "high-speed miniaturized ceramic substrate optical front-end device" of the three-dimensional structure provided by the present invention has the following advantages when compared with other products:

1. At present, active short-circuit electrical connector active fiber patch cords are mainly made of traditional TOSA (Transmit Optical Sub-Assemblies), ROSA (Receive Optical Sub-Assemblies), SiOB and circuit board AOC. The substrate structure device, which is a subversion of the traditional optical communication product thinking, is designed with completely different materials as the package structure device, and the innovative material is used to fabricate the optical front-end device.

2. The light-emitting direction of the surface-emitting laser crystal 4 in the present invention can be directly coupled into the first optical fiber 14, and the optical signal is transmitted through the first optical fiber 14 to another high-speed structure of the present invention. a remote optical detector die on the miniaturized ceramic substrate optical front device, and a remote surface-emitting laser die 18 for transmitting optical signals through the second optical fiber 15 directly on the optical detector The die 5 is directly coupled with the concentrating optical fiber jumper connector 11 and integrated with the fiber-optic coupling pedestal design of the conventional manufacturing mode. The present invention does not need to be equipped with any optical lens and corner design, and can be different. Product application requirements, modify the circuit pin output of the high-speed miniaturized optical front-end device and the application interface circuit board 16 can be joined, without the need for the traditional production mode, the beam should be rotated first.

3. The surface-emitting laser die 4, the photodetector die 5, the driving die 6 and the transimpedance amplifying chip 7 are bonded to the miniaturized ceramic substrate 1 by chip bonding and wire bonding. The surface-emitting laser die 4 and the photodetector die 5 are designed in a high-speed miniaturized ceramic substrate optical front-end device perpendicular to the three-dimensional structure of the application interface circuit board 16, at the bottom of the same miniaturized ceramic substrate 1. The signal and power pins of the driving chip 6 and the transimpedance amplifying chip 7 are taken out, and the application interface circuit board 16 can be directly connected to directly provide appropriate power and signal transmission.

4. The present invention is only an example, that is, the miniaturized ceramic substrate 1 is transmitted and transmitted using only one set of optical transmissions. If the number of the miniaturized ceramic substrates 1 is increased, an array of extended ceramic ceramic substrates (Array) is formed as a plurality of groups. Optical transmission and transmission adjustment is also within the scope of this patent.

5. It is easy to manufacture, small in size, convenient for various products to adopt the shape change package of the application interface circuit board 16 to reduce the mold opening cost of product assembly and shorten the product development time.

6. Cooperating with the concentrating optical fiber jumper connector 11 to be coupled into the miniaturized active optical fiber connector, supporting plug and play, suitable for mobile access and other fields requiring frequent insertion and removal.

The detailed description of the present invention is intended to be illustrative of a preferred embodiment of the invention, and is not intended to limit the scope of the invention. The patent scope of this case.

To sum up, this case is not only innovative in terms of technical thinking, but also has many of the above-mentioned functions that are not in the traditional methods of the past. It has fully complied with the statutory invention patent requirements of novelty and progressiveness, and applied for it according to law. Approved this invention patent application, in order to invent invention, to the sense of virtue.

1‧‧‧Miniature ceramic substrate

2‧‧‧First anchor point

3‧‧‧Second anchor point

4‧‧‧Surface-emitting laser grains

5‧‧‧Detector grain

6‧‧‧Drive chip

7‧‧‧Transfer amplification chip

11‧‧‧Concentrated optical fiber jumper connector

12‧‧‧First positioning rod

13‧‧‧Second positioning rod

14‧‧‧First fiber

15‧‧‧second fiber

16‧‧‧Application interface board

17‧‧‧Remote detector grain

18‧‧‧Remote surface-emitting laser grains

Claims (3)

A three-dimensional high-speed miniaturized ceramic substrate optical front-end device, comprising: a miniaturized ceramic substrate, an H-shaped three-dimensional structure arranged in a three-dimensional space, and a front-surface type laser crystal grain and a detector crystal grain are arranged on the front surface thereof And having a first positioning point and a second positioning point, wherein the miniaturized ceramic substrate is provided with a driving chip and a transimpedance amplifying chip on the reverse side; the surface-emitting laser crystal grain is used as an optical transmitting source, and the external optical fiber is externally connected Coupling; the photodetector die acts as an optical receiving source and is coupled to the external second fiber; the driving chip drives the surface-emitting laser die to be connected to an external application interface circuit board; The chip is an optical receiving signal for amplifying the photodetector die, and is connected to the application interface circuit board; the first positioning point is a first positioning rod insertion point of the external concentrating optical fiber jumper connector; the second positioning point is the a second positioning rod insertion point of the concentrating optical fiber jumper connector; the surface-emitting laser ray, the illuminator die, the driving chip and the transimpedance amplifying chip are arranged by chip bonding and wire bonding On the miniaturized ceramic substrate, The miniaturized ceramic substrate is embedded with metal wires electrically connected to each other to connect the surface-type laser die and the pad surface of the driving chip, and the photodetector die and the transimpedance amplifier chip. The pad surface is such that the surface-emitting laser die and the detector die are perpendicular to the application interface circuit board. The high-speed miniaturized ceramic substrate optical front-end device of the three-dimensional structure described in claim 1, wherein the light-emitting direction of the surface-emitting laser crystal grain is directly coupled into the first optical fiber to transmit the optical signal Transmitting the first optical fiber to the remote optical detector die on the high-speed miniaturized ceramic substrate optical front-end device of the three-dimensional structure, and transmitting the optical signal through the remote surface-emitting laser die The two optical fibers are directly on the illuminator die, so that the concentrating light can be directly The fiber jumper connector is positioned and coupled integrally. The high-speed miniaturized ceramic substrate optical front-end device according to the three-dimensional structure described in claim 1, wherein the number of the miniaturized ceramic substrates is set to be more than one set, and the array is extended to form an array of optical transmission and transmission. Adjustment.