CN118545358A - How to provide circuit board labels - Google Patents

Abstract

A method for providing a circuit board label comprises the following steps: identifying an attachment area of the circuit board through at least one optical point on the circuit board; attaching the label to the attachment area of the circuit board; and pressing the label and the circuit board together. In addition, the material of the label comprises polyimide.

Description

How to provide circuit board labels

Technical Field

The present invention relates to a method for providing a label, and in particular to a method for providing a circuit board label.

Background Art

With the development of science and technology, electronic devices are widely used in various industries. In addition, most electronic devices require the support of circuit boards, making circuit boards the product with the highest market share among electronic components.

In order to identify the information of the circuit board from the appearance, black ink is first printed on the surface of the circuit board, and then the identification graphics are printed on the black ink. However, the identification graphics must be printed after the black ink solidifies. The production process is too much and time-consuming, resulting in increased costs. In addition, the circuit board needs to be transported multiple times during the production period, which will increase the probability of scratching the circuit board and reduce the pass rate. Furthermore, if the temperature during printing is too high, it may cause the circuit board to malfunction and cannot be used, which will also reduce the production pass rate. In addition, if the identification graphics are printed incorrectly, they cannot be corrected or reprinted, and the entire circuit board can only be scrapped.

Summary of the invention

The present invention provides a method for providing a circuit board label, which can simply and accurately provide a label containing information on the circuit board, thereby reducing the production cost and avoiding the decrease in the qualified rate caused by printing pictures and texts on the circuit board.

A method for providing a circuit board label disclosed in an embodiment of the present invention includes the following steps: identifying an attachment area of the circuit board through at least one optical point on the circuit board; attaching the label to the attachment area of the circuit board; and pressing the label and the circuit board together. In addition, the material of the label includes polyimide.

According to the method for providing circuit board labels disclosed in the above embodiments, optical dots can assist labels to be accurately attached to the attachment area of the circuit board, and the process of attaching labels is simple and can be completed quickly, thereby reducing the production cost. Furthermore, attaching labels to the circuit board can avoid the situation where the circuit board may be scratched due to printing on the surface of the circuit board, and can also avoid the situation where the circuit board may fail due to high temperature of printing, thereby avoiding the decrease in the qualified rate of the circuit board. In addition, if the printed content needs to be modified, it is only necessary to re-attach the label, and there is no need to report the entire circuit board, which can further save production costs.

The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the claims of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart of a method for providing a circuit board label according to an embodiment of the present invention.

FIG. 2 is a front view of a label in a method for providing a circuit board label according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of using a photosensitive element to sense a circuit board in a method for providing a circuit board label according to an embodiment of the present invention.

FIG. 4 is a schematic diagram of attaching a label to a circuit board in a method for providing a circuit board label according to an embodiment of the present invention.

DETAILED DESCRIPTION

An embodiment of the present invention will be described below, with reference to FIGS. 1 to 4 , wherein FIG. 1 is a flow chart of a method for providing a circuit board label according to an embodiment of the present invention, FIG. 2 is a front view schematic diagram of a label in the method for providing a circuit board label according to an embodiment of the present invention, FIG. 3 is a schematic diagram of sensing a circuit board with a photosensitive element in the method for providing a circuit board label according to an embodiment of the present invention, and FIG. 4 is a schematic diagram of attaching a label to a circuit board in the method for providing a circuit board label according to an embodiment of the present invention.

In step S101, the label 100 is laser engraved to form display information 101 on the label 100. The label 100 is, for example, attached to a release film and can be rolled up to complete laser engraving on a roll-to-roll device. The material of the label 100 may, for example, include polyimide (PI), which can withstand the high temperature during laser engraving (for example, it can withstand a high temperature of 288°C at least three times) and form display information 101. The display information 101 may be text information such as a serial number or manufacturer, as shown in Figure 2. In some embodiments, the display information may also be graphic information such as a trademark or a recycling mark. In some embodiments, the display information may also be formed on the label by printing or other methods, but the present invention is not limited to this.

Next, in step S102, the photosensitive element 200 may be used to sense the plurality of optical points 301 on the circuit board 300 to determine whether the photosensitive element 200 or the circuit board 300 needs to be adjusted or replaced. The photosensitive element 200 may be, for example, a high-precision charge-coupled device (CCD) in a camera, and the camera may be used to photograph the circuit board 300 to complete the photosensitive element 200 sensing the optical points 301. When the photosensitive element 200 cannot successfully sense the optical points 301, it may be that the photosensitive element 200 and the circuit board 300 are not well aligned with each other, or the surface of the photosensitive element 200 or the optical points 301 may be dirty. At this time, it is determined that the photosensitive element 200 or the circuit board 300 needs to be adjusted or replaced, and the process proceeds to step S1021. In step S1021, the position of the photosensitive element 200 or the circuit board 300 can be adjusted to align with each other, the surface of the photosensitive element 200 or the optical point 301 can be cleaned, or the photosensitive element 200 or the circuit board 300 in good condition can be directly replaced. Then, step S102 is re-executed. When the photosensitive element 200 can successfully sense the optical point 301, it is determined that the circuit board 300 and the photosensitive element 200 do not need to be adjusted or replaced, and the process proceeds to step S103.

In step S103, the photosensitive element 200 can be used to identify the attachment area 302 of the circuit board 300 through the optical point 301 on the circuit board 300, as shown in FIG3. Then, in step S104, the positioning file can be read by a labeling device (not shown separately). The labeling device can be, for example, a roll-to-roll labeling device. The positioning file can, for example, record coordinates. Then, in step S105, according to the positioning file, a picking element (not shown separately) of the labeling device can be moved to a target position corresponding to the above coordinates, wherein the picking element can be, for example, a suction nozzle.

Next, in step S106, the photosensitive element 200 can be used, for example, to determine whether the target position matches the attachment area 302 of the circuit board 300. For example, it can be checked whether the picking component is aligned with the attachment area 302. When the picking component is not aligned with the attachment area 302, it will be determined that the target position does not match the attachment area 302 of the circuit board 300, and the process proceeds to step S1061. In step S1061, the position of the picking component can be adjusted. Then, step S106 is executed again. When it is confirmed that the picking component can be aligned with the attachment area 302, it will be determined that the target position matches the attachment area 302 of the circuit board 300. Then, the label 100 that has been laser engraved and rolled up with the release film can be placed in the labeling equipment, and the process proceeds to step S107.

In step S107, the label 100 can be removed from the release film by using a picking component, and the label 100 can be moved to a target position and then attached to the attachment area 302 of the circuit board 300, as shown in FIG4. Then, in step S108, the label 100 and the circuit board 300 can be moved to a pressing device (not shown). Then, in step S109, the pressing device can be used to press the label 100 and the circuit board 300 to ensure that the label 100 is firmly attached to the circuit board 300.

Please note that the execution order of the above step S101 and step S102 is not intended to limit the present invention. In some embodiments, the above two steps can be executed in any order or simultaneously.

According to the method for providing circuit board labels of the above embodiment, the optical point can assist the label to be accurately attached to the attachment area of the circuit board, and the process of attaching the label is simple and can be completed quickly, thereby reducing the production cost. Furthermore, attaching the label to the circuit board can avoid the situation that the circuit board may be scratched due to printing on the surface of the circuit board, and can also avoid the situation that the circuit board may fail due to the high temperature of printing, thereby avoiding the decrease in the qualified rate of the circuit board. In addition, if the display information needs to be modified, it is only necessary to re-attach the label, and there is no need to report the entire circuit board, which can further save production costs.

【Explanation of symbols】

100: Tags

101: Display information

200: Photosensitive element

300: Circuit board

301: Optical Point

302: Attachment area

S101, S102, S1021, S103, S104, S105, S106, S1061, S107, S108, S109: steps.

Claims (6)

1. A method for providing a circuit board label, comprising: Identifying the attachment area of the circuit board by at least one optical point on the circuit board; attaching a label to the attaching area of the circuit board, wherein the material of the label comprises polyimide; and The label and the circuit board are pressed together. 2. The method for providing a circuit board label according to claim 1, wherein before attaching the label to the attaching area of the circuit board, the method further comprises: The label is laser engraved to form display information on the label. 3. The method for providing a circuit board label according to claim 1, wherein before identifying the attachment area of the circuit board by the at least one optical point on the circuit board, the method further comprises: Using a photosensitive element to sense the at least one optical point on the circuit board to determine whether the circuit board or the photosensitive element needs to be adjusted or replaced; When the circuit board or the photosensitive element is determined to need to be adjusted or replaced, the circuit board or the photosensitive element is adjusted or replaced, and the step of sensing the at least one optical point on the circuit board with the photosensitive element is performed again; and When the circuit board and the photosensitive element are determined to not need to be adjusted or replaced, the step of identifying the attachment area of the circuit board through the at least one optical point on the circuit board is performed. 4. The method for providing a circuit board label according to claim 1, further comprising: after identifying the attachment area of the circuit board by the at least one optical point on the circuit board; Read the positioning file with the labeling device; According to the positioning file, move the picking component of the labeling device to the target position; Determining whether the target position matches the attachment area of the circuit board; When the target position is determined not to match the attachment area of the circuit board, adjusting the position of the picking component, and executing again the step of determining whether the target position matches the attachment area of the circuit board; and When the target position is determined to match the attachment area of the circuit board, the step of attaching the label to the attachment area of the circuit board is performed. 5. The method for providing a circuit board label according to claim 1, wherein before the label and the circuit board are pressed together, the method further comprises: The label and the circuit board are moved to a pressing device. 6 . The method for providing a circuit board label according to claim 1 , wherein the step of attaching the label to the attaching area of the circuit board is performed by a roll-to-roll labeling device.