CN118623797B - A method and device for measuring three-dimensional information of multi-layer structure - Google Patents
A method and device for measuring three-dimensional information of multi-layer structure Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
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Abstract
本发明公开了一种多层结构三维信息的测量方法及装置，测量方法包括如下步骤：1)对多层结构的顶面进行全区域光学扫描，获取反射光的强度分布信息；2)将反射光的强度分布信息转换为三维点云信息；通过最小二乘拟合三维点云信息得到多层型面；3)多层结构折射倾斜补偿；4)点云坐标修正；5)从多层结构真实点云信息中提取多层结构的微通道的特征信息。本发明实现了多层通道结构的有效检测，检测精准，检测效率高，适用于批量检测。
The present invention discloses a method and device for measuring three-dimensional information of a multi-layer structure, and the measuring method comprises the following steps: 1) optically scanning the entire area of the top surface of the multi-layer structure to obtain the intensity distribution information of the reflected light; 2) converting the intensity distribution information of the reflected light into three-dimensional point cloud information; obtaining the multi-layer profile by least square fitting the three-dimensional point cloud information; 3) compensating for the refraction tilt of the multi-layer structure; 4) correcting the point cloud coordinates; 5) extracting the characteristic information of the microchannel of the multi-layer structure from the real point cloud information of the multi-layer structure. The present invention realizes the effective detection of the multi-layer channel structure, with accurate detection and high detection efficiency, and is suitable for batch detection.
Description
Technical Field
The invention relates to the technical field of detection of internal features of a multilayer structure, in particular to a method and a device for measuring three-dimensional information of the multilayer structure.
Background
Including but not limited to wafers and chips in the semiconductor field, MEMS devices, lenses and lenses in the optical field, optical fibers, coating films, optical filters, polymer materials in the material field, nanomaterials, microfluidic chips in the medical field, and multilayer structures such as multilayer films (blue light reflective coating, anti-reflection coating, photonic crystal, light emitting diode) with regular structures on the surfaces, all of which need to be subjected to feature detection after being produced and molded, so as to evaluate whether the performance of the device meets the requirements.
At present, a microscope eye examination method is generally adopted to manually detect the produced multilayer structure product, which is time-consuming and labor-consuming, and only can detect obvious defects such as bubbles, scratches and the like. Along with development of computer technology and popularization of artificial intelligence, the defect detection methods such as an image method, an infrared method, an electromagnetic method and an ultrasonic method are also applied to production detection of a multilayer structure, but are limited to complex structures inside the multilayer structure, and only specific defects such as surface cracks can be detected. Although the image processing method for supervising and detecting defects and the like is expected to be capable of identifying various defect features with high accuracy, the image processing method is only suitable for multilayer structures with transparent and clear surface structures, and has poor production and detection effects on multilayer structures with complex structures and multilayer molded surfaces.
Disclosure of Invention
In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a method and a device for measuring three-dimensional information of a multilayer structure, which realize effective detection of a multilayer channel structure, are accurate in detection, have high detection efficiency, and are suitable for batch detection.
The invention provides a method for measuring three-dimensional information of a multilayer structure, which comprises the following steps:
1) Transmitting measuring light to the multilayer structure through the line spectrum confocal sensor, and carrying out full-area optical scanning on the top surface of the multilayer structure through the measuring light to obtain intensity distribution information of the reflected light;
2) Converting the intensity distribution information of the reflected light into three-dimensional point cloud information, and fitting the three-dimensional point cloud information by least square to obtain a multi-layer molded surface;
The multi-layer molded surface comprises a1 st layer molded surface, a 2 nd layer molded surface, an n th layer molded surface and a measuring thickness between adjacent molded surfaces from top to bottom, wherein the measuring thickness between the adjacent molded surfaces is named as h 1、h2、...、hn-1;
3) Refractive tilt compensation of the multilayer structure;
The true thickness H i between adjacent profiles is:
wherein, N is the refractive index of the material of the multilayer structure, and θ i is the incident angle of the measuring light relative to the i layer profile;
α=f(λ);
Wherein, Is a direction vector opposite to the direction of the incident ray of the measurement light;
is the normal vector of the i layer profile;
Alpha is the included angle between the incident ray of the measuring light in the y-z plane and the z axis;
f (λ) is a functional relation of α with respect to the light source wavelength λ;
4) Correcting the point cloud coordinates;
correcting the three-dimensional point cloud information from the 1 st layer profile to the nth layer profile by taking the point cloud information of the 1 st layer profile as a reference, namely that all points below the 1 st layer are in normal vectors Moving (Deltax, deltay, deltaz) 1 in the direction to obtain the real point cloud information of the layer 2 molded surface;
And by analogy, sequentially correcting the three-dimensional point cloud information from the ith layer profile to the nth layer profile again by taking the real point cloud information of the ith layer profile as a reference, namely after all points below the ith layer are subjected to the i-1 th correction, each point is in the normal vector Again moving (Δx, Δy, Δz) i in the direction to obtain real point cloud information for the i+1th layer profile, i=2..n-1;
after n-1 times of correction, obtaining real point cloud information of the multilayer structure;
Wherein, (H i-hi) is the refractive thickness error between the i-th layer profile and the i+1-th layer profile;
5) And extracting characteristic information of the micro-channels of the multilayer structure from the real point cloud information of the multilayer structure.
Further, in the step 2), downsampling, statistical filtering and coarse point removal are performed on the three-dimensional point cloud information.
Further, the characteristic information of the micro-channel includes length, width, thickness, diameter and/or surface flatness.
In addition, the invention also provides a measuring device for measuring the multilayer structure by adopting the measuring method, which comprises the following steps:
A work table;
The measuring platform is arranged above the workbench;
the placement seat is arranged above the measuring platform and is used for placing a multilayer structure;
The linear spectrum confocal sensor is arranged above the placement seat;
the driving module is arranged on the workbench, is respectively connected with the measuring platform and the line spectrum confocal sensor in a transmission way, and is used for driving the measuring platform to move along the X-axis direction and the Y-axis direction respectively and driving the line spectrum confocal sensor to move along the Z-axis direction;
The displacement platform, including fixed set up in the first base of measurement platform top surface, the top sliding connection of first base has the removal seat, one side of first base is fixed to be provided with and is used for the drive remove the seat and follow the first cylinder that X axle direction removed, the top of removing the seat is fixed to be provided with the second base, the bottom of settling the seat with the top sliding connection of second base, one side of second base is fixed to be provided with and is used for the drive settle the seat and follow the second cylinder that Y axle direction removed.
Further, the driving module comprises an X-axis module, a Y-axis module and a Z-axis module;
The X-axis module is arranged on the top surface of the workbench, the Y-axis module is in transmission connection with the top of the X-axis module, the measuring platform is in transmission connection with the top of the Y-axis module, a support is fixedly arranged on one side of the top surface of the workbench, the Z-axis module is fixedly arranged on one side of the support, and the line spectrum confocal sensor is in transmission connection with the Z-axis module.
Further, supporting plates are arranged at four corners of the bottom of the workbench respectively, the tops of the supporting plates are in threaded connection with the workbench through screws, and universal wheels are arranged on the inner sides of the bottoms of the workbench, which are located on the supporting plates.
Compared with the prior art, the invention has the beneficial effects that:
(1) The invention adopts a line spectrum confocal measurement mode to measure the multilayer structure, and has higher morphology resolution and measurement accuracy. And after the point cloud data of the line spectrum confocal sensor after the light intensity peak value and the refractive index error of the corrected material are solved, the complex and tortuous three-dimensional shape of the multilayer channel under the surface of the multilayer structure is accurately reproduced through operations such as fitting the molded surface, matching the characteristics of the spliced channel and the like, and the size or characteristic information for evaluating the multilayer structure is extracted. Compared with the traditional image processing measurement mode, the method realizes the accurate measurement of the multilayer structure.
(2) The optical measurement of the invention is not only not limited by external factors such as propagation medium, temperature field, measurement material and the like, but also is not in direct contact with the multilayer structure to be measured, thereby avoiding possible surface damage and pollution and ensuring the accuracy and stability of measurement. And the data of the reflected light can be collected in real time, the characteristics of the micro-channels of the multilayer structure can be analyzed in real time, and the measurement efficiency and the experimental flexibility are greatly improved.
(3) The automatic control of the measurement process is realized through the measuring device, the error of manual operation is reduced, the consistency and repeatability of measurement are improved, the multi-degree-of-freedom grabbing robot is matched, the adaptive detection cycle link is designed, the detection efficiency is high, and the automatic control device is suitable for detecting a large number of multi-layer structure products.
It should be understood that the description in this summary is not intended to limit the critical or essential features of the embodiments of the invention, nor is it intended to limit the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a measuring device;
fig. 2 is a schematic structural view of the displacement table.
The reference numbers in the figure are 1, a workbench, 2, a measuring platform, 3, a setting seat, 4, a line spectrum confocal sensor, 5, a driving module, 6, a displacement platform and 7, a multilayer structure;
11. 12 parts of supporting disc, 13 parts of screw rod and universal wheel;
51. X-axis module, 52, Y-axis module, 53, Z-axis module, 54, bracket;
61. First base, 62, movable seat, 63, first cylinder, 64, second base, 65, second cylinder.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the invention are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
The embodiment of the invention provides a method for measuring three-dimensional information of a multilayer structure, which comprises the following steps:
1) Transmitting measuring light to the multilayer structure through the line spectrum confocal sensor, and carrying out full-area optical scanning on the top surface of the multilayer structure through the measuring light to obtain intensity distribution information of the reflected light;
2) Converting the intensity distribution information of the reflected light into three-dimensional point cloud information, and fitting the three-dimensional point cloud information by least square to obtain a multi-layer molded surface;
The multi-layer molded surface comprises a1 st layer molded surface, a 2 nd layer molded surface, an n th layer molded surface and a measuring thickness between adjacent molded surfaces from top to bottom, wherein the measuring thickness between the adjacent molded surfaces is named as h 1、h2、...、hn-1;
3) Refractive tilt compensation of the multilayer structure;
The true thickness H i between adjacent profiles is:
wherein, N is the refractive index of the material of the multilayer structure, and θ i is the incident angle of the measuring light relative to the i layer profile;
α=f(λ);
Wherein, Is a direction vector opposite to the direction of the incident ray of the measurement light;
is the normal vector of the i layer profile;
Alpha is the included angle between the incident ray of the measuring light in the y-z plane and the z axis;
f (λ) is a functional relation of α with respect to the light source wavelength λ;
4) Correcting the point cloud coordinates;
correcting the three-dimensional point cloud information from the 1 st layer profile to the nth layer profile by taking the point cloud information of the 1 st layer profile as a reference, namely that all points below the 1 st layer are in normal vectors Moving (Deltax, deltay, deltaz) 1 in the direction to obtain the real point cloud information of the layer 2 molded surface;
And by analogy, sequentially correcting the three-dimensional point cloud information from the ith layer profile to the nth layer profile again by taking the real point cloud information of the ith layer profile as a reference, namely after all points below the ith layer are subjected to the i-1 th correction, each point is in the normal vector Again moving (Δx, Δy, Δz) i in the direction to obtain real point cloud information for the i+1th layer profile, i=2..n-1;
after n-1 times of correction, obtaining real point cloud information of the multilayer structure;
Wherein, (H i-hi) is the refractive thickness error between the i-th layer profile and the i+1-th layer profile;
5) And extracting characteristic information of the micro-channels of the multilayer structure from the real point cloud information of the multilayer structure.
In this embodiment, for the microfluidic chip with a film layer on the surface, the 1 st layer of molded surface is the top surface of the film layer, the 2 nd layer of molded surface is the bottom surface of the film layer, the uppermost microchannel is between the 3 rd layer of molded surface and the 4 th layer of molded surface, the second microchannel is between the 5 th layer of molded surface and the 6 th layer of molded surface, and the subsequent microchannels are analogized in sequence.
For the microfluidic chip with no film layer on the surface, the 1 st layer molded surface is the top surface of the microfluidic chip, the uppermost microchannel is arranged between the 2 nd layer molded surface and the 3 rd layer molded surface, the second microchannel is arranged between the 4 th layer molded surface and the 5 th layer molded surface, and the subsequent microchannels are analogized in sequence.
The plane of the mechanical error micro-fluidic chip is not completely perpendicular to the incidence direction of the measured light, and the refractive index of the measured micro-fluidic chip is different due to the fact that the material of the material is different, the light source of the line spectrum confocal sensor irradiates the surface of the micro-fluidic chip to be refracted to different degrees, so that the profile of the measured data is compensated and corrected. And after the point cloud data of the linear spectrum confocal sensor after the light intensity peak value and the refractive index error of the corrected material are solved, the complex and tortuous three-dimensional shape of the multi-layer channel under the surface of the microfluidic chip is accurately reproduced through operations such as fitting the molded surface, matching the characteristics of the spliced channel and the like, and the size or characteristic information for evaluating the production quality of the microfluidic chip is extracted. The micro-fluidic chip is measured by adopting a line spectrum confocal measurement mode, and the micro-fluidic chip has higher morphology resolution and measurement accuracy. Compared with the traditional image processing measurement mode, the accurate measurement of the multi-layer structure of the microfluidic chip is realized.
The optical measurement of the application is not only not limited by external factors such as propagation medium, temperature field, measurement material and the like, but also is not in direct contact with the micro-fluidic chip to be measured, thereby avoiding possible surface damage and pollution and ensuring the accuracy and stability of measurement. And the data of the reflected light can be collected in real time, the characteristics of the micro-channel of the micro-fluidic chip can be analyzed in real time, and the measurement efficiency and the experimental flexibility are greatly improved.
The measuring method can correct the refraction errors of the sensor due to the light source and the material in the acquisition process in time according to the material of the measured multilayer structure and the inclination of the processing surface, and has stronger universality for quality detection of various multilayer structures in the market on the basis of ensuring the measuring precision.
In a preferred embodiment, in step 2), the three-dimensional point cloud information is downsampled, statistically filtered, and coarse points removed, thereby ensuring the accuracy of the measurement data.
In a preferred embodiment, the characteristic information of the micro-channel includes length, width, thickness, diameter and/or surface flatness, and the measurement data is comprehensive.
In addition, referring to fig. 1 to fig. 2, an embodiment of the present invention further provides a measurement device for measuring a multi-layer structure by using the measurement method, including:
A work table 1;
The measuring platform 2 is arranged above the workbench 1;
the placement seat 3is arranged above the measuring platform 2 and is used for placing the multilayer structure 7;
a line spectrum confocal sensor 4 arranged above the placement seat 3;
the driving module 5 is arranged on the workbench 1 and is respectively connected with the measuring platform 2 and the line spectrum confocal sensor 4 in a transmission way, and is used for driving the measuring platform 2 to move along the X-axis direction and the Y-axis direction respectively and driving the line spectrum confocal sensor 4 to move along the Z-axis direction;
The displacement platform 6 comprises a first base 61 fixedly arranged on the top surface of the measuring platform 2, a movable seat 62 is slidably connected to the top of the first base 61, a first air cylinder 63 for driving the movable seat 62 to move along the X-axis direction is fixedly arranged on one side of the first base 61, a second base 64 is fixedly arranged on the top of the movable seat 62, the bottom of the placement seat 3 is slidably connected with the top of the second base 64, and a second air cylinder 65 for driving the placement seat 3 to move along the Y-axis direction is fixedly arranged on one side of the second base 64.
In this embodiment, before the measurement of the multilayer structure 7 is performed, the working area on the workbench 1 is cleaned, so as to ensure the surface to be flat. The multilayer structure 7 to be tested is placed on the placement seat 3, ensuring that the surface of the multilayer structure 7 is clean and free from impurities or dirt.
The linear spectral confocal sensor 4 and the driving module 5 are then opened, and the multilayer structure 7 is moved to an initial position below the linear spectral confocal sensor 4. And the displacement table 6 drives the placement seat 3 to move along the X-axis direction and the Y-axis direction respectively, so that the comprehensive scanning of the multilayer structure 7 is realized, the driving precision of the displacement table 6 is high, and the scanning precision is ensured.
The automatic control of the measurement process is realized through the measuring device, the error of manual operation is reduced, the consistency and repeatability of measurement are improved, the multi-degree-of-freedom grabbing robot is matched, the adaptive detection cycle link is designed, the detection efficiency is high, and the automatic control device is suitable for detecting a large number of multi-layer structure products.
In a preferred embodiment, as shown in FIG. 1, the drive module 5 includes an X-axis module 51, a Y-axis module 52, and a Z-axis module 53;
The X-axis module 51 is arranged on the top surface of the workbench 1, the Y-axis module 52 is in transmission connection with the top of the X-axis module 51, the measuring platform 2 is in transmission connection with the top of the Y-axis module 52, a support 54 is fixedly arranged on one side of the top surface of the workbench 1, the Z-axis module 53 is fixedly arranged on one side of the support 54, and the linear spectrum confocal sensor 4 is in transmission connection with the Z-axis module 53.
In the embodiment, the measuring platform 2 is driven to move by the X-axis module 51 and the Y-axis module 52, so that the placement seat 3 moves to the lower part of the line spectrum confocal sensor 4, the coarse adjustment of the position of the placement seat 3 is realized, and the adjustment efficiency is good. The spacing between the line spectral confocal sensor 4 and the multilayer structure 7 is adjusted by the Z-axis module 53, ensuring efficient reception of reflected light.
In a preferred embodiment, as shown in fig. 1, four corners of the bottom of the workbench 1 are respectively provided with a supporting disc 11, the top of the supporting disc 11 is in threaded connection with the workbench 1 through a screw 12, and universal wheels 13 are arranged on the inner side of the bottom of the workbench 1, which is positioned on the inner side of each supporting disc 11. The workbench 1 is convenient to move and support and fix.
In the description of the present specification, the terms "connected," "mounted," "fixed," and the like are to be construed broadly, and "connected" may be, for example, a fixed connection, a detachable connection, or an integral connection, and may be directly connected or indirectly connected through an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, the terms "one embodiment," "some embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (6)
1. The method for measuring the three-dimensional information of the multilayer structure is characterized by comprising the following steps of:
1) Transmitting measuring light to the multilayer structure through the line spectrum confocal sensor, and carrying out full-area optical scanning on the top surface of the multilayer structure through the measuring light to obtain intensity distribution information of the reflected light;
2) Converting the intensity distribution information of the reflected light into three-dimensional point cloud information, and fitting the three-dimensional point cloud information by least square to obtain a multi-layer molded surface;
The multi-layer molded surface comprises a1 st layer molded surface, a 2 nd layer molded surface, an n th layer molded surface and a measuring thickness between adjacent molded surfaces from top to bottom, wherein the measuring thickness between the adjacent molded surfaces is named as h 1、h2、...、hn-1;
3) Refractive tilt compensation of the multilayer structure;
The true thickness H i between adjacent profiles is:
wherein, N is the refractive index of the material of the multilayer structure, and θ i is the incident angle of the measuring light relative to the i layer profile;
α=f(λ);
Wherein, Is a direction vector opposite to the direction of the incident ray of the measurement light;
is the normal vector of the i layer profile;
Alpha is the included angle between the incident ray of the measuring light in the y-z plane and the z axis;
f (λ) is a functional relation of α with respect to the light source wavelength λ;
4) Correcting the point cloud coordinates;
correcting the three-dimensional point cloud information from the 1 st layer profile to the nth layer profile by taking the point cloud information of the 1 st layer profile as a reference, namely that all points below the 1 st layer are in normal vectors Moving (Deltax, deltay, deltaz) 1 in the direction to obtain the real point cloud information of the layer 2 molded surface;
And by analogy, sequentially correcting the three-dimensional point cloud information from the ith layer profile to the nth layer profile again by taking the real point cloud information of the ith layer profile as a reference, namely after all points below the ith layer are subjected to the i-1 th correction, each point is in the normal vector Again moving (Δx, Δy, Δz) i in the direction to obtain real point cloud information for the i+1th layer profile, i=2..n-1;
after n-1 times of correction, obtaining real point cloud information of the multilayer structure;
Wherein, (H i-hi) is the refractive thickness error between the i-th layer profile and the i+1-th layer profile;
5) And extracting characteristic information of the micro-channels of the multilayer structure from the real point cloud information of the multilayer structure.
2. The method according to claim 1, wherein in the step 2), the three-dimensional point cloud information is subjected to downsampling, statistical filtering, and coarse point removal.
3. The measurement method according to claim 1, wherein the characteristic information of the micro-channel includes length, width, thickness, diameter and/or surface flatness.
4. A measuring device for measuring a multilayer structure using the measuring method according to any one of claims 1 to 3, comprising:
A work table;
The measuring platform is arranged above the workbench;
the placement seat is arranged above the measuring platform and is used for placing a multilayer structure;
The linear spectrum confocal sensor is arranged above the placement seat;
the driving module is arranged on the workbench, is respectively connected with the measuring platform and the line spectrum confocal sensor in a transmission way, and is used for driving the measuring platform to move along the X-axis direction and the Y-axis direction respectively and driving the line spectrum confocal sensor to move along the Z-axis direction;
The displacement platform, including fixed set up in the first base of measurement platform top surface, the top sliding connection of first base has the removal seat, one side of first base is fixed to be provided with and is used for the drive remove the seat and follow the first cylinder that X axle direction removed, the top of removing the seat is fixed to be provided with the second base, the bottom of settling the seat with the top sliding connection of second base, one side of second base is fixed to be provided with and is used for the drive settle the seat and follow the second cylinder that Y axle direction removed.
5. The measurement device of claim 4, wherein the drive module comprises an X-axis module, a Y-axis module, and a Z-axis module;
The X-axis module is arranged on the top surface of the workbench, the Y-axis module is in transmission connection with the top of the X-axis module, the measuring platform is in transmission connection with the top of the Y-axis module, a support is fixedly arranged on one side of the top surface of the workbench, the Z-axis module is fixedly arranged on one side of the support, and the line spectrum confocal sensor is in transmission connection with the Z-axis module.
6. The measuring device according to claim 4, wherein supporting plates are respectively arranged at four corners of the bottom of the workbench, the top of each supporting plate is in threaded connection with the workbench through a screw, and universal wheels are arranged on the inner sides of the supporting plates at the bottom of the workbench.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106959078A (en) * | 2017-02-28 | 2017-07-18 | 苏州凡目视觉科技有限公司 | A kind of contour measuring method for measuring three-dimensional profile |
| CN111486952A (en) * | 2020-06-02 | 2020-08-04 | 南京引创光电科技有限公司 | Optical measurement system |
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| CN111486952A (en) * | 2020-06-02 | 2020-08-04 | 南京引创光电科技有限公司 | Optical measurement system |
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