SG10201407002SA - Temperature Control System having Adjacently-Installed Temperature Equalizer and Heat Transfer Fluid and Application Device Thereof - Google Patents

Temperature Control System having Adjacently-Installed Temperature Equalizer and Heat Transfer Fluid and Application Device Thereof

Info

Publication number
SG10201407002SA
SG10201407002SA SG10201407002SA SG10201407002SA SG10201407002SA SG 10201407002S A SG10201407002S A SG 10201407002SA SG 10201407002S A SG10201407002S A SG 10201407002SA SG 10201407002S A SG10201407002S A SG 10201407002SA SG 10201407002S A SG10201407002S A SG 10201407002SA
Authority
SG
Singapore
Prior art keywords
adjacently
control system
heat transfer
transfer fluid
application device
Prior art date
Application number
SG10201407002SA
Inventor
Yang Tai-Her
Original Assignee
Yang Tai-Her
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yang Tai-Her filed Critical Yang Tai-Her
Publication of SG10201407002SA publication Critical patent/SG10201407002SA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F28F27/02—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/06—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits forming part of, or being attached to, the tank containing the body of fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Control Of Temperature (AREA)
  • Details Of Heat-Exchange And Heat-Transfer (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coating Apparatus (AREA)
SG10201407002SA 2013-10-29 2014-10-28 Temperature Control System having Adjacently-Installed Temperature Equalizer and Heat Transfer Fluid and Application Device Thereof SG10201407002SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/066,282 US9897400B2 (en) 2013-10-29 2013-10-29 Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof

Publications (1)

Publication Number Publication Date
SG10201407002SA true SG10201407002SA (en) 2015-05-28

Family

ID=51845295

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407002SA SG10201407002SA (en) 2013-10-29 2014-10-28 Temperature Control System having Adjacently-Installed Temperature Equalizer and Heat Transfer Fluid and Application Device Thereof

Country Status (8)

Country Link
US (1) US9897400B2 (en)
EP (1) EP3037771B1 (en)
JP (2) JP6967829B2 (en)
CN (1) CN104571197B (en)
AU (1) AU2014256355B2 (en)
BR (1) BR102014027041B8 (en)
SG (1) SG10201407002SA (en)
TW (1) TWI648513B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO342628B1 (en) * 2012-05-24 2018-06-25 Fmc Kongsberg Subsea As Active control of underwater coolers
KR102443261B1 (en) * 2015-10-08 2022-09-13 현대모비스 주식회사 apparatus with direct cooling pathway for cooling both side of power semiconductor
EP3504948B1 (en) 2016-08-26 2022-11-09 Inertech IP LLC Cooling systems and methods using single-phase fluid and a flat tube heat exchanger with counter-flow circuiting
WO2018044813A1 (en) * 2016-08-31 2018-03-08 Nlight, Inc. Laser cooling system
CN106849838A (en) * 2017-04-12 2017-06-13 南通华謇能源科技有限公司 A kind of thermal photovoltaic TRT with regenerator
US10784645B2 (en) 2018-03-12 2020-09-22 Nlight, Inc. Fiber laser having variably wound optical fiber
CN108571911B (en) * 2018-03-14 2019-06-07 西北工业大学 Parallel port with adaptive structure
CN110749230B (en) * 2019-01-24 2025-03-18 中船第九设计研究院工程有限公司 A large-volume stainless steel insulated hot water pool that matches the operating conditions of an air compressor
EP3923689B1 (en) 2020-06-12 2024-04-24 Aptiv Technologies AG Cooling device and its manufacturing method
EP3955716B1 (en) 2020-08-13 2024-07-31 Aptiv Technologies AG Cooling device and method of manufacturing the same
FR3117729B1 (en) * 2020-12-14 2023-12-29 Valeo Systemes Thermiques Heat treatment system for an electrical and/or electronic element
EP4025024A1 (en) 2021-01-04 2022-07-06 Aptiv Technologies Limited Cooling device and method of manufacturing the same
DE102021211362A1 (en) 2021-10-08 2023-04-13 Mahle International Gmbh Temperature control body and power electronics

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282221A (en) * 1961-08-23
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
US4127161A (en) * 1977-03-02 1978-11-28 Energy Recycling Company Energy storage unit and system
JPH01123972A (en) * 1987-11-09 1989-05-16 Nec Corp Cooling system of electronic device
JPH02136664A (en) * 1988-11-16 1990-05-25 Fujitsu Ltd Refrigerant supply method
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
DE4108981C2 (en) * 1991-03-19 1995-03-16 Siemens Ag Arrangement and method for heat dissipation from at least one heat source
US5906236A (en) * 1997-07-28 1999-05-25 Heatflo Systems, Inc. Heat exchange jacket for attachment to an external surface of a pump motor
KR100294317B1 (en) * 1999-06-04 2001-06-15 이정현 Micro-cooling system
US6367544B1 (en) * 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
JP2002257450A (en) * 2001-03-02 2002-09-11 Sanyo Electric Co Ltd Cooling apparatus of semiconductor device
US20040008483A1 (en) * 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
CN1474645A (en) * 2002-08-08 2004-02-11 英业达股份有限公司 Gas heat dissipation device and method for electronic equipment
JP2005009797A (en) * 2003-06-20 2005-01-13 Shinji Matsuda Heating system
US20050128705A1 (en) * 2003-12-16 2005-06-16 International Business Machines Corporation Composite cold plate assembly
JP4218838B2 (en) * 2005-02-17 2009-02-04 株式会社ソニー・コンピュータエンタテインメント Power supply system, power supply apparatus, and electronic circuit driving method
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US7508665B1 (en) * 2006-10-18 2009-03-24 Isothermal Systems Research, Inc. Server farm liquid thermal management system
US20080149303A1 (en) * 2006-12-25 2008-06-26 Chia-Ming Chang Heat sink for a shaft-type linear motor
JP2009115396A (en) * 2007-11-07 2009-05-28 Fujitsu Ltd Loop type heat pipe
KR101434239B1 (en) * 2008-01-31 2014-08-26 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. Modular data processing components and systems
JP5537777B2 (en) * 2008-02-08 2014-07-02 日本モレックス株式会社 Heat sink, cooling module and coolable electronic board
CN102016483A (en) * 2008-04-29 2011-04-13 开利公司 Modular heat exchanger
US8607854B2 (en) * 2008-11-19 2013-12-17 Tai-Her Yang Fluid heat transfer device having plural counter flow circuits with periodic flow direction change therethrough
US8132616B1 (en) * 2009-02-25 2012-03-13 Rockwell Collins, Inc. Temperature conditioning system with thermo-responsive valves
US8453468B1 (en) * 2009-03-18 2013-06-04 Be Aerospace, Inc. System and method for thermal control of different heat loads from a single source of saturated fluids
CN201413489Y (en) * 2009-04-21 2010-02-24 联想(北京)有限公司 Cooling system and a computer provided with same
US20110088881A1 (en) * 2009-10-16 2011-04-21 Tai-Her Yang Heat absorbing or dissipating device with piping staggered and uniformly distributed by temperature difference
JP5531571B2 (en) * 2009-11-12 2014-06-25 富士通株式会社 Function expansion unit system
CN102194529A (en) * 2010-03-19 2011-09-21 上海微电子装备有限公司 Patch type heat-radiating device with active cooling
US9010407B2 (en) * 2010-04-01 2015-04-21 Mac-Dan Innovations Llc Waste water heat recovery system
US10051762B2 (en) * 2011-02-11 2018-08-14 Tai-Her Yang Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
US8840034B2 (en) * 2011-06-10 2014-09-23 International Business Machines Corporation Automatic in situ coolant flow control in LFT heat exchanger
CN103209567A (en) * 2012-01-13 2013-07-17 鸿富锦精密工业（深圳）有限公司 Closed type control device
CN103294078B (en) * 2012-02-22 2015-06-17 上海微电子装备有限公司 Modularized temperature control device
CN102840706A (en) * 2012-09-14 2012-12-26 山东省科学院海洋仪器仪表研究所 Refrigerating device for adjusting temperature of working environment of well measuring instrument

Also Published As

Publication number Publication date
EP3037771B1 (en) 2023-03-01
TWI648513B (en) 2019-01-21
BR102014027041B1 (en) 2021-02-17
JP7181346B2 (en) 2022-11-30
JP2015087105A (en) 2015-05-07
EP3037771A1 (en) 2016-06-29
BR102014027041A2 (en) 2016-10-25
CN104571197A (en) 2015-04-29
JP6967829B2 (en) 2021-11-17
AU2014256355A1 (en) 2015-05-14
US9897400B2 (en) 2018-02-20
US20150114615A1 (en) 2015-04-30
CN104571197B (en) 2022-05-03
TW201530079A (en) 2015-08-01
JP2021179304A (en) 2021-11-18
BR102014027041B8 (en) 2021-03-02
AU2014256355B2 (en) 2018-08-23

Similar Documents

Publication Publication Date Title
SG10201407002SA (en) Temperature Control System having Adjacently-Installed Temperature Equalizer and Heat Transfer Fluid and Application Device Thereof
GB201303386D0 (en) Heat Transfer Device
GB2575374B8 (en) Fluid heat exchanger
GB2516740B (en) Heat exchanger with embedded heat pipes
EP2964942A4 (en) Heat recovery system and heat exchanger
EP3006263A4 (en) Comfortable temperature control device utilizing heat flux sensor
EP3118538A4 (en) Heat exchanger for hot water supply and hot water supply device comprising same
PL3007559T3 (en) Temperature detection device and heat treatment device
EP3051228A4 (en) Cooling and heating device
PL3322765T3 (en) Heat transfer fluid composition and use
EP3054228A4 (en) Heat exchange element and heat exchanger
EP3071891B8 (en) A heat transfer system and a method of its operation
SG2013080742A (en) Heat transfer tube and cracking furnace using the same
SG11201603436RA (en) A sheet for exchange of heat or mass transfer between fluid flows, a device comprising such a sheet, and a method of manufacturing the sheet
GB201302505D0 (en) Heating and cooling system
SG11201605236QA (en) A fluid handling device and a method of heating or cooling a fluid flow
SG11201506736TA (en) Fluidic device and fabrication method thereof, and thermal transfer medium for fluidic device fabrication
PT2918923T (en) Method for venting the heat transfer medium of heating devices
GB201301736D0 (en) Heat exchange apparatus and warming systems
PL3090213T3 (en) Heat exchanger, heating device, heating system and method for heating water
SG10201407026UA (en) Adjacently-Installed Temperature Equalizer with Single Side Heat Transferring
PT3055613T (en) Thermal device, its use, and method for heating a heat transfer medium
PL3057623T3 (en) Heat evaporator suitable for aromatherapy with heater and heat transfer means
GB2498777B (en) Refrigeration apparatus with means for controlling transfer of heat and/or fluid
SI2763497T1 (en) Heating element for infrared radiator