CN219652183U - Material taking mechanism and chip substrate material taking device - Google Patents

Abstract

The utility model provides a material taking mechanism and a chip substrate material taking device, which belong to the technical field of material taking mechanisms, wherein the material taking mechanism comprises: the device comprises a fixed block, a moving assembly and a suction assembly; the moving component is connected with the fixed block and is used for driving the absorbing component to move in the X horizontal direction and the Y horizontal direction, and the X horizontal direction is perpendicular to the Y horizontal direction; the suction component is arranged at the bottom end of the moving component and is used for sucking the article to be sucked. According to the scheme provided by the utility model, when the chip substrates of different types are required to be transferred, the suction cup can be positioned at the suction position of the chip substrate by adjusting the position of the suction cup, so that the suction and transfer of the chip substrate are completed.

Description

Material taking mechanism and chip substrate material taking device

Technical Field

The utility model relates to the technical field of material taking mechanisms, in particular to a material taking mechanism and a chip substrate material taking device.

Background

Chips are silicon wafers containing integrated circuits, which are a way of miniaturizing circuits in electronics, and are often manufactured on the surface of semiconductor wafers. In order to mount, fix, seal and protect the chip, enhance the electrothermal performance of the chip and communicate the circuits inside and outside the chip, the chip is generally packaged by adopting a packaging substrate, i.e. the chip is welded on the packaging substrate to form a chip substrate.

In the production process of chips, when the chip substrate is processed in the subsequent process, the chip substrate needs to be transferred to a production line in the subsequent process. In the prior art, a chip substrate is generally grasped through a mechanical arm, specifically: when grabbing the chip base plate, the mechanical arm mainly relies on two clamping jaws to clamp the two ends of the chip base plate so as to fix the chip base plate, and because the chip base plate is thinner, the clamping of the clamping jaws to the chip base plate is unstable, so that the problem that the chip base plate falls off from the clamping jaws occurs in the process of transferring the chip base plate, and further the chip is damaged. However, if the chip substrates are directly transported, not only is transportation inconvenient, but also the scattered chip substrates are easy to be damaged due to collision in the transportation process, and the subsequent processing of the chip substrates is affected. In order to solve the above-mentioned problem, in the related art, the suction cup is fixed on the manipulator, and the suction cup is used to suck the upper surface of the chip substrate, so as to fix the chip substrate, and further transfer the chip substrate. The chip substrate is fixed stably, but when the chip substrates of different types are required to be clamped, the sucking disc is directly fixed on the manipulator, and the welding positions of the chips on the packaging substrate are different, so that the sucking disc can possibly fall to the sucking position on the chip substrate, and the sucking and transferring of the chip substrate can not be realized.

Therefore, the utility model aims to design the material taking mechanism and the chip substrate material taking device, when the chip substrates with different types are required to be transferred, the suction disc can fall at the suction position of the chip substrate by adjusting the position of the suction disc, so that the suction and the transfer of the chip substrate are completed.

Disclosure of Invention

In order to overcome the problems in the related art, the utility model provides the material taking mechanism and the chip substrate material taking device, when different types of chip substrates need to be transferred, the positions of the suckers are adjusted, so that the suckers can fall at the suction positions of the chip substrates, and the suction and the transfer of the chip substrates are completed.

One of the objects of the present utility model is to provide a reclaimer mechanism comprising: the device comprises a fixed block, a moving assembly and a suction assembly; the moving component is connected with the fixed block and is used for driving the absorbing component to move in the X horizontal direction and the Y horizontal direction, and the X horizontal direction is perpendicular to the Y horizontal direction; the suction component is arranged at the bottom end of the moving component and is used for sucking the article to be sucked.

In a preferred technical scheme of the utility model, the moving assembly comprises a first moving part and a second moving part; the first moving part is arranged below the fixed block; the second moving part is connected with the first moving part through a clamping structure.

In a preferred technical solution of the present utility model, the clamping structure includes: the bottom end of the first moving part is provided with a clamping groove, and the top end of the second moving part is provided with a clamping protrusion matched with the clamping groove;

or;

the bottom of first removal portion is provided with the joint arch, the top of second removal portion be provided with the joint recess of joint protruding looks adaptation.

In a preferred technical scheme of the utility model, the first moving part comprises a linear rail and a sliding block; the linear track is fixed on the fixed block; the sliding block is movably arranged on the linear track; the second moving part is connected with the sliding block.

In a preferred technical scheme of the utility model, the first moving part comprises a dovetail groove and a guide rail; the guide rail is movably arranged on the dovetail groove; the second moving part is connected with the guide rail.

In a preferred technical scheme of the utility model, the length direction of the clamping groove is perpendicular to the extending direction of the dovetail groove.

In the preferred technical scheme of the utility model, the second moving part comprises a moving block, an inclined pin ejector rod and a spring; the moving block is connected with the first moving part; the inclined pin ejector rod is arranged at the top end of the moving block; the spring is arranged on the inclined pin ejector rod.

In the preferred technical scheme of the utility model, a V-shaped chamfer is arranged below the inclined pin ejector rod; the moving block is provided with a threaded hole; and an adjusting screw matched with the threaded hole passes through the threaded hole to be abutted with the V-shaped chamfer.

In a preferred technical scheme of the utility model, the guide rail is fixed on the dovetail groove through a fastening screw.

The second objective of the present utility model is to provide a chip substrate taking device, which includes the above-mentioned taking mechanism.

The beneficial effects of the utility model are as follows:

the utility model provides a material taking mechanism which comprises a fixed block, a movable assembly and a suction assembly, wherein the fixed block is arranged on the movable assembly; when the articles (such as chip substrates) to be sucked of different types are required to be sucked, the positions of the chips on the substrates are different, so that the sucking positions on the chip substrates are different, at the moment, the movable assembly is used for driving the sucking assembly to move in the X horizontal direction and the Y horizontal direction, the positions of the sucking assembly can be adjusted in the X horizontal direction and the Y horizontal direction, and the articles to be sucked are sucked through the sucking assembly arranged at the bottom end of the movable assembly, so that the articles to be sucked are taken and transferred. Compared with the prior art, the suction assembly is directly fixed on the mechanical arm in a mode that adjustment cannot be performed, the suction assembly is capable of being placed at the suction position of the chip substrate by adjusting the position of the suction disc, so that suction and transfer of the chip substrate are completed, and the suction assembly is simple in structure, small in occupied space, low in cost, high in efficiency, stable in suction and capable of being compatible with chip substrates of various types.

The utility model also provides the chip substrate taking device comprising the taking mechanism, when the chip substrate is transferred, the chip substrate taking device can quickly adjust the position of the corresponding sucking component according to the sucking position of the chip substrate, so that the chip substrate can be stably sucked and transferred, and the whole device has simple structure, good stability and high reliability.

Drawings

FIG. 1 is a schematic view of a take-off structure provided by the present utility model;

FIG. 2 is another schematic view of a take-off structure provided by the present utility model;

FIG. 3 is a schematic front view of a take-off structure provided by the present utility model;

fig. 4 is a schematic view of the structure of the guide rail and the moving block according to the present utility model.

Reference numerals:

1. a fixed block; 21. a first moving part; 211. a dovetail groove; 212. a guide rail; 213. a fastening screw; 22. a second moving part; 221. a moving block; 222. a taper pin ejector rod; 2221. v-shaped chamfer; 223. a spring; 224. an adjusting screw; 23. a clamping groove; 24. the clamping bulge; 3. a suction assembly; 31. a suction cup; 4. and a chip substrate.

Detailed Description

Preferred embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the utility model. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

At present, in the production process of chips, a sucker is generally fixed on a manipulator, and the sucker is utilized to suck the upper surface of a chip substrate so as to fix the chip substrate and further transfer the chip substrate. The chip substrate is fixed stably, but when the chip substrates of different types are required to be clamped, the sucking disc is directly fixed on the manipulator, and the welding positions of the chips on the packaging substrate are different, so that the sucking disc can possibly fall to the sucking position on the chip substrate, and the sucking and transferring of the chip substrate can not be realized.

According to the material taking mechanism and the chip substrate material taking device, when the chip substrates of different types are required to be transferred, the positions of the suckers are adjusted, so that the suckers can fall on the suction positions of the chip substrates, the suction and the transfer of the chip substrates are completed, and the material taking mechanism and the material taking device have the advantages of simple structure, small occupied space, low cost, high efficiency, stable suction and capability of being compatible with the chip substrates of various types.

The following describes the technical scheme of the embodiment of the present utility model in detail with reference to the accompanying drawings.

Example 1

As shown in fig. 1 to 4, an extracting mechanism provided in embodiment 1 of the present utility model includes: a fixed block 1, a moving assembly and a sucking assembly 3. The fixed block 1 can be connected with a frame or a manipulator, and is used for determining a fixed base point for the moving assembly and the sucking assembly 3 or realizing the rapid movement of the moving assembly and the sucking assembly 3; the moving component is connected with the fixed block 1, the absorbing component 3 is arranged at the bottom end of the moving component, and the moving component is used for driving the absorbing component 3 to move in an X horizontal direction (i.e. left-right direction in fig. 3) and a Y horizontal direction (i.e. front-back direction in fig. 1), and the X horizontal direction is perpendicular to the Y horizontal direction; the sucking component 3 is used for sucking the article to be sucked.

In order to enable the suction assembly 3 to be movable in the X horizontal direction and the Y horizontal direction, the movement assembly comprises a first movement portion 21 and a second movement portion 22; the first moving part 21 is used for realizing the movement of the suction assembly 3 in the X horizontal direction, and the second moving part 22 is used for realizing the movement of the suction assembly 3 in the Y horizontal direction.

Specifically, the first moving part 21 is disposed below the fixed block 1, and the first moving part 21 is fixed to the fixed block 1 by a fixing screw; specifically, the first moving part 21 includes a linear rail and a slider; the linear rail is fixed on the fixed block 1 through a fixing screw, the sliding block is movably arranged on the linear rail, a part of the sliding block protruding out of the linear rail is located below the linear rail, and the second moving part 22 is connected with the sliding block, so that the second moving part 22 is driven to move along the extending direction (namely, the X horizontal direction) of the linear sliding rail through moving the sliding block.

In a preferred embodiment, the first moving part 21 includes a dovetail groove 211 and a guide rail 212; the dovetail groove 211 is fixed on the fixed block 1 by a fixing screw, the guide rail 212 is movably provided on the dovetail groove 211, and specifically, the guide rail 212 is fixed on the dovetail groove 211 by a fastening screw 213. The second moving part 22 is connected to the guide rail 212, so that the second moving part 22 is driven to move along the extending direction (i.e., the X horizontal direction) of the dovetail groove 211 by moving the guide rail 212. Compared with the combined structure of the linear guide rail 212 and the sliding block, the combined structure of the dovetail groove 211 and the guide rail 212 is adopted, so that the connection between the second moving part 22 and the first moving part 21 is facilitated, and the combined structure is more stable in the moving process.

The second moving part 22 is connected to the first moving part 21 through a clamping structure. The clamping structure comprises: the clamping groove 23 and the clamping protrusion 24 are matched. Illustratively, the bottom end of the first moving part 21 is provided with a clamping groove 23, and the top end of the second moving part 22 is provided with a clamping protrusion 24 adapted to the clamping groove 23; or, the bottom end of the first moving part 21 is provided with a clamping protrusion, and the top end of the second moving part 22 is provided with a clamping groove adapted to the clamping protrusion.

Specifically, as shown in fig. 1-2, the second moving part 22 includes a moving block 221, and the moving block 221 is connected to the first moving part 21. More specifically, taking the first moving portion 21 as an example, the first moving portion includes a dovetail groove 211 and a guide rail 212, a clamping groove 23 is provided at a bottom end of the guide rail 212, the clamping groove 23 is T-shaped, and an opening of the clamping groove 23 faces downward; in order to realize the movement in the Y horizontal direction, the length direction of the clamping groove 23 is perpendicular to the extending direction of the dovetail groove 211; a clamping protrusion 24 matched with the clamping groove 23 is arranged at the top end of the moving block 221, so that the first moving part 21 and the second moving part 22 are connected; further, the clamping groove is provided with a sliding rail, so that after the clamping protrusion 24 is placed in the clamping groove 23, the clamping protrusion 24 can move along the length direction of the clamping groove 23, that is, the second moving part 22 can move in the Y horizontal direction.

As shown in fig. 3 to 4, in order to facilitate the movement and fixing of the moving block 221, the second moving part 22 further includes a tilt pin prop 222 and a spring 223; the inclined pin ejector rod 222 is disposed in the moving block 221, and the extending direction of the inclined pin ejector rod 222 is in an up-down direction, specifically, the inclined pin ejector rod 222 is disposed at the top end of the moving block 221, and when the inclined pin ejector rod 222 is in a lifting state, the top end of the inclined pin ejector rod 222 can be abutted against the moving block 221. The spring 223 is disposed on the inclined pin ejector rod 222, specifically, a strip-shaped groove is disposed on the upper side surface of the inclined pin ejector rod 222, the extending direction of the strip-shaped groove is consistent with that of the inclined pin ejector rod 222, the spring 223 is disposed in the strip-shaped groove, and when the inclined pin ejector rod 222 is in a lifting state, the spring 223 is in a compressed state.

In order to fix the state of the inclined pin ejector rod 222, a V-shaped inclined section 2221 is provided below the inclined pin ejector rod 222; the moving block 221 is provided with a threaded hole; the adjusting screw 224 matched with the threaded hole passes through the threaded hole to be abutted against the V-shaped chamfer 2221, namely, when the adjusting screw 224 is screwed down, the top end of the adjusting screw 224 is abutted against the V-shaped chamfer 2221, so that an upward jacking force is given to the inclined pin ejector rod 222, and the moving block 221 is driven to lift upwards and abut against the guide rail 212, so that the moving block 221 is fixed on the guide rail 212; when the adjusting screw 224 is unscrewed, the moving block 221 moves downward under the action of gravity and the rebound force of the spring 223, so that the moving block 221 can be moved along the extending direction of the guide rail 212, thereby adjusting the position of the suction assembly in the Y horizontal direction.

The suction assembly 3 includes a suction cup 31, the suction cup 31 is disposed at the bottom end of the moving block 221, and in particular, the suction cup 31 is fixed at the bottom end of the moving block 221 through a connector. In order to make the force of the object to be sucked more uniform when the sucking disc 31 sucks the object to be sucked, it is preferable that the number of the sucking discs 31 is 1 to 5, and more preferable that the number of the sucking discs 31 is 2 to 3.

The article to be suctioned includes, but is not limited to, (1) an article such as a chip substrate that can be suctioned by the suction cup 31. (2) The number of the suction modules 3 may be plural, the number of the second moving parts 22 may be plural, and the number of the first moving parts 21 connected to the second moving parts 22 may be plural, so that each suction module 3 may move in the X horizontal direction and the Y horizontal direction. Therefore, the position of the suction component 3 can be adjusted for a certain suction position, so that the stress of the article to be sucked is more uniform, and the efficiency is further improved.

Taking the chip substrate as an example, the specific implementation process is as follows:

when the chip substrates with different types are required to be sucked, firstly, the fastening screw 213 on the guide rail 212 is unscrewed, and the guide rail 212 is moved along the extending direction of the dovetail groove 211, so that the moving block 221 and the sucker 31 can be driven to move in the X horizontal direction, and when the suction position is reached in the X horizontal direction, the fastening screw 213 on the guide rail 212 is screwed, the guide rail 212 is fixed on the dovetail groove 211, and the position of the suction assembly 3 in the X horizontal direction can be fixed.

Secondly, by tightening the adjusting screw 224, the top end of the adjusting screw 224 abuts against the V-shaped chamfer 2221 to drive the moving block 221 to lift up and abut against the guide rail 212, so that the moving block 221 is fixed on the guide rail 212, that is, the position of the suction component 3 in the Y horizontal direction is fixed, so that the suction component 3 can reach the suction position, and the suction of the chip substrate is completed. When the position in the Y horizontal direction needs to be adjusted, the adjusting screw 224 is only required to be unscrewed, the moving block 221 moves downwards under the action of gravity and the rebound force of the spring 223, and then the moving block 221 can be moved along the extending direction of the guide rail 212, and when the position is reached, the adjusting screw 224 is required to be screwed.

In the embodiment of the utility model, the material taking mechanism comprises a fixed block, a movable assembly and a suction assembly; when the articles (such as chip substrates) to be sucked of different types are required to be sucked, the positions of the chips on the substrates are different, so that the sucking positions on the chip substrates are different, at the moment, the movable assembly is used for driving the sucking assembly to move in the X horizontal direction and the Y horizontal direction, the positions of the sucking assembly can be adjusted in the X horizontal direction and the Y horizontal direction, and the articles to be sucked are sucked through the sucking assembly arranged at the bottom end of the movable assembly, so that the articles to be sucked are taken and transferred. Compared with the prior art, the suction assembly is directly fixed on the mechanical arm in a mode that adjustment cannot be performed, the suction assembly is capable of being placed at the suction position of the chip substrate by adjusting the position of the suction disc, so that suction and transfer of the chip substrate are completed, and the suction assembly is simple in structure, small in occupied space, low in cost, high in efficiency, stable in suction and capable of being compatible with chip substrates of various types.

Example 2

On the basis of the structure of the embodiment 1, the utility model also provides a chip substrate taking device, which comprises a mechanical arm and the taking mechanism.

The fixed block of the material taking mechanism is connected with the mechanical arm, and then the movement of the material taking mechanism between the chip substrate sucking station and the subsequent working procedure processing station can be completed rapidly through the movement of the mechanical arm.

The specific structure of the material taking mechanism is shown in the above embodiment, and will not be described herein.

According to the chip substrate taking device, when the chip substrate is transferred, the position of the corresponding absorbing component can be quickly adjusted according to the absorbing position of the chip substrate, so that the chip substrate can be stably absorbed, and the chip substrate can be stably and quickly transferred from the absorbing station to the processing station through the cooperation of the mechanical arm.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures. In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. A take-off mechanism, comprising: a fixed block (1), a moving component and a sucking component (3);

the moving component is connected with the fixed block (1) and is used for driving the absorbing component (3) to move in the X horizontal direction and the Y horizontal direction, and the X horizontal direction is perpendicular to the Y horizontal direction;

the suction component (3) is arranged at the bottom end of the moving component and is used for sucking the article to be sucked.

2. The take-off mechanism of claim 1, wherein,

the moving assembly comprises a first moving part (21) and a second moving part (22);

the first moving part (21) is arranged below the fixed block (1);

the second moving part (22) is connected with the first moving part (21) through a clamping structure.

3. The take-off mechanism of claim 2, wherein,

the joint structure includes:

the bottom end of the first moving part (21) is provided with a clamping groove (23), and the top end of the second moving part (22) is provided with a clamping protrusion (24) matched with the clamping groove (23);

or;

the bottom of first removal portion (21) is provided with the joint arch, the top of second removal portion (22) be provided with the joint recess of joint protruding looks adaptation.

4. The take-off mechanism of claim 2, wherein,

the first moving part (21) comprises a linear track and a sliding block;

the linear track is fixed on the fixed block (1);

the sliding block is movably arranged on the linear track;

the second moving part (22) is connected with the sliding block.

5. The take-off mechanism of claim 3, wherein,

the first moving part (21) comprises a dovetail groove (211) and a guide rail (212);

the guide rail (212) is movably arranged on the dovetail groove (211);

the second moving part (22) is connected with the guide rail (212).

6. The take-off mechanism of claim 5, wherein,

the length direction of the clamping groove (23) is perpendicular to the extending direction of the dovetail groove (211).

7. The take-off mechanism of claim 2, wherein,

the second moving part (22) comprises a moving block (221), an inclined pin ejector rod (222) and a spring (223);

the moving block (221) is connected to the first moving part (21);

the oblique pin ejector rod (222) is arranged at the top end of the moving block (221);

the spring (223) is arranged on the inclined pin ejector rod (222).

8. The take-off mechanism of claim 7, wherein,

a V-shaped chamfer (2221) is arranged below the inclined pin ejector rod (222);

a threaded hole is formed in the moving block (221);

an adjusting screw (224) matched with the threaded hole passes through the threaded hole and is abutted with the V-shaped chamfer (2221).

9. The take-off mechanism of claim 5, wherein,

the guide rail (212) is fixed on the dovetail groove (211) through a fastening screw (213).

10. A chip substrate take-out device comprising a take-out mechanism as claimed in any one of claims 1 to 9.