TWI502425B - Touch panel and touch display panel using the same - Google Patents
Touch panel and touch display panel using the same Download PDFInfo
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- TWI502425B TWI502425B TW102114808A TW102114808A TWI502425B TW I502425 B TWI502425 B TW I502425B TW 102114808 A TW102114808 A TW 102114808A TW 102114808 A TW102114808 A TW 102114808A TW I502425 B TWI502425 B TW I502425B
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
本發明是有關於一種觸控面板及使用其觸控顯示面板,且特別是有關於一種重工較容易的觸控面板及使用其之觸控顯示面板。The present invention relates to a touch panel and a touch display panel thereof, and more particularly to a touch panel that is easier to rework and a touch display panel using the same.
近年來,各式電子產品都不斷朝向操作簡便、小體積以及大螢幕(display)尺寸的方向邁進,特別是攜帶式的電子產品對於體積及螢幕尺寸的要求更為嚴格。因此,許多電子產品都整合了觸控顯示面板,以節省鍵盤或是操控按鍵所需的空間,進而擴大螢幕的面積。In recent years, various electronic products have been moving toward simple operation, small size, and large screen size. In particular, portable electronic products have stricter requirements on volume and screen size. Therefore, many electronic products integrate a touch display panel to save space on the keyboard or control buttons, thereby expanding the screen area.
一般而言,觸控面板具有彼此電性絕緣的多條連接線,分別連接於觸控面板中央的感測陣列與外圍的接墊之間。然而,隨著觸控顯示面板朝向窄邊框發展,連接線的布局密度相對提高。當採用蝕刻或印刷等方式來形成連接線時,相鄰兩連接線之間可能會有材料殘留(residue),導致連接線彼此間的電性干擾或甚至造成短路的問題。Generally, the touch panel has a plurality of connecting lines electrically insulated from each other, and is respectively connected between the sensing array in the center of the touch panel and the peripheral pads. However, as the touch display panel is developed toward a narrow bezel, the layout density of the connection lines is relatively increased. When a connection line is formed by etching or printing, there may be a material residue between adjacent two connection lines, causing electrical interference between the connection lines or even causing a short circuit.
雖然,為了確保觸控面板能正常運作,會在觸控面板的製程中進行一系列的電性檢測,但在檢測出電性干擾或短路問題時,連接線上已全面覆蓋絕緣層而難以移除此材料殘留。如此,觸控面板重工困難,相對提高了觸控面板的生產成本。Although a series of electrical detections are performed in the process of the touch panel in order to ensure the normal operation of the touch panel, when the electrical interference or short circuit problem is detected, the connection line is completely covered with the insulating layer and is difficult to remove. This material remains. In this way, the touch panel is difficult to rework, and the production cost of the touch panel is relatively increased.
本發明提供一種觸控面板,其重工容易,有助於提升製程良率,降低生產成本。The invention provides a touch panel, which is easy to rework and helps to improve the process yield and reduce the production cost.
本發明提供一種觸控面板,可有效降低連接線之間的電性干擾。The invention provides a touch panel, which can effectively reduce electrical interference between the connection lines.
在一實施例中,本發明的觸控面板包括一透光基板、一感測陣列、多個接墊、多條連接線以及一第一絕緣層。透光基板具有一內表面。感測陣列配置於內表面上。接墊配置於內表面上,並且鄰近透光基板的一側。連接線配置於內表面上,並且分別連接於感測陣列與相應的各接墊之間。第一絕緣層配置於透光基板上,並且覆蓋連接線,第一絕緣層具有一開口,暴露出兩相鄰連接線之間的部分內表面。In one embodiment, the touch panel of the present invention includes a light transmissive substrate, a sensing array, a plurality of pads, a plurality of connecting lines, and a first insulating layer. The light transmissive substrate has an inner surface. The sensing array is disposed on the inner surface. The pad is disposed on the inner surface and adjacent to one side of the transparent substrate. The connecting wires are disposed on the inner surface and are respectively connected between the sensing array and the corresponding pads. The first insulating layer is disposed on the transparent substrate and covers the connecting line. The first insulating layer has an opening exposing a portion of the inner surface between the two adjacent connecting lines.
在另一實施例中,本發明的觸控面板包括一透光基板、一第一透明導電層、一第一絕緣層、一第二透明導電層、一第二絕緣層、多個接墊以及多條連接線。透明基板具有一內表面。第一透明導電層位於內表面上,且第一透明導電層包括多個第一電極圖案。第一絕緣層位於第一電極圖案上。第二透明導電層位於 第一絕緣層上,且第二透明導電層包括多個第二電極圖案,且第一電極圖案與第二電極圖案共同構成一感測陣列。第二絕緣層覆蓋第二電極圖案。接墊配置於內表面上,並且鄰近基板的一側。連接線配置於內表面上,並且分別連接於感測陣列與相應的各接墊之間,該第一絕緣層覆蓋連接線,且第一絕緣層具有一開口,暴露出兩相鄰連接線之間的部分內表面。In another embodiment, the touch panel of the present invention includes a transparent substrate, a first transparent conductive layer, a first insulating layer, a second transparent conductive layer, a second insulating layer, and a plurality of pads. Multiple cables. The transparent substrate has an inner surface. The first transparent conductive layer is on the inner surface, and the first transparent conductive layer includes a plurality of first electrode patterns. The first insulating layer is on the first electrode pattern. The second transparent conductive layer is located The first transparent conductive layer includes a plurality of second electrode patterns, and the first electrode pattern and the second electrode pattern together form a sensing array. The second insulating layer covers the second electrode pattern. The pads are disposed on the inner surface and adjacent to one side of the substrate. The connecting line is disposed on the inner surface and is respectively connected between the sensing array and the corresponding pads. The first insulating layer covers the connecting line, and the first insulating layer has an opening exposing two adjacent connecting lines. Part of the inner surface.
本發明另提供一種應用前述觸控面板的觸控顯示面板。The present invention further provides a touch display panel using the foregoing touch panel.
在一實施例中,本發明的觸控顯示面板包含如前所述的觸控面板以及一顯示面板。顯示面板與觸控面板疊合。顯示面板包括一基板、一對向基板、一夾設於基板與對向基板之間的顯示介質層以及至少一連接墊。顯示面板定義有顯示區與周邊電路區。顯示區具有至少一個子畫素。子畫素與至少一訊號線連接,且子畫素具有至少一切換元件以及一與切換元件連接的至少一畫素電極。連接墊設置於周邊電路區,且連接墊與訊號線連接。In one embodiment, the touch display panel of the present invention includes the touch panel as described above and a display panel. The display panel is overlapped with the touch panel. The display panel includes a substrate, a pair of substrates, a display medium layer sandwiched between the substrate and the opposite substrate, and at least one connection pad. The display panel defines a display area and a peripheral circuit area. The display area has at least one sub-pixel. The sub-pixel is connected to at least one signal line, and the sub-pixel has at least one switching element and at least one pixel electrode connected to the switching element. The connection pad is disposed in the peripheral circuit area, and the connection pad is connected to the signal line.
在另一實施例中,本發明的觸控顯示面板包含如前所述的觸控面板、一基板、一顯示介質層以及至少一連接墊。顯示介質層夾設於基板與觸控面板之間,其中,觸控顯示面板定義有顯示區與周邊電路區。顯示區具有至少一個子畫素。子畫素與至少一訊號線連接,且子畫素具有至少一切換元件以及一與切換元件連接的至少一畫素電極。連接墊設置於周邊電路區,且連接墊與訊號線連接。In another embodiment, the touch display panel of the present invention includes the touch panel, a substrate, a display medium layer, and at least one connection pad as described above. The display medium layer is disposed between the substrate and the touch panel, wherein the touch display panel defines a display area and a peripheral circuit area. The display area has at least one sub-pixel. The sub-pixel is connected to at least one signal line, and the sub-pixel has at least one switching element and at least one pixel electrode connected to the switching element. The connection pad is disposed in the peripheral circuit area, and the connection pad is connected to the signal line.
基於上述,本發明利用觸控面板的第一絕緣層的開口暴 露出兩相鄰連接線之間的內表面,因此,若在形成連接線時有材料殘留的情形而導致連接線彼此電性干擾甚或短路的現象,即可輕易地移除兩相鄰連接線間的內表面上不必要的材料殘留,因而降低了觸控面板以及使用此觸控面板之觸控顯示面板的重工困難度以及製作成本。Based on the above, the present invention utilizes the opening storm of the first insulating layer of the touch panel. The inner surface between the two adjacent connecting lines is exposed, so that if there is material residue in the formation of the connecting line, the connecting lines are electrically interfered with each other or even short-circuited, and the two adjacent connecting lines can be easily removed. Unnecessary material remains on the inner surface, thus reducing the difficulty of the touch panel and the touch display panel using the touch panel and the manufacturing cost.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
10、10a‧‧‧觸控顯示面板10, 10a‧‧‧ touch display panel
100、200‧‧‧觸控面板100,200‧‧‧ touch panel
110、210‧‧‧透光基板110, 210‧‧‧Transparent substrate
112、212‧‧‧內表面112, 212‧‧‧ inner surface
114、214‧‧‧外表面114, 214‧‧‧ outer surface
120、220‧‧‧第一透明導電層120, 220‧‧‧ first transparent conductive layer
122‧‧‧第一電極圖案122‧‧‧First electrode pattern
130‧‧‧第一絕緣層130‧‧‧First insulation
140‧‧‧第二透明導電層140‧‧‧Second transparent conductive layer
142‧‧‧第二電極圖案142‧‧‧Second electrode pattern
150‧‧‧第二絕緣層150‧‧‧Second insulation
160‧‧‧接墊160‧‧‧ pads
170、270‧‧‧連接線170, 270‧‧‧ connecting lines
180、280‧‧‧遮光層180, 280‧‧ ‧ shading layer
230‧‧‧絕緣層230‧‧‧Insulation
300、400‧‧‧顯示面板300, 400‧‧‧ display panel
310、410‧‧‧基板310, 410‧‧‧ substrate
320‧‧‧對向基板320‧‧‧ opposite substrate
330、430‧‧‧顯示介質層330, 430‧‧‧ Display medium layer
340‧‧‧子畫素340‧‧‧Subpixels
342‧‧‧切換元件342‧‧‧Switching components
344‧‧‧畫素電極344‧‧‧ pixel electrodes
350‧‧‧訊號線350‧‧‧ Signal Line
360‧‧‧連接墊360‧‧‧Connecting mat
134、234‧‧‧開口134, 234‧‧‧ openings
P1‧‧‧顯示區P1‧‧‧ display area
S1、S2‧‧‧周邊電路區S1, S2‧‧‧ peripheral circuit area
SA‧‧‧感測陣列SA‧‧‧Sensor array
T1‧‧‧觸控區T1‧‧‧ touch area
圖1是依照本發明的一實施例的一種觸控面板的製作流程示意圖。FIG. 1 is a schematic diagram of a manufacturing process of a touch panel according to an embodiment of the invention.
圖2A至圖2E是對應圖3之製作流程的剖面結構示意圖。2A to 2E are schematic cross-sectional views corresponding to the manufacturing flow of FIG. 3.
圖3是圖2C的觸控面板沿A-A’線的剖面示意圖。3 is a cross-sectional view of the touch panel of FIG. 2C taken along line A-A'.
圖4是圖2E的觸控面板沿B-B’線的剖面示意圖。4 is a cross-sectional view of the touch panel of FIG. 2E taken along line B-B'.
圖5至圖9是依照本發明的不同實施例的觸控面板的局部剖面示意圖。5 to 9 are partial cross-sectional views of a touch panel in accordance with various embodiments of the present invention.
圖10是依照本發明的一實施例的一種觸控面板的製作流程示意圖。FIG. 10 is a schematic diagram of a manufacturing process of a touch panel according to an embodiment of the invention.
圖11是依照本發明的一實施例的一種觸控面板的局部剖面示意圖。FIG. 11 is a partial cross-sectional view of a touch panel in accordance with an embodiment of the invention.
圖12及圖13是依照本發明的不同實施例的觸控面板的局部 剖面示意圖。12 and 13 are portions of a touch panel in accordance with various embodiments of the present invention. Schematic diagram of the section.
圖14是依照本發明的一實施例的一種觸控顯示面板的剖面示意圖。FIG. 14 is a cross-sectional view of a touch display panel according to an embodiment of the invention.
圖15是圖14的顯示面板的等效電路示意圖。15 is a schematic diagram of an equivalent circuit of the display panel of FIG. 14.
圖16是依照本發明的另一實施例的一種觸控顯示面板的剖面示意圖。FIG. 16 is a cross-sectional view of a touch display panel in accordance with another embodiment of the present invention.
圖1是依照本發明的一實施例的一種觸控面板的製作流程示意圖。圖2A至圖2E依序繪示對應圖3之製作流程的剖面結構。本實施例的觸控面板的製作流程大致包括下列步驟:首先,如圖2A所示,形成多條連接線170以及多個接墊160於透光基板110上(步驟S110)。透光基板110具有一內表面112,而連接線170以及接墊160分別被形成於透光基板110的內表面112上。接墊160鄰近透光基板110的一側,而連接線170連接相應的接墊160。透光基板110的材質例如是玻璃、石英、有機聚合物、塑膠或是其它合適的透光材質。此處,透光材質泛指一般具備高穿透率之材質,而並非用以限定穿透率為100%之材質。連接線170可為單層或多層結構,且其材質可為金屬、合金、有機導電材料、上述材料之氧化物、上述材料之氮化物、上述材料之氮氧化物或其它用的導電材料,而上述的金屬材質例如可為鉬(Mo)、鉻(Cr)、鋁(Al)、釹(Nd)、鈦(Ti)、銅(Cu)、銀(Ag)、金(Au)、鋅(Zn)、 銦(In)、鎵(Ga)或上述的組合成複合材料。FIG. 1 is a schematic diagram of a manufacturing process of a touch panel according to an embodiment of the invention. 2A to 2E show the cross-sectional structure corresponding to the manufacturing flow of FIG. 3 in sequence. The manufacturing process of the touch panel of the present embodiment generally includes the following steps. First, as shown in FIG. 2A, a plurality of connecting lines 170 and a plurality of pads 160 are formed on the transparent substrate 110 (step S110). The transparent substrate 110 has an inner surface 112, and the connecting wires 170 and the pads 160 are formed on the inner surface 112 of the transparent substrate 110, respectively. The pad 160 is adjacent to one side of the transparent substrate 110, and the connecting line 170 is connected to the corresponding pad 160. The material of the transparent substrate 110 is, for example, glass, quartz, organic polymer, plastic or other suitable light transmissive material. Here, the light-transmitting material generally refers to a material having a high transmittance, and is not intended to limit a material having a transmittance of 100%. The connecting wire 170 may be a single layer or a multi-layer structure, and the material thereof may be metal, alloy, organic conductive material, oxide of the above material, nitride of the above material, oxynitride of the above material or other conductive material, and The above metal material may be, for example, molybdenum (Mo), chromium (Cr), aluminum (Al), niobium (Nd), titanium (Ti), copper (Cu), silver (Ag), gold (Au), zinc (Zn). ), Indium (In), gallium (Ga) or a combination of the above is a composite material.
接著,如圖2B所示,形成一第一透明導電層120於透光基板110的內表面112上(步驟S120)。透光基板110包括一觸控區T1與一周邊電路區S1,且周邊電路區S1實質上圍繞觸控區T1設置。第一透明導電層120包括位於觸控區T1內的多個第一電極圖案122。在本實施例中,第一透明導電層120可為單層或多層結構,且其材料包括銦錫氧化物(Indium Tin Oxide,ITO)、銦鋅氧化物(Indium Zinc Oxide,IZO)、鋁錫氧化物(Aluminum Tin Oxide,ATO)、鋁鋅氧化物(Aluminum Zinc Oxide,AZO)、銦鎵氧化物(Indium Gallium Oxide,IGO)、鋁鎵氧化物(Aluminum Gallium Oxide,AGO)或其它合適的透明導電材料。Next, as shown in FIG. 2B, a first transparent conductive layer 120 is formed on the inner surface 112 of the transparent substrate 110 (step S120). The transparent substrate 110 includes a touch area T1 and a peripheral circuit area S1, and the peripheral circuit area S1 is substantially disposed around the touch area T1. The first transparent conductive layer 120 includes a plurality of first electrode patterns 122 located in the touch region T1. In this embodiment, the first transparent conductive layer 120 may be a single layer or a multilayer structure, and the material thereof includes Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), and aluminum tin. Aluminium Oxide (ATO), Aluminum Zinc Oxide (AZO), Indium Gallium Oxide (IGO), Aluminum Gallium Oxide (AGO) or other suitable transparent Conductive material.
之後,如圖2C所示,覆蓋一第一絕緣層130於第一透明導電層120及連接線170上(步驟S130)。更具體而言,第一絕緣層130覆蓋第一電極圖案122以及連接線170,且第一絕緣層130具有接觸窗132,用以暴露出局部的第一電極圖案122,例如每一第一電極圖案122的兩端。另外,本實施例更在第一絕緣層130對應於兩相鄰連接線170之間的位置上形成開口(opening),以暴露出該兩相鄰連接線170之間的部分內表面112。圖3進一步繪示沿圖2C之A-A’線的剖面結構。如圖3所示,藉由在第一絕緣層130的開口134,可在兩相鄰連接線170之間形成空氣間隙(air gap)。第一絕緣層130可為單層或多層結構,且其材料可包括無機絕緣材料例如氧化矽、氮化矽或氮氧化矽之至少一者或其它合適的材料, 或有機絕緣材料例如光阻、苯並環丁烯(benzocyclobutene,BCB)、聚甲基丙烯酸甲酯(Polymethylmethacrylate,PMMA)、聚醯亞胺(polyimide,PI)其中至少一種或其他合適的材料。當然,本發明不以此為限,凡是可以提供絕緣特性的材料都可以選擇性地應用於本實施例以製作第一絕緣層。Thereafter, as shown in FIG. 2C, a first insulating layer 130 is overlaid on the first transparent conductive layer 120 and the connection line 170 (step S130). More specifically, the first insulating layer 130 covers the first electrode pattern 122 and the connection line 170, and the first insulating layer 130 has a contact window 132 for exposing a partial first electrode pattern 122, such as each first electrode. Both ends of the pattern 122. In addition, the present embodiment further forms an opening at a position where the first insulating layer 130 corresponds to between two adjacent connecting lines 170 to expose a portion of the inner surface 112 between the two adjacent connecting lines 170. Fig. 3 further illustrates the cross-sectional structure taken along line A-A' of Fig. 2C. As shown in FIG. 3, an air gap can be formed between the two adjacent connecting lines 170 by the opening 134 of the first insulating layer 130. The first insulating layer 130 may be a single layer or a multilayer structure, and the material thereof may include an inorganic insulating material such as at least one of cerium oxide, tantalum nitride or cerium oxynitride or other suitable materials. Or an organic insulating material such as photoresist, benzocyclobutene (BCB), polymethylmethacrylate (PMMA), polyimide (PI), at least one or other suitable materials. Of course, the present invention is not limited thereto, and any material that can provide insulating properties can be selectively applied to the present embodiment to fabricate the first insulating layer.
接著,如圖2D所示,形成一第二透明導電層140於第一絕緣層130上(步驟S140),其中,第二透明導電層140包括多個第二電極圖案142,而圖2B所示的第一電極圖案122與圖2D所示的第二電極圖案142共同構成本實施例之感測陣列,而連接線170則連接於感測陣列以及接墊160之間。在本實施例中,第二透明導電層140可為單層或多層結構,且其材料可選自第一透明導電層120所述的材料,且二者元件120與140之材料相同或不相皆可使用。Next, as shown in FIG. 2D, a second transparent conductive layer 140 is formed on the first insulating layer 130 (step S140), wherein the second transparent conductive layer 140 includes a plurality of second electrode patterns 142, and FIG. 2B The first electrode pattern 122 and the second electrode pattern 142 shown in FIG. 2D together form the sensing array of the embodiment, and the connecting line 170 is connected between the sensing array and the pad 160. In this embodiment, the second transparent conductive layer 140 may be a single layer or a multi-layer structure, and the material thereof may be selected from the materials described in the first transparent conductive layer 120, and the materials of the two elements 120 and 140 are the same or not. Can be used.
接著,在本實施例中,可例如於步驟S140之後執行步驟S160,也就是對觸控面板進行電性檢測,以確保觸控面板能正常運作。此時,若在透過形成連接線170時有材料殘留的情形而導致檢測出連接線170有電性干擾或短路的現象,即可執行S170,對觸控面板進行重工,由於本實施例的第一絕緣層130的開口OP暴露出兩相鄰連接線170之間的內表面112,因此於重工時可透過開口134而輕易地移除不必要的材料殘留,降低觸控面板100的重工困難度以及製作成本。Then, in this embodiment, step S160 can be performed after step S140, that is, electrical detection is performed on the touch panel to ensure that the touch panel can operate normally. At this time, if there is a phenomenon that the connection line 170 is electrically disturbed or short-circuited due to the material remaining when the connection line 170 is formed, the S170 can be performed to rework the touch panel. The opening OP of the insulating layer 130 exposes the inner surface 112 between the two adjacent connecting lines 170, so that unnecessary material residue can be easily removed through the opening 134 during rework, and the difficulty of reworking the touch panel 100 is reduced. And production costs.
接著,如圖2E所示,覆蓋一第二絕緣層150於第二透明 導電層140以及連接線170上(步驟S150),其中,第二絕緣層150如圖2C所示覆蓋第二電極圖案142以及連接線170。在本實施例中,第二絕緣層150可為單層或多層結構,且其材料可選自第一絕緣層130所述的材料,且二者元件130與150之材料相同或不相皆可使用。當然,本發明不以此為限,凡是可以提供絕緣特性的材料都可以選擇性地應用於本實施例以製作第二絕緣層150。Next, as shown in FIG. 2E, a second insulating layer 150 is covered on the second transparent layer. The conductive layer 140 and the connection line 170 are formed (step S150), wherein the second insulating layer 150 covers the second electrode pattern 142 and the connection line 170 as shown in FIG. 2C. In this embodiment, the second insulating layer 150 may be a single layer or a multi-layer structure, and the material thereof may be selected from the materials described in the first insulating layer 130, and the materials of the elements 130 and 150 may be the same or different. use. Of course, the present invention is not limited thereto, and any material that can provide insulating properties can be selectively applied to the present embodiment to fabricate the second insulating layer 150.
在此須說明的是,步驟S160以及步驟S170亦可不如前所述在步驟S140後執行,而是在完成步驟S150後執行,也就是在將第二絕緣層150覆蓋第二透明導電層140以及連接線170後,再對觸控面板100進行電性測試。但在此配置下,第二絕緣層150亦須暴露開口134所暴露的部分內表面112,以在檢測出連接線170有材料殘留而導致電性干擾或短路的現象時,可輕易對第一絕緣層130及第二絕緣層150所暴露出的兩相鄰連接線170間的內表面112進行重工,移除不必要的材料殘留。It should be noted that step S160 and step S170 may also be performed after step S140 as described above, but after step S150 is completed, that is, the second insulating layer 150 is covered with the second transparent conductive layer 140 and After the connection line 170 is connected, the touch panel 100 is electrically tested. However, in this configuration, the second insulating layer 150 must also expose a portion of the inner surface 112 exposed by the opening 134 to facilitate the first detection when the material of the connecting line 170 is detected to cause electrical interference or short circuit. The inner surface 112 between the two adjacent connecting lines 170 exposed by the insulating layer 130 and the second insulating layer 150 is reworked to remove unnecessary material residue.
此外,在本發明的其它實施例中,更可填充一介電材(未繪示)於開口134上方,使其位於兩相鄰連接線170之間,其中介電材的介電常數小於第一絕緣層的介電常數,以降低相鄰兩連接線170間的電性干擾。在本實施例中,介電材可為單層或多層結構,且其材料例如為光學膠(optically clear adhesive,OCA)、水膠(Liquid Optical Clear Adhesive,LOCA)或其它合適的材料。In addition, in other embodiments of the present invention, a dielectric material (not shown) may be filled over the opening 134 so as to be located between two adjacent connecting lines 170, wherein the dielectric constant of the dielectric material is smaller than the first insulating layer. The dielectric constant is to reduce electrical interference between adjacent two connecting lines 170. In this embodiment, the dielectric material may be a single layer or a multilayer structure, and the material thereof is, for example, an optically clear adhesive (OCA), a liquid optical adhesive (LOCA) or other suitable material.
依上述的製程所製作出的觸控面板100如圖2E所示包括一透光基板110、一第一透明導電層120、一第一絕緣層130、一 第二透明導電層140、一第二絕緣層150、多個接墊160以及多條連接線170。透明基板110具有內表面112。第一透明導電層120即位於內表面112上,第一絕緣層130覆蓋於第一透明導電層120的第一電極圖案122上。第二透明導電層140配置於第一絕緣層130上,且第二透明導電層140包括多個第二電極圖案142,而第一電極圖案122與第二電極圖案142共同構成感測陣列SA。第二絕緣層150覆蓋第二電極圖案142。接墊160配置於內表面112上並鄰近透光基板110的一側。連接線170亦配置於內表面112上,並且分別連接於感測陣列SA與相應的各接墊160之間。As shown in FIG. 2E, the touch panel 100 manufactured by the above process includes a transparent substrate 110, a first transparent conductive layer 120, a first insulating layer 130, and a first The second transparent conductive layer 140 , a second insulating layer 150 , a plurality of pads 160 , and a plurality of connecting lines 170 . The transparent substrate 110 has an inner surface 112. The first transparent conductive layer 120 is located on the inner surface 112, and the first insulating layer 130 covers the first electrode pattern 122 of the first transparent conductive layer 120. The second transparent conductive layer 140 is disposed on the first insulating layer 130, and the second transparent conductive layer 140 includes a plurality of second electrode patterns 142, and the first electrode patterns 122 and the second electrode patterns 142 together constitute the sensing array SA. The second insulating layer 150 covers the second electrode pattern 142. The pad 160 is disposed on the inner surface 112 and adjacent to one side of the transparent substrate 110. The connecting wires 170 are also disposed on the inner surface 112 and are respectively connected between the sensing array SA and the corresponding pads 160.
承上述,圖4進一步繪示沿圖2E之B-B’線的剖面結構。如圖4所示,第二絕緣層150亦暴露開口134所暴露的部分內表面112,以在第一絕緣層130及第二絕緣層150所暴露出的兩相鄰連接線170之間形成空氣間隙。如此,在檢測出連接線170有材料殘留而導致電性干擾或短路的現象時,即可輕易對第一絕緣層130及第二絕緣層150所暴露出的兩相鄰連接線170間的內表面112進行重工,移除不必要的材料殘留。In view of the above, Figure 4 further illustrates the cross-sectional structure taken along line B-B' of Figure 2E. As shown in FIG. 4, the second insulating layer 150 also exposes a portion of the inner surface 112 exposed by the opening 134 to form an air between the two adjacent connecting lines 170 exposed by the first insulating layer 130 and the second insulating layer 150. gap. In this way, when it is detected that the connection line 170 has a material residue and causes electrical interference or short circuit, the inside of the two adjacent connection lines 170 exposed by the first insulation layer 130 and the second insulation layer 150 can be easily performed. Surface 112 is reworked to remove unnecessary material residue.
當然,本實施例的觸控面板並不侷限於如圖4的配置方式,在本發明的其它實施例中,透明導電層120亦可覆蓋於連接線170上或是配置於第一絕緣層130以及第二絕緣層150之間,以下將列舉幾種觸控面板之其它可能的配置方式。The touch panel of the present embodiment is not limited to the configuration of FIG. 4 . In other embodiments of the present invention, the transparent conductive layer 120 may be over the connection line 170 or disposed on the first insulating layer 130 . And between the second insulating layer 150, other possible configurations of several touch panels will be listed below.
圖5至圖9是依照本發明的不同實施例的觸控面板的局部剖面示意圖。具體而言,如圖5所示,第一透明導電層120更 可覆蓋連接線170,也就是第一透明導電層120位於連接線170與第一絕緣層130之間,而第二絕緣層150覆蓋第一絕緣層130。5 to 9 are partial cross-sectional views of a touch panel in accordance with various embodiments of the present invention. Specifically, as shown in FIG. 5, the first transparent conductive layer 120 is further The connection line 170 may be covered, that is, the first transparent conductive layer 120 is located between the connection line 170 and the first insulating layer 130, and the second insulating layer 150 covers the first insulating layer 130.
請參照圖6,在本實施例中,第二絕緣層150配置於第一絕緣層130上。第一透明導電層120覆蓋連接線170且位於連接線170與第一絕緣層130之間,而第二透明導電層140覆蓋第一絕緣層130並位於第一絕緣層130與第二絕緣層150之間,第二透明導電層140可對罩覆於其內連接線170形成一屏蔽作用,進一步降低兩相鄰連接線170之間的電性干擾。Referring to FIG. 6 , in the embodiment, the second insulating layer 150 is disposed on the first insulating layer 130 . The first transparent conductive layer 120 covers the connection line 170 and is located between the connection line 170 and the first insulation layer 130 , and the second transparent conductive layer 140 covers the first insulation layer 130 and is located at the first insulation layer 130 and the second insulation layer 150 . Between the second transparent conductive layer 140, a shield can be formed on the inner connecting line 170 to further reduce the electrical interference between the two adjacent connecting lines 170.
請參照圖7,在本實施例中,第二絕緣層150配置於第一絕緣層130上,而第二透明導電層140更覆蓋第一絕緣層130,且位於第一絕緣層130與第二絕緣層150之間,以對罩覆於其內的連接線170形成一屏蔽作用,進一步降低兩相鄰連接線170之間的電性干擾。Referring to FIG. 7 , in the embodiment, the second insulating layer 150 is disposed on the first insulating layer 130 , and the second transparent conductive layer 140 further covers the first insulating layer 130 , and is located in the first insulating layer 130 and the second layer Between the insulating layers 150, a shielding effect is formed on the connecting wires 170 covered by the cover, thereby further reducing electrical interference between the two adjacent connecting wires 170.
請參照圖8,在本實施例中,第二絕緣層150亦可覆蓋開口134所暴露的部分內表面112。但在此配置下,觸控面板的電性測試則須在第二絕緣層150設置之前進行,也就是在圖1中的步驟S150之前進行,以在覆蓋第二絕緣層150之前,先測試篩選出有材料殘留而導致短路的觸控面板,並對其第一絕緣層130所暴露的兩相鄰連接線170之間的內表面112再次進行蝕刻,移除不必要的材料殘留。之後,再將第二絕緣層150覆蓋於第一絕緣層130以及開口134所暴露的部分內表面112上。此外,第二絕緣層150亦可覆蓋開口134所暴露的部分內表面112的設計亦可運用於 圖5~圖7中。Referring to FIG. 8 , in the embodiment, the second insulating layer 150 may also cover a portion of the inner surface 112 exposed by the opening 134 . However, in this configuration, the electrical test of the touch panel must be performed before the second insulating layer 150 is disposed, that is, before step S150 in FIG. 1 to test and screen before covering the second insulating layer 150. The touch panel with residual material causes a short circuit, and the inner surface 112 between the two adjacent connecting lines 170 exposed by the first insulating layer 130 is etched again to remove unnecessary material residue. Thereafter, the second insulating layer 150 is overlaid on the first insulating layer 130 and a portion of the inner surface 112 exposed by the opening 134. In addition, the design that the second insulating layer 150 can also cover a portion of the inner surface 112 exposed by the opening 134 can also be applied to Figure 5 to Figure 7.
請參照圖9,進一步而言,在本實施例中,如圖5至圖8所示的觸控面板更可包括配置於透光基板110上的一遮光層180。在本實施例中,較佳地,遮光層180可例如配置於連接線170之下且位於內表面112與至少兩相鄰連接線170之間。也就是說,遮光層180設置於透光基板110之周邊電路區S1上,並暴露出觸控區T1,而可防止周邊電路區S1漏光。當然,本發明並不以此為限。在本發明的其它實施例中,遮光層180亦可設置於絕緣層130、150的上方。遮光層180例如為黑矩陣(black matrix),其材質包括遮光樹脂、遮光金屬或是遮光樹脂與遮光金屬之複合材質。此外,較佳地,遮光層180可例如配置於連接線170之下且位於內表面112與至少兩相鄰連接線170之間的設計亦可運用於圖5~圖8中。Referring to FIG. 9 , further, in the embodiment, the touch panel shown in FIG. 5 to FIG. 8 further includes a light shielding layer 180 disposed on the transparent substrate 110 . In this embodiment, preferably, the light shielding layer 180 can be disposed under the connection line 170 and between the inner surface 112 and at least two adjacent connection lines 170. That is to say, the light shielding layer 180 is disposed on the peripheral circuit region S1 of the transparent substrate 110, and exposes the touch region T1, thereby preventing the peripheral circuit region S1 from leaking light. Of course, the invention is not limited thereto. In other embodiments of the present invention, the light shielding layer 180 may also be disposed above the insulating layers 130, 150. The light shielding layer 180 is, for example, a black matrix, and the material thereof includes a light shielding resin, a light shielding metal, or a composite material of a light shielding resin and a light shielding metal. In addition, preferably, the design that the light shielding layer 180 can be disposed under the connection line 170 and between the inner surface 112 and the at least two adjacent connection lines 170 can also be applied to FIGS. 5-8.
在此須說明的是,本發明的觸控面板的感測陣列除了如前所述地由雙層透明導電層交疊而成之外,亦可由單層的透明導電層來形成感測陣列,再覆蓋絕緣層於單層感測陣列以及連接線上,以下將對其製作流程做更詳細的說明。It should be noted that the sensing array of the touch panel of the present invention may be formed by a single transparent conductive layer to form a sensing array, in addition to being overlapped by a double transparent conductive layer as described above. The insulating layer is covered on the single-layer sensing array and the connecting line. The production process will be described in more detail below.
圖10繪示了本實施例的觸控面板的製作流程圖,圖11是本實施例的觸控面板的局部剖面示意圖。本實施例的觸控面板的製作流程其大致包括下列步驟:首先,分別形成多條連接線270以及多個接墊(未繪示)於透光基板210的一內表面212上(步驟S210),其中,接墊如圖2A之接墊160所示之設置於鄰近透光基 板的一側,而連接線270則連接各接墊。在本實施例中,透光基板的材質例如是玻璃、石英、有機聚合物、塑膠或是其它合適的透光材質。FIG. 10 is a flow chart showing the manufacturing process of the touch panel of the embodiment, and FIG. 11 is a partial cross-sectional view showing the touch panel of the embodiment. The manufacturing process of the touch panel of the present embodiment generally includes the following steps: First, a plurality of connecting lines 270 and a plurality of pads (not shown) are formed on an inner surface 212 of the transparent substrate 210 (step S210). , wherein the pad is disposed adjacent to the transparent substrate as shown by the pad 160 of FIG. 2A One side of the board, and the connecting line 270 connects the pads. In this embodiment, the material of the transparent substrate is, for example, glass, quartz, organic polymer, plastic or other suitable light transmissive material.
接著,形成一感測陣列於透光基板210的內表面212上(步驟S220),其中透光基板210包括一觸控區與一周邊電路區如圖2B所示觸控區T1與周邊電路區S1,且周邊電路區實質上圍繞觸控區設置,感測陣列位於觸控區,而接墊以及連接線270則配置於周邊電路區,且連接線270連接於感測陣列以及接墊之間。之後,再覆蓋一絕緣層230於感測陣列及連接線270上(步驟S230),其中,絕緣層230如圖11所示具有一開口234,暴露出兩相鄰連接線270之間的部分內表面212。絕緣層230可為單層或多層結構,且其材料可選自上述實施例中絕緣層130所述之材料。Then, a sensing array is formed on the inner surface 212 of the transparent substrate 210 (step S220), wherein the transparent substrate 210 includes a touch area and a peripheral circuit area, as shown in FIG. 2B, the touch area T1 and the peripheral circuit area. S1, and the peripheral circuit area is substantially disposed around the touch area, the sensing array is located in the touch area, and the pad and the connection line 270 are disposed in the peripheral circuit area, and the connection line 270 is connected between the sensing array and the pad . Thereafter, an insulating layer 230 is overlaid on the sensing array and the connecting line 270 (step S230), wherein the insulating layer 230 has an opening 234 as shown in FIG. 11 to expose a portion between the two adjacent connecting lines 270. Surface 212. The insulating layer 230 may be a single layer or a multilayer structure, and the material thereof may be selected from the materials described in the insulating layer 130 in the above embodiment.
之後,再對觸控面板200進行電性檢測(步驟S240),以確保觸控面板200能正常運作。此時,若在透過形成連接線270時有材料殘留的情形而導致檢測出連接線270有電性干擾或短路的現象,即可對觸控面板200進行重工(執行S250),由於本實施例的絕緣層230的開口234暴露出兩相鄰連接線270之間的內表面212,因此於重工時可透過開口234而輕易地移除不必要的材料殘留,降低觸控面板200的重工困難度以及製作成本。After that, the touch panel 200 is electrically detected (step S240) to ensure that the touch panel 200 can operate normally. At this time, if there is a phenomenon that the connection line 270 is electrically disturbed or short-circuited due to the material remaining when the connection line 270 is formed, the touch panel 200 can be reworked (execution S250), since this embodiment The opening 234 of the insulating layer 230 exposes the inner surface 212 between the two adjacent connecting lines 270, so that unnecessary material residue can be easily removed through the opening 234 during rework, and the difficulty of reworking the touch panel 200 is reduced. And production costs.
此外,本實施例亦可如前所述於絕緣層230的開口234上方形成有位於兩相鄰連接線270之間的空氣間隙或填充介電材,且介電材的介電常數小於第一絕緣層的介電常數,以降低兩 相鄰連接線270間的電性干擾。在本實施例中,介電材可為單層或多層結構,且其材料例如為光學膠(optically clear adhesive,OCA)、水膠(Liquid Optical Clear Adhesive,LOCA)或其它合適的材料。In addition, in this embodiment, an air gap or a filling dielectric between two adjacent connecting lines 270 may be formed over the opening 234 of the insulating layer 230 as described above, and the dielectric constant of the dielectric material is smaller than the first. The dielectric constant of the insulating layer to lower the two Electrical interference between adjacent connecting lines 270. In this embodiment, the dielectric material may be a single layer or a multilayer structure, and the material thereof is, for example, an optically clear adhesive (OCA), a liquid optical adhesive (LOCA) or other suitable material.
當然,本實施例的觸控面板200並不侷限於如圖11的配置方式,圖12及圖13為觸控面板的其它配置方式之局部剖面結構。具體而言,請參照圖12,用以形成感測陣列的透明導電層220更可覆蓋於連接線270上,也就是透明導電層220位於連接線270以及第一絕緣層230之間。Of course, the touch panel 200 of the present embodiment is not limited to the configuration of FIG. 11 , and FIG. 12 and FIG. 13 are partial cross-sectional structures of other configurations of the touch panel. Specifically, referring to FIG. 12 , the transparent conductive layer 220 for forming the sensing array can cover the connection line 270 , that is, the transparent conductive layer 220 is located between the connection line 270 and the first insulation layer 230 .
請參照圖13,在本實施例中,如圖11及圖12所示的觸控面板更可包括配置於透光基板210上的一遮光層280。在本實施例中,較佳地,遮光層280可例如配置於連接線270之下且位於內表面212與至少兩相鄰連接線270之間。也就是說,遮光層280設置於透光基板210之周邊電路區上,並暴露出觸控區,而可防止周邊電路區漏光。當然,本發明並不以此為限。在本發明的其它實施例中,遮光層280亦可設置於絕緣層230的上方。遮光層280例如為黑矩陣(black matrix),其材質包括遮光樹脂、遮光金屬或是遮光樹脂與遮光金屬之複合材質。此外,較佳地,遮光層280可例如配置於連接線270之下且位於內表面212與至少兩相鄰連接線270之間的設計亦可運用於圖11~圖12中。Referring to FIG. 13 , in the embodiment, the touch panel shown in FIG. 11 and FIG. 12 further includes a light shielding layer 280 disposed on the transparent substrate 210 . In the present embodiment, preferably, the light shielding layer 280 can be disposed under the connection line 270 and between the inner surface 212 and at least two adjacent connection lines 270. That is to say, the light shielding layer 280 is disposed on the peripheral circuit area of the transparent substrate 210, and exposes the touch area, thereby preventing light leakage in the peripheral circuit area. Of course, the invention is not limited thereto. In other embodiments of the present invention, the light shielding layer 280 may also be disposed above the insulating layer 230. The light shielding layer 280 is, for example, a black matrix, and the material thereof includes a light shielding resin, a light shielding metal, or a composite material of a light shielding resin and a light shielding metal. In addition, preferably, the light shielding layer 280 can be disposed, for example, under the connection line 270 and between the inner surface 212 and the at least two adjacent connection lines 270, and can also be applied to FIGS. 11-12.
圖14是依照本發明的一實施例的一種觸控顯示面板的剖面示意圖。圖15是圖14的顯示面板的等效電路示意圖。前述觸 控面板100或200適於應用至本實施例的觸控顯示面板10中。亦即,本實施例的觸控顯示面板10包含如前述實施例之觸控面板100或200以及一顯示面板300,其中顯示面板與觸控面板100或200疊合。在本實施例中,觸控面板100或200是利用其相對內表面之外表面114或214(例如為圖4或圖11所示的外表面114或214)疊合於顯示面板300上。為了,讓上述二面板能夠牢固通常會再於觸控面板(100或200)與顯示面板300之間加入粘著層(未標示),例如:光學膠(optically clear adhesive,OCA)、水膠(Liquid Optical Clear Adhesive,LOCA)或其它合適的材料。也就是說,粘著層(未標示)夾設於觸控面板(100或200)之基板(110或210)外表面(114或214)與顯示面板300之基板(320或310)外表面。顯示面板300可例如是穿透型顯示面板、半穿透型顯示面板、反射型顯示面板、彩色濾光片於主動層上(color filter on array)之顯示面板、主動層於彩色濾光片上(array on color filter)之顯示面板、垂直配向型(VA)顯示面板、水平切換型(IPS)顯示面板、多域垂直配向型(MVA)顯示面板、扭曲向列型(TN)顯示面板、超扭曲向列型(STN)顯示面板、圖案垂直配向型(PVA)顯示面板、超級圖案垂直配向型(S-PVA)顯示面板、先進大視角型(ASV)顯示面板、水平切換型顯示面板(IPS)、邊緣電場切換型(FFS)顯示面板、連續焰火狀排列型(CPA)顯示面板、軸對稱排列微胞型(ASM)顯示面板、光學補償彎曲排列型(OCB)顯示面板、超級水平切換型(S-IPS)顯示面板、先進超級水平切換型(AS-IPS)顯示面板、極端邊緣電場切換型(UFFS) 顯示面板、藍相液晶顯示面板、高分子穩定配向型顯示面板、雙視角型(dual-view)顯示面板、三視角型(triple-view)顯示面板、三維顯示面板(three-dimensional)、電泳顯示面板、電濕潤顯示面板、電激發光顯示面板、或其它型面板、或上述之組合。FIG. 14 is a cross-sectional view of a touch display panel according to an embodiment of the invention. 15 is a schematic diagram of an equivalent circuit of the display panel of FIG. 14. The aforementioned touch The control panel 100 or 200 is adapted to be applied to the touch display panel 10 of the present embodiment. That is, the touch display panel 10 of the present embodiment includes the touch panel 100 or 200 and the display panel 300 as in the foregoing embodiments, wherein the display panel is overlapped with the touch panel 100 or 200. In the present embodiment, the touch panel 100 or 200 is superposed on the display panel 300 with its opposite inner surface outer surface 114 or 214 (eg, the outer surface 114 or 214 shown in FIG. 4 or FIG. 11). In order to enable the above two panels to be firmly fixed, an adhesive layer (not labeled), such as an optically clear adhesive (OCA) or a water gel, is usually added between the touch panel (100 or 200) and the display panel 300. Liquid Optical Clear Adhesive, LOCA) or other suitable materials. That is, an adhesive layer (not labeled) is interposed on the outer surface (114 or 214) of the substrate (110 or 210) of the touch panel (100 or 200) and the outer surface of the substrate (320 or 310) of the display panel 300. The display panel 300 can be, for example, a transmissive display panel, a transflective display panel, a reflective display panel, a color filter on a display panel of a color filter on array, and an active layer on a color filter. (array on color filter) display panel, vertical alignment type (VA) display panel, horizontal switching type (IPS) display panel, multi-domain vertical alignment type (MVA) display panel, twisted nematic (TN) display panel, super Twisted nematic (STN) display panel, pattern vertical alignment type (PVA) display panel, super pattern vertical alignment type (S-PVA) display panel, advanced large viewing angle (ASV) display panel, horizontal switching display panel (IPS) ), edge electric field switching type (FFS) display panel, continuous flame-like arrangement (CPA) display panel, axisymmetric array microcell type (ASM) display panel, optical compensation curved alignment type (OCB) display panel, super horizontal switching type (S-IPS) display panel, advanced super horizontal switching type (AS-IPS) display panel, extreme edge electric field switching type (UFFS) Display panel, blue phase liquid crystal display panel, polymer stable alignment display panel, dual-view display panel, triple-view display panel, three-dimensional display panel, electrophoretic display A panel, an electrowetting display panel, an electroluminescent display panel, or other type of panel, or a combination thereof.
更具體而言,本實施例的顯示面板300包括一基板310、一對向基板320、一夾設於基板310與對向基板320之間的顯示介質層330以及至少一連接墊360。在本實施例中,基板310例如是主動元件陣列基板,而顯示介質層330例如為液晶層、電激發光層或其它合適的材料層。對向基板320位於基板310的對向。顯示面板300定義有一顯示區P1與一周邊電路區S2。顯示區P1具有至少一個子畫素340。子畫素340與至少一訊號線350連接,訊號線350例如是資料線或/及掃描線等,用以與子畫素340連接。子畫素340具有至少一切換元件342以及一與切換元件342連接的至少一畫素電極344。切換元件342例如為薄膜電晶體(Thin Film Transistor,TFT),其中薄膜電晶體的類型可為底閘型電晶體、頂閘型電晶體、或其它合適的電晶體。連接墊360設置於周邊電路區S2,且連接墊360與訊號線350連接。More specifically, the display panel 300 of the present embodiment includes a substrate 310, a pair of substrates 320, a display medium layer 330 interposed between the substrate 310 and the opposite substrate 320, and at least one connection pad 360. In the present embodiment, the substrate 310 is, for example, an active device array substrate, and the display dielectric layer 330 is, for example, a liquid crystal layer, an electroluminescent layer, or other suitable material layer. The opposite substrate 320 is located opposite to the substrate 310. The display panel 300 defines a display area P1 and a peripheral circuit area S2. The display area P1 has at least one sub-pixel 340. The sub-pixel 340 is connected to at least one signal line 350. The signal line 350 is, for example, a data line or/and a scan line or the like for connecting to the sub-pixel 340. The sub-pixel 340 has at least one switching element 342 and at least one pixel electrode 344 connected to the switching element 342. The switching element 342 is, for example, a Thin Film Transistor (TFT), and the type of the thin film transistor may be a bottom gate type transistor, a top gate type transistor, or other suitable transistor. The connection pad 360 is disposed in the peripheral circuit area S2, and the connection pad 360 is connected to the signal line 350.
圖16是依照本發明的另一實施例的一種觸控顯示面板的剖面示意圖。前述觸控面板100或200適於應用至本實施例的觸控顯示面板10a中。亦即,本實施例的觸控顯示面板10a包含如前述實施例之觸控面板100或200、一基板410、一顯示介質層420以及至少一連接墊430。基板410例如是主動元件陣列基板,而顯 示介質層430例如是液晶層、電激發光層或其它合適的材料層。顯示介質層430夾設於基板410與觸控面板100之基板110或觸控面板200之基板210之間以構成觸控顯示面板10a。在本實施例中,顯示介質層430是夾設於觸控面板100或200的透光基板的外表面114或214(例如為圖4或圖11所示的外表面114或214)以及基板410之間。觸控顯示面板10a的電路配置亦可例如為圖15所示,觸控顯示面板10a定義有顯示區P1與周邊電路區S2。顯示區P1具有至少一個子畫素340。子畫素340與至少一訊號線350連接,以透過訊號線350提供子畫素340顯示訊號。子畫素340具有至少一切換元件342以及一與切換元件342連接的至少一畫素電極344。切換元件342例如為薄膜電晶體(Thin Film Transistor,TFT)連接墊360設置於周邊電路區S2,且連接墊360與訊號線350連接。連接墊360適於與一驅動晶片電性連接,以驅動觸控顯示面板10a。FIG. 16 is a cross-sectional view of a touch display panel in accordance with another embodiment of the present invention. The touch panel 100 or 200 is suitable for application to the touch display panel 10a of the present embodiment. That is, the touch display panel 10a of the present embodiment includes the touch panel 100 or 200, a substrate 410, a display medium layer 420, and at least one connection pad 430 as in the foregoing embodiments. The substrate 410 is, for example, an active device array substrate, and The dielectric layer 430 is, for example, a liquid crystal layer, an electroluminescent layer, or other suitable material layer. The display medium layer 430 is interposed between the substrate 410 and the substrate 110 of the touch panel 100 or the substrate 210 of the touch panel 200 to form the touch display panel 10a. In this embodiment, the display medium layer 430 is an outer surface 114 or 214 (for example, the outer surface 114 or 214 shown in FIG. 4 or FIG. 11 ) and the substrate 410 of the transparent substrate sandwiched between the touch panel 100 or 200 . between. The circuit configuration of the touch display panel 10a can also be, for example, as shown in FIG. 15. The touch display panel 10a defines a display area P1 and a peripheral circuit area S2. The display area P1 has at least one sub-pixel 340. The sub-pixel 340 is coupled to at least one of the signal lines 350 to provide a sub-pixel 340 display signal through the signal line 350. The sub-pixel 340 has at least one switching element 342 and at least one pixel electrode 344 connected to the switching element 342. The switching element 342 is, for example, a Thin Film Transistor (TFT) connection pad 360 disposed in the peripheral circuit region S2, and the connection pad 360 is connected to the signal line 350. The connection pad 360 is adapted to be electrically connected to a driving chip to drive the touch display panel 10a.
綜上所述,本發明利用觸控面板的絕緣層的開口暴露出兩相鄰連接線之間的內表面,因此,若在形成連接線時有材料殘留的情形而導致連接線電性干擾或短路的現象,即可輕易地移除兩相鄰連接線間的內表面上不必要的材料殘留,因而降低了觸控面板以及使用此觸控面板之觸控顯示面板的重工困難度以及製作成本。此外,本發明更可填充空氣或是其介電常數小於第一絕緣層的介電常數之介電材於第一絕緣層的開口上方,以進一步降低連接線彼此間的電性干擾,以提升觸控面板以及使用此觸控面板 之觸控顯示面板的性能。In summary, the present invention utilizes the opening of the insulating layer of the touch panel to expose the inner surface between two adjacent connecting lines. Therefore, if there is material residue in the formation of the connecting line, the connecting line is electrically disturbed or The short circuit phenomenon can easily remove unnecessary material residue on the inner surface between two adjacent connecting lines, thereby reducing the difficulty of the touch panel and the touch display panel using the touch panel, and the manufacturing cost. . In addition, the present invention can further fill air or a dielectric material having a dielectric constant smaller than the dielectric constant of the first insulating layer over the opening of the first insulating layer to further reduce electrical interference between the connecting lines to enhance Touch panel and using the touch panel The performance of the touch display panel.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
110‧‧‧透光基板110‧‧‧Transparent substrate
112‧‧‧內表面112‧‧‧ inner surface
114‧‧‧外表面114‧‧‧ outer surface
130‧‧‧第一絕緣層130‧‧‧First insulation
170‧‧‧連接線170‧‧‧Connecting line
134‧‧‧開口134‧‧‧ openings
Claims (24)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102114808A TWI502425B (en) | 2013-04-25 | 2013-04-25 | Touch panel and touch display panel using the same |
| CN201310247493.4A CN103440061B (en) | 2013-04-25 | 2013-06-20 | Touch panel and touch display panel using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102114808A TWI502425B (en) | 2013-04-25 | 2013-04-25 | Touch panel and touch display panel using the same |
Publications (2)
| Publication Number | Publication Date |
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| TW201441881A TW201441881A (en) | 2014-11-01 |
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| TWI560601B (en) * | 2015-09-08 | 2016-12-01 | Ritdisplay Corp | Touch display panel |
| US11367373B1 (en) * | 2021-02-04 | 2022-06-21 | Novatek Microelectronics Corp. | Driver integrated circuit |
| CN113407062B (en) * | 2021-07-14 | 2022-10-25 | 业成科技(成都)有限公司 | Display panel and terminal device |
| CN114911376B (en) | 2022-05-31 | 2025-10-31 | 武汉天马微电子有限公司 | Touch panel and touch display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201001262A (en) * | 2008-06-23 | 2010-01-01 | Au Optronics Corp | Capacitive touch panel and manufacturing method thereof |
| TW201205384A (en) * | 2010-06-04 | 2012-02-01 | Wintek Corp | Touch-sensitive device and fabrication method thereof |
| TW201314518A (en) * | 2011-09-19 | 2013-04-01 | Wintek Corp | Touch-sensitive device and touch-sensitive display device |
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| CN101221309A (en) * | 2008-01-28 | 2008-07-16 | 友达光电股份有限公司 | Touch control type display device |
| CN101989160A (en) * | 2009-08-07 | 2011-03-23 | 铼宝科技股份有限公司 | Capacitive touch panel |
| US9582392B2 (en) * | 2010-09-14 | 2017-02-28 | Microsoft Technology Licensing, Llc | Add-on performance advisor |
| CN102929454A (en) * | 2011-08-12 | 2013-02-13 | 宸鸿科技(厦门)有限公司 | Capacitive touch panel and method for reducing visibility of metal conductors thereof |
| CN102646000B (en) * | 2012-03-02 | 2015-09-09 | 华映光电股份有限公司 | The manufacture method of contact panel |
| CN102955311B (en) * | 2012-10-30 | 2015-12-09 | 南京中电熊猫液晶显示科技有限公司 | A kind of liquid crystal indicator of embedded touch control |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201001262A (en) * | 2008-06-23 | 2010-01-01 | Au Optronics Corp | Capacitive touch panel and manufacturing method thereof |
| TWI378377B (en) * | 2008-06-23 | 2012-12-01 | Au Optronics Corp | Capacitive touch panel and manufacturing method thereof |
| TW201205384A (en) * | 2010-06-04 | 2012-02-01 | Wintek Corp | Touch-sensitive device and fabrication method thereof |
| TW201314518A (en) * | 2011-09-19 | 2013-04-01 | Wintek Corp | Touch-sensitive device and touch-sensitive display device |
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| CN103440061A (en) | 2013-12-11 |
| TW201441881A (en) | 2014-11-01 |
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