TWI401715B - Button module and digital device having the same - Google Patents
Button module and digital device having the same Download PDFInfo
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- TWI401715B TWI401715B TW099142908A TW99142908A TWI401715B TW I401715 B TWI401715 B TW I401715B TW 099142908 A TW099142908 A TW 099142908A TW 99142908 A TW99142908 A TW 99142908A TW I401715 B TWI401715 B TW I401715B
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- contact
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- magnetic plate
- protrusions
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- 230000005291 magnetic effect Effects 0.000 claims description 98
- 238000003825 pressing Methods 0.000 claims description 40
- 125000006850 spacer group Chemical group 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 150000002910 rare earth metals Chemical class 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012905 input function Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- Push-Button Switches (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Description
本發明涉及按鍵模組,特別涉及一種便於組裝之按鍵模組及具有該按鍵模組之數位裝置。The invention relates to a button module, in particular to a button module which is easy to assemble and a digital device having the button module.
隨著數位技術飛速發展,電腦、行動電話等數位產品於人們日常生活及自動化生產中扮演著愈來愈重要作用。對電腦、手機等之控制與資料輸入主要藉由按鍵來實現,由此可見,按鍵之重要性不容置疑。With the rapid development of digital technology, digital products such as computers and mobile phones are playing an increasingly important role in people's daily life and automated production. The control and data input to computers, mobile phones, etc. are mainly realized by buttons, and thus the importance of the buttons is unquestionable.
先前數位裝置之按鍵常具有金屬彈片,操作時,金屬彈片受力發生形變而電連接於電路之兩個觸點之間,從而實現資料輸入。當外力作用消失後,彈片恢復形變。組裝該按鍵時,需要將金屬彈片逐個放置於電路之預定位置,將耗費大量之人力與時間。並且,金屬彈片輕且薄,組裝時,常發生於一預定位置放置複數片相互堆疊之金屬彈片之現象,不利於提高組裝良率。此外,金屬彈片都有一定之使用壽命,於經歷複數次按壓後,將發生疲勞現象,不利於提高按鍵之使用壽命。The buttons of the previous digital device often have metal shrapnel. During operation, the metal shrapnel is deformed by force and electrically connected between the two contacts of the circuit, thereby realizing data input. When the external force disappears, the shrapnel recovers. When the button is assembled, it is necessary to place the metal domes one by one at a predetermined position of the circuit, which will consume a lot of manpower and time. Moreover, the metal shrapnel is light and thin, and when assembled, a phenomenon in which a plurality of metal shingles stacked on each other are placed at a predetermined position often occurs, which is disadvantageous for improving the assembly yield. In addition, the metal shrapnel has a certain service life, and after a plurality of presses, fatigue phenomenon will occur, which is not conducive to improving the service life of the button.
有鑑於此,提供一種便於組裝之按鍵模組及具有該按鍵模組之數位裝置,以提高組裝效率,並提供較長之使用壽命實屬必要。In view of the above, it is necessary to provide a button module that is easy to assemble and a digital device having the button module to improve assembly efficiency and provide a long service life.
一種按鍵模組,包括依次設置之第一磁性板、電路板、間隔板以及第二磁性板。所述電路板具有複數按鍵觸點,每一按鍵觸點均包括相互間隔之第一觸點與第二觸點。所述間隔板具有與所述複數按鍵觸點一一對應之複數通孔。每一按鍵觸點均暴露於一對應之通孔。所述第二磁性板用於與所述第一磁性板產生相互排斥之磁力。所述第二磁性板具有與所述複數按鍵觸點一一對應之複數導通凸起,每一導通凸起均延伸至所述間隔板之一對應之通孔內並與暴露於該通孔中之按鍵觸點相對,每一導通凸起均用於在按壓外力作用下同與該導通凸起相對之按鍵觸點接觸,並電連接第一觸點與第二觸點。A button module includes a first magnetic plate, a circuit board, a partition plate and a second magnetic plate which are sequentially disposed. The circuit board has a plurality of button contacts, each button contact including a first contact and a second contact spaced apart from each other. The spacer has a plurality of through holes corresponding to the plurality of button contacts in one-to-one correspondence. Each button contact is exposed to a corresponding through hole. The second magnetic plate is configured to generate a mutually repulsive magnetic force with the first magnetic plate. The second magnetic plate has a plurality of conductive protrusions corresponding to the plurality of button contacts, and each of the conductive protrusions extends into a corresponding one of the through holes of the spacer and is exposed to the through hole The button contacts are opposite to each other, and each of the conduction protrusions is configured to contact the button contact opposite to the conduction protrusion under the action of the pressing external force, and electrically connect the first contact and the second contact.
一種數位裝置,包括殼體及如上所述之按鍵模組。所述殼體具有複數按壓結構。所述複數按壓結構與複數導通凸起一一對應,用於將按壓外力傳導給複數導通凸起。A digital device includes a housing and a button module as described above. The housing has a plurality of pressing structures. The plurality of pressing structures are in one-to-one correspondence with the plurality of conductive protrusions for conducting the pressing external force to the plurality of conductive protrusions.
本技術方案之按鍵模組具有第一磁性板與第二磁性板,第二磁性板具有與按鍵觸點相對之導通凸起。第一磁性板與第二磁性板之間之相互排斥之磁力作用使得第二磁性板上之導通凸起可於按壓作用消失時自動與按鍵觸點脫離接觸。具有該按鍵模組之數位裝置結構簡單,便於組裝,使用壽命長。The button module of the present technical solution has a first magnetic plate and a second magnetic plate, and the second magnetic plate has a conduction protrusion opposite to the button contact. The mutually repulsive magnetic force between the first magnetic plate and the second magnetic plate causes the conductive protrusion on the second magnetic plate to automatically come out of contact with the button contact when the pressing action disappears. The digital device with the button module has a simple structure, is easy to assemble, and has a long service life.
下面將結合附圖及複數實施例對本技術方案提供之按鍵模組及具有該按鍵模組之數位裝置作進一步詳細說明。The button module provided by the technical solution and the digital device having the button module will be further described in detail below with reference to the accompanying drawings and the embodiments.
請一併參閱圖1至圖4,本技術方案第一實施例提供一種按鍵模組10,包括依次設置之第一磁性板11、電路板12、間隔板13以及第二磁性板14。所述第一磁性板11、電路板12、間隔板13以及第二磁性板14可藉由黏接劑、螺釘等固定於一起。Referring to FIG. 1 to FIG. 4 , the first embodiment of the present invention provides a button module 10 including a first magnetic plate 11 , a circuit board 12 , a partition plate 13 , and a second magnetic plate 14 . The first magnetic plate 11, the circuit board 12, the spacer 13 and the second magnetic plate 14 may be fixed together by an adhesive, a screw or the like.
所述第一磁性板11為塑膠磁鐵,其可為長方體形板體。所述第一磁性板11為複合型磁性聚合物,即,為高分子聚合物與永磁材料之混合物。所述第一磁性板11可先往高分子聚合物中混合稀土永磁材料、金屬永磁材料或鐵氧體永磁材料,再以擠出成型、注射成型、壓延成型或模壓成型工藝製成。於上述過程中,還可藉由外加磁場或機械力,使加入之永磁材料之易磁化方向有序排列,從而使所得之第一磁性板11具有較強之磁性。所述第一磁性板11具有相對之第一磁性面110與第二磁性面111。本實施例中,所述第一磁性板11為聚醯胺中混合鍶鐵氧體(mSrO·nFe2O3)永磁材料,靠近所述第一磁性面110處為第一磁性板11之N極,靠近第二磁性面111處為第一磁性板11之S極。The first magnetic plate 11 is a plastic magnet, which may be a rectangular parallelepiped plate body. The first magnetic plate 11 is a composite magnetic polymer, that is, a mixture of a high molecular polymer and a permanent magnetic material. The first magnetic plate 11 may be first mixed with a rare earth permanent magnet material, a metal permanent magnet material or a ferrite permanent magnet material, and then formed by extrusion molding, injection molding, calender molding or compression molding. . In the above process, the magnetic field of the permanent magnet material to be added may be sequentially arranged by an external magnetic field or a mechanical force, so that the obtained first magnetic plate 11 has strong magnetic properties. The first magnetic plate 11 has a first magnetic surface 110 and a second magnetic surface 111 opposite to each other. In this embodiment, the first magnetic plate 11 is a mixed barium ferrite (mSrO·nFe 2 O 3 ) permanent magnet material in polyamine, and is adjacent to the first magnetic surface 110 as an N pole of the first magnetic plate 11 . Near the second magnetic surface 111 is the S pole of the first magnetic plate 11.
所述電路板12之形狀與所述第一磁性板11之形狀相對應,亦為長方體形板體。所述電路板12包括依次堆疊之第一覆蓋層120、第一導電圖案層121、絕緣層122、第二導電圖案層123以及第二覆蓋層124。所述第一覆蓋層120靠近所述第一磁性板11並與所述第二磁性面111相接觸。第一覆蓋層120用於保護第一導電圖案層121。所述第二覆蓋層124遠離所述第一磁性板11。第二覆蓋層124用於保護第二導電圖案層123。所述第一覆蓋層120與第二覆蓋層124均可為絕緣材質。本實施例中,所述第二覆蓋層124為透明材質。所述第一導電圖案層121包括複數條第一導電線路125。所述絕緣層122具有與所述複數條第一導電線路125一一對應之複數導通孔126。每一導通孔126均連接於一條第一導電線路125。所述第二導電圖案層123包括複數按鍵觸點127與複數條第二導電線路128。所述第二覆蓋層124覆蓋所述第二導電圖案層123之複數條第二導電線路128,並暴露出所述複數按鍵觸點127。所述複數條第一導電線路125、複數條第二導電線路128均與一微處理器相連接,以實現按鍵內容之識別與輸入。每一按鍵觸點127均包括相互間隔之第一觸點1270與第二觸點1271。每一按鍵觸點127之第一觸點1270均藉由一導通孔126連接於一條第一導電線路125。所述第二觸點1271環繞所述第一觸點1270。每條第二導電線路128均連接於一第二觸點1271。本實施例中,所述複數按鍵觸點127之數量為十二個,分成三行四列,呈陣列式排佈。當然,所述複數按鍵觸點127之分佈情況,還可根據數位產品結構之實際需要而作相應變化。本實施例中,每一按鍵觸點127均為同心圓形狀,即,第一觸點1270為位於中心之圓形,第二觸點1271為環繞所述第一觸點1270之圓環形。The shape of the circuit board 12 corresponds to the shape of the first magnetic plate 11, and is also a rectangular parallelepiped plate body. The circuit board 12 includes a first cover layer 120, a first conductive pattern layer 121, an insulating layer 122, a second conductive pattern layer 123, and a second cover layer 124 which are sequentially stacked. The first cover layer 120 is adjacent to the first magnetic plate 11 and is in contact with the second magnetic surface 111. The first cover layer 120 is for protecting the first conductive pattern layer 121. The second cover layer 124 is away from the first magnetic plate 11 . The second cover layer 124 is for protecting the second conductive pattern layer 123. The first cover layer 120 and the second cover layer 124 may both be made of an insulating material. In this embodiment, the second cover layer 124 is a transparent material. The first conductive pattern layer 121 includes a plurality of first conductive lines 125. The insulating layer 122 has a plurality of via holes 126 that are in one-to-one correspondence with the plurality of first conductive lines 125. Each via 126 is connected to a first conductive line 125. The second conductive pattern layer 123 includes a plurality of button contacts 127 and a plurality of second conductive lines 128. The second cover layer 124 covers the plurality of second conductive lines 128 of the second conductive pattern layer 123 and exposes the plurality of button contacts 127. The plurality of first conductive lines 125 and the plurality of second conductive lines 128 are all connected to a microprocessor to realize identification and input of key content. Each of the button contacts 127 includes a first contact 1270 and a second contact 1271 that are spaced apart from each other. The first contact 1270 of each button contact 127 is connected to a first conductive line 125 by a via hole 126. The second contact 1271 surrounds the first contact 1270. Each of the second conductive lines 128 is connected to a second contact 1271. In this embodiment, the number of the plurality of button contacts 127 is twelve, and is divided into three rows and four columns, arranged in an array. Of course, the distribution of the plurality of button contacts 127 can also be changed according to the actual needs of the digital product structure. In this embodiment, each of the button contacts 127 has a concentric shape, that is, the first contact 1270 is circular at the center, and the second contact 1271 is annular around the first contact 1270.
當然,所述電路板12亦可具有其他之結構,所述按鍵觸點127還可為其他結構。例如,所述電路板12可僅包括一層絕緣層及一層形成於所述絕緣層之導電圖案層之結構,導電圖案層可包括複數按鍵觸點以及複數條導電線路,每一按鍵觸點均包括第一觸點與第二觸點,第一觸點與第二觸點均可為習知之梳狀電路結構,且第一觸點之梳狀電路結構與第二觸點之梳狀電路結構相互交叉設置。Of course, the circuit board 12 can also have other structures, and the button contacts 127 can also have other structures. For example, the circuit board 12 may include only one insulating layer and one layer of a conductive pattern layer formed on the insulating layer. The conductive pattern layer may include a plurality of button contacts and a plurality of conductive lines, each of which includes The first contact and the second contact, the first contact and the second contact may both be a conventional comb circuit structure, and the comb circuit structure of the first contact and the comb circuit structure of the second contact are mutually Cross settings.
所述間隔板13位於所述電路板12遠離所述第一磁性板11之一側。與所述第一磁性板11之形狀相對應地,所述間隔板13亦為長方體形板體。所述間隔板13之厚度可為180毫米至200微米,優選為188微米。所述間隔板13可採用聚酯製成,其具有相對之第一間隔表面130與第二間隔表面131,其中,所述第一間隔表面130靠近所述電路板12並與所述第二覆蓋層124相接觸,第二間隔表面131遠離所述電路板12。所述間隔板13具有貫穿所述第一間隔表面130與第二間隔表面131之複數通孔132,所述複數通孔132與所述複數按鍵觸點127一一對應,每一按鍵觸點127均暴露於一對應之通孔132。本實施例中,所述通孔132之截面為圓形。The spacer 13 is located on a side of the circuit board 12 away from the first magnetic board 11. Corresponding to the shape of the first magnetic plate 11, the partition plate 13 is also a rectangular parallelepiped plate body. The spacer 13 may have a thickness of from 180 mm to 200 μm, preferably 188 μm. The spacer 13 may be made of polyester having a first spacing surface 130 and a second spacing surface 131, wherein the first spacing surface 130 is adjacent to the circuit board 12 and the second covering The layers 124 are in contact with each other, and the second spacing surface 131 is remote from the circuit board 12. The partition plate 13 has a plurality of through holes 132 extending through the first spacing surface 130 and the second spacing surface 131. The plurality of through holes 132 are in one-to-one correspondence with the plurality of button contacts 127, and each button contact 127 Both are exposed to a corresponding via 132. In this embodiment, the through hole 132 has a circular cross section.
所述第二磁性板14用於與所述第一磁性板11產生相互排斥之磁力。所述第二磁性板14亦為塑膠磁鐵,其可為複合型磁性聚合物。本實施例中,所述第二磁性板14為與第一磁性板11相同之複合型磁性聚合物,即,亦為聚醯胺中混合鍶鐵氧體(mSrO·nFe2O3)永磁材料。所述第二磁性板14包括一板體140、複數導通凸起141與複數按壓凸起142。本實施例中,所述板體140、複數導通凸起141及複數按壓凸起142為一體成型。The second magnetic plate 14 is used to generate mutually repulsive magnetic forces with the first magnetic plate 11. The second magnetic plate 14 is also a plastic magnet, which may be a composite magnetic polymer. In this embodiment, the second magnetic plate 14 is the same composite magnetic polymer as the first magnetic plate 11, that is, a mixed barium ferrite (mSrO.nFe2O3) permanent magnet material in polyamine. The second magnetic plate 14 includes a plate body 140 , a plurality of conductive protrusions 141 , and a plurality of pressing protrusions 142 . In this embodiment, the plate body 140, the plurality of conductive protrusions 141, and the plurality of pressing protrusions 142 are integrally formed.
所述板體140之形狀與所述第一磁性板11之形狀相對應,亦為長方體形板體。所述板體140具有相對之第一表面143與第二表面144,所述第一表面143靠近所述間隔板13並與間隔板13相接觸,所述第二表面144遠離所述間隔板13。靠近所述第一表面143處為第二磁性板14之S極,靠近第二表面144處為所述第二磁性板14之N極。當然,所述第一磁性板11與第二磁性板14之磁極分佈還可為其他方式,僅需可於所述第一磁性板11與第二磁性板14之間產生相互排斥之磁力即可。The shape of the plate body 140 corresponds to the shape of the first magnetic plate 11, and is also a rectangular parallelepiped plate body. The plate body 140 has a first surface 143 opposite to the partition plate 13 and is in contact with the partition plate 13 , and the second surface 144 is away from the partition plate 13 . . Near the first surface 143 is the S pole of the second magnetic plate 14, and near the second surface 144 is the N pole of the second magnetic plate 14. Of course, the magnetic pole distribution of the first magnetic plate 11 and the second magnetic plate 14 may be other manners, and only a mutual magnetic force may be generated between the first magnetic plate 11 and the second magnetic plate 14 . .
所述複數導通凸起141均自所述板體140之第一表面143延伸,且與所述複數按鍵觸點127一一對應。每一導通凸起141均延伸至所述間隔板13之一對應之通孔132內並與暴露於該通孔132中之按鍵觸點127相對。每一導通凸起141均用於在外力作用下同與該導通凸起141相對之按鍵觸點127接觸,並電連接第一觸點1270與第二觸點1271。所述導通凸起141為圓柱體形,其直徑小於或等於所述通孔132之孔徑,從而可收容於所述通孔132內。所述導通凸起141突出於所述第一表面143之高度為80微米至100微米。每一導通凸起141均具有遠離所述板體140之導通端面145,所述導通端面145上形成有導電層146。所述導電層146可為導電碳漿,藉由印刷工藝形成於所述導通端面145。所述導電層146之厚度為10微米至20微米。The plurality of conductive protrusions 141 extend from the first surface 143 of the board 140 and are in one-to-one correspondence with the plurality of button contacts 127. Each of the conductive protrusions 141 extends into the corresponding through hole 132 of one of the spacers 13 and is opposite to the key contact 127 exposed in the through hole 132. Each of the conduction protrusions 141 is for contacting the button contact 127 opposite to the conduction protrusion 141 under an external force, and electrically connects the first contact 1270 and the second contact 1271. The conductive protrusion 141 has a cylindrical shape and a diameter smaller than or equal to the aperture of the through hole 132 so as to be received in the through hole 132. The conductive protrusion 141 protrudes from the first surface 143 by a height of 80 micrometers to 100 micrometers. Each of the conduction protrusions 141 has a conduction end surface 145 away from the plate body 140, and a conductive layer 146 is formed on the conduction end surface 145. The conductive layer 146 may be a conductive carbon paste formed on the conduction end surface 145 by a printing process. The conductive layer 146 has a thickness of 10 micrometers to 20 micrometers.
可理解,若第二磁性板14中混合之永磁材料為金屬永磁材料等可導電之材料使得第二磁性板14具備導電性能,所述導通凸起141上亦可不必形成導電層146。It can be understood that if the permanent magnetic material mixed in the second magnetic plate 14 is a conductive material such as a metal permanent magnet material, so that the second magnetic plate 14 has electrical conductivity, the conductive protrusion 146 may not be formed on the conduction protrusion 141.
所述複數按壓凸起142位於所述板體140之第二表面144,且與所述複數按鍵觸點127一一對應。所述複數按壓凸起142均自所述第二表面144向遠離所述第一表面143方向突出,用於起標識作用。本實施例中,每一按壓凸起142均為圓臺形結構。所述按壓凸起142突出於第二表面144之最大高度為50微米至100微米。還可藉由印刷等方式於所述複數按壓凸起142上形成數字、字母等符號。當然,所述第二磁性板14亦可沒有複數按壓凸起142,而直接於第二表面144與所述複數按鍵觸點127對應處形成數字、字母等符號,直接於第二表面144與所述複數按鍵觸點127對應處進行按壓亦可實現輸入。The plurality of pressing protrusions 142 are located on the second surface 144 of the board body 140 and are in one-to-one correspondence with the plurality of button contacts 127. The plurality of pressing protrusions 142 protrude from the second surface 144 away from the first surface 143 for marking. In this embodiment, each of the pressing protrusions 142 has a truncated cone shape. The pressing protrusion 142 protrudes from the second surface 144 to a maximum height of 50 micrometers to 100 micrometers. The numerals, letters, and the like may be formed on the plurality of pressing protrusions 142 by printing or the like. Of course, the second magnetic plate 14 may not have a plurality of pressing protrusions 142, and directly form a number, a letter, and the like at the corresponding position of the second surface 144 and the plurality of button contacts 127, directly on the second surface 144 and the The input can be realized by pressing the corresponding button contact 127 at the corresponding position.
由於第二磁性板14上靠近第一表面143處為S極,第一磁性板11靠近第二磁性板14之第二磁性面111處亦為S極,第一磁性板11與第二磁性板14產生相互排斥之磁力作用。於複數導通凸起141不被按壓之情況下,所述複數導通凸起141不會與對應之按鍵觸點127相接觸。當按壓某個按壓凸起142,使其受到之按壓地外力大於磁力作用時,該導通凸起141向靠近與之相對之一按鍵觸點127方向移動,從而與該按鍵觸點127之第一觸點1270、第二觸點1271相接觸而電連接於與該按鍵觸點127之第一觸點1270與第二觸點1271之間,如此,電連接於第一觸點1270之第一導電線路125與連接於第二觸點1271之第二導電線路128實現了電導通,從而藉由微處理之處理即可實現輸入資訊之識別。按壓作用消失時,排斥之磁力作用可使得導通凸起141回到原位。Since the second magnetic plate 14 is S pole near the first surface 143, the first magnetic plate 11 is also adjacent to the second magnetic surface 111 of the second magnetic plate 14 as an S pole, and the first magnetic plate 11 and the second magnetic plate 14 produces mutually exclusive magnetic effects. In the case where the plurality of conduction protrusions 141 are not pressed, the plurality of conduction protrusions 141 do not come into contact with the corresponding button contacts 127. When a pressing protrusion 142 is pressed such that the external force is pressed by the magnetic force, the conduction protrusion 141 moves toward the opposite one of the button contacts 127, thereby being the first with the button contact 127. The contact 1270 and the second contact 1271 are in contact with each other and electrically connected between the first contact 1270 and the second contact 1271 of the button contact 127, and thus are electrically connected to the first conductive portion of the first contact 1270. The line 125 is electrically connected to the second conductive line 128 connected to the second contact 1271, so that the identification of the input information can be realized by the processing of the micro processing. When the pressing action disappears, the magnetic force of the repulsion causes the conduction protrusion 141 to return to the original position.
請一併參閱圖3與圖5,本技術方案第二實施例提供一種數位裝置100,其包括顯示屏101、第一實施例之按鍵模組10、殼體102以及內部元件(圖未示)。所述數位裝置100可為手機。所述按鍵模組10與內部元件均設置於殼體102內。所述內部元件可包括微處理器、微記憶體、無線裝置等數位裝置常用元件。殼體102具有一第一開口103與複數第二開口104,所述第一開口103用於暴露出顯示屏101之顯示面。所述第二開口104用於暴露出按鍵模組10之複數按壓凸起142。按鍵模組10與第一開口103藉由內部元件信號連接,從而,藉由按壓複數按壓凸起142即可實現數位裝置100之輸入功能,並將跟輸入資訊對應之資料顯示於顯示屏101。Referring to FIG. 3 and FIG. 5 together, the second embodiment of the present invention provides a digital device 100 including a display screen 101, a button module 10 of the first embodiment, a housing 102, and internal components (not shown). . The digital device 100 can be a mobile phone. The button module 10 and the internal components are disposed in the housing 102. The internal components may include conventional components of digital devices such as microprocessors, micro memories, and wireless devices. The housing 102 has a first opening 103 and a plurality of second openings 104 for exposing the display surface of the display screen 101. The second opening 104 is configured to expose a plurality of pressing protrusions 142 of the button module 10 . The button module 10 and the first opening 103 are connected by internal component signals, so that the input function of the digital device 100 can be realized by pressing the plurality of pressing protrusions 142, and the data corresponding to the input information is displayed on the display screen 101.
當然,本領域技術人員可理解,當按鍵模組10沒有按壓凸起142時,第二開口104暴露出按鍵模組10中對應於導通凸起141之部份,同樣可實現按壓時資訊之輸入。另外,殼體102亦可不開設第二開口104,而於與第二磁性板14對應之部位設置彈性按壓部,或者,殼體102可整體均由柔性材料製成。總而言之,僅需殼體102具有對應於導通凸起141之按壓結構,便於操作人員按壓按鍵模組10即可。所述按壓結構可為如上所示之第二開口104,可為彈性按壓部,還可為其它便於實現按壓導通凸起141之結構。Certainly, those skilled in the art can understand that when the button module 10 does not press the protrusion 142, the second opening 104 exposes a portion of the button module 10 corresponding to the conduction protrusion 141, and the information input during pressing can also be realized. . In addition, the housing 102 may not be provided with the second opening 104, and an elastic pressing portion may be disposed at a portion corresponding to the second magnetic plate 14, or the housing 102 may be entirely made of a flexible material. In summary, it is only necessary for the housing 102 to have a pressing structure corresponding to the conduction protrusion 141, so that the operator can press the button module 10. The pressing structure may be the second opening 104 as shown above, may be an elastic pressing portion, and may be other structures that facilitate the pressing of the conductive protrusion 141.
本技術方案之按鍵模組10具有第一磁性板11與第二磁性板14,第二磁性板14具有與按鍵觸點127相對之導通凸起141。第一磁性板11與第二磁性板14之間之相互排斥之磁力作用使得第二磁性板14上之導通凸起141可於按壓作用消失時自動與按鍵觸點127脫離接觸。具有該按鍵模組10之數位裝置100結構簡單,便於組裝,使用壽命長。The button module 10 of the present technical solution has a first magnetic plate 11 and a second magnetic plate 14, and the second magnetic plate 14 has a conduction protrusion 141 opposite to the button contact 127. The mutually repulsive magnetic force between the first magnetic plate 11 and the second magnetic plate 14 causes the conduction protrusions 141 on the second magnetic plate 14 to automatically come out of contact with the key contacts 127 when the pressing action disappears. The digital device 100 having the button module 10 has a simple structure, is easy to assemble, and has a long service life.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧按鍵模組10‧‧‧Key Module
11‧‧‧第一磁性板11‧‧‧First magnetic board
110‧‧‧第一磁性面110‧‧‧First magnetic surface
111‧‧‧第二磁性面111‧‧‧Second magnetic surface
12‧‧‧電路板12‧‧‧ boards
120‧‧‧第一覆蓋層120‧‧‧First cover
121‧‧‧第一導電圖案層121‧‧‧First conductive pattern layer
122‧‧‧絕緣層122‧‧‧Insulation
123‧‧‧第二導電圖案層123‧‧‧Second conductive pattern layer
124‧‧‧第二覆蓋層124‧‧‧Second overlay
125‧‧‧第一導電線路125‧‧‧First conductive line
126‧‧‧導通孔126‧‧‧through holes
127‧‧‧按鍵觸點127‧‧‧Key contacts
1270‧‧‧第一觸點1270‧‧‧First contact
1271‧‧‧第二觸點1271‧‧‧second contact
128‧‧‧第二導電線路128‧‧‧Second conductive line
13‧‧‧間隔板13‧‧‧ Spacer
130‧‧‧第一間隔表面130‧‧‧First interval surface
131‧‧‧第二間隔表面131‧‧‧Second spacing surface
132‧‧‧通孔132‧‧‧through hole
14‧‧‧第二磁性板14‧‧‧Second magnetic board
140‧‧‧板體140‧‧‧ board
141‧‧‧導通凸起141‧‧‧ conduction bulge
142‧‧‧按壓凸起142‧‧‧ Pressing the bulge
143‧‧‧第一表面143‧‧‧ first surface
144‧‧‧第二表面144‧‧‧ second surface
145‧‧‧導通端面145‧‧‧Connecting end face
146‧‧‧導電層146‧‧‧ Conductive layer
100‧‧‧數位裝置100‧‧‧ digital devices
101‧‧‧顯示幕101‧‧‧ display screen
102‧‧‧殼體102‧‧‧ housing
103‧‧‧第一開口103‧‧‧First opening
104‧‧‧第二開口104‧‧‧second opening
圖1係本技術方案第一實施例提供之按鍵模組之結構示意圖。FIG. 1 is a schematic structural diagram of a button module provided by a first embodiment of the present technical solution.
圖2係上述按鍵模組之分解示意圖。FIG. 2 is an exploded view of the above button module.
圖3係圖1沿III-III線之部分剖視圖。Figure 3 is a partial cross-sectional view taken along line III-III of Figure 1.
圖4係圖2中IV處之局部放大圖。Figure 4 is a partial enlarged view of the portion IV in Figure 2.
圖5係本技術方案第二實施例提供之數位裝置之結構示意圖。FIG. 5 is a schematic structural diagram of a digital device according to a second embodiment of the present technical solution.
10‧‧‧按鍵模組 10‧‧‧Key Module
11‧‧‧第一磁性板 11‧‧‧First magnetic board
12‧‧‧電路板 12‧‧‧ boards
120‧‧‧第一覆蓋層 120‧‧‧First cover
122‧‧‧絕緣層 122‧‧‧Insulation
124‧‧‧第二覆蓋層 124‧‧‧Second overlay
13‧‧‧間隔板 13‧‧‧ Spacer
14‧‧‧第二磁性板 14‧‧‧Second magnetic board
142‧‧‧按壓凸起 142‧‧‧ Pressing the bulge
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099142908A TWI401715B (en) | 2010-12-09 | 2010-12-09 | Button module and digital device having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099142908A TWI401715B (en) | 2010-12-09 | 2010-12-09 | Button module and digital device having the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201225127A TW201225127A (en) | 2012-06-16 |
| TWI401715B true TWI401715B (en) | 2013-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099142908A TWI401715B (en) | 2010-12-09 | 2010-12-09 | Button module and digital device having the same |
Country Status (1)
| Country | Link |
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| TW (1) | TWI401715B (en) |
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| TWI578353B (en) * | 2014-09-16 | 2017-04-11 | 達方電子股份有限公司 | Magnetic keyswitch and magnetic keyswitch manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6738043B2 (en) * | 2000-06-27 | 2004-05-18 | Fujitsu Takamisawa Component Limited | Coordinates input apparatus |
| TW200807469A (en) * | 2006-07-25 | 2008-02-01 | Qualidyne Co Ltd | Dismountable magnetically levitated keyboard structure |
| CN101331570A (en) * | 2005-12-16 | 2008-12-24 | 戴尔·麦克菲·普尔考克斯 | Keyboard with a keyboard body |
| TW201029033A (en) * | 2009-01-22 | 2010-08-01 | Hon Hai Prec Ind Co Ltd | Navigation key |
| TWM390491U (en) * | 2010-05-21 | 2010-10-11 | Darfon Electronics Corp | Keyswitch and keyboard |
-
2010
- 2010-12-09 TW TW099142908A patent/TWI401715B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6738043B2 (en) * | 2000-06-27 | 2004-05-18 | Fujitsu Takamisawa Component Limited | Coordinates input apparatus |
| CN101331570A (en) * | 2005-12-16 | 2008-12-24 | 戴尔·麦克菲·普尔考克斯 | Keyboard with a keyboard body |
| TW200807469A (en) * | 2006-07-25 | 2008-02-01 | Qualidyne Co Ltd | Dismountable magnetically levitated keyboard structure |
| TW201029033A (en) * | 2009-01-22 | 2010-08-01 | Hon Hai Prec Ind Co Ltd | Navigation key |
| TWM390491U (en) * | 2010-05-21 | 2010-10-11 | Darfon Electronics Corp | Keyswitch and keyboard |
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| TW201225127A (en) | 2012-06-16 |
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