CN112555784B - A heat transfer working medium for enhancing the efficiency of the heat sink of high-power LED lamps - Google Patents
A heat transfer working medium for enhancing the efficiency of the heat sink of high-power LED lamps Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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Abstract
Description
技术领域technical field
本发明涉及相变传热技术领域，特别涉及一种用于强化大功率LED灯散热器效率的传热工作介质。The invention relates to the technical field of phase change heat transfer, in particular to a heat transfer working medium for enhancing the efficiency of a heat sink of a high-power LED lamp.
背景技术Background technique
目前LED的光电转换效率还有待提高，约有65％以上的电能变成热能释放。LED灯体温度过高会加速灯珠光衰，直接影响LED灯具使用寿命，要确保大功率LED灯珠产品正常工作(功率超过100W为大功率LED灯)，需要做好散热工作，如何将大功率LED灯产生的热量及时有效的输送出去已成为LED发展的制约因素。At present, the photoelectric conversion efficiency of LED still needs to be improved, and more than 65% of the electric energy is released into heat energy. If the temperature of the LED lamp body is too high, it will accelerate the luminous decay of the lamp beads, which will directly affect the service life of the LED lamps. To ensure the normal operation of the high-power LED lamp bead products (the power exceeds 100W is a high-power LED lamp), it is necessary to do a good job of heat dissipation. The timely and effective delivery of heat generated by LED lamps has become a restrictive factor in the development of LEDs.
现有的大功率LED散热器主要采用热管和均热板相变技术，热管技术做大功率导热体工艺复杂，成本高，拼接而成均温性差，且无法克服热传导死角，不能实现瞬间均温效果，同时无法解决方向性热传导问题，所形成的散热体不能任何方向使用，应用范围小。已公开的发明申请201921249253.7设计了一种新型LED筒灯用热管散热结构，将热管安置在散热器基体中，此设计可加强灯体散热能力，但存在安装结构复杂，灯体散热版面温度不均匀等特点。The existing high-power LED radiator mainly adopts the phase change technology of heat pipe and soaking plate. The heat pipe technology has a complex process and high cost to make a high-power heat conductor. At the same time, the problem of directional heat conduction cannot be solved, the formed heat sink cannot be used in any direction, and the application range is small. Published invention application 201921249253.7 designed a new type of heat pipe heat dissipation structure for LED downlights. The heat pipe is placed in the radiator base. This design can enhance the heat dissipation capacity of the lamp body, but there are complex installation structures and uneven temperature of the lamp body heat dissipation layout. Features.
均热板相变散热器响应速度快，受热面板温度均匀，受灯体照射角度影响少，因而被广泛用于大功率LED散热。而均热板散热器的散热效率受相变工质影响，因此开发一种高效可行的传热工质对大功率LED灯非常有必要。目前相变工质存在相变温度高、汽化潜热低，相变传热系数低等缺点。已公开的发明申请号为201410172539.5的技术，设计一种LED平板散热器，用于大功率LED散热，此技术在平板空腔体中注入相变工质，空腔内的可相变传热的介质受热沸腾，蒸汽迅速填充到空腔的各部分，使得底板各点的温度趋于一致，提高了散热均匀性，但此技术并没有提到其使用何总的相变工质。目前市面上使用相变工质有丙酮、乙醇、R22等，相比纯传热工质，混合纳米流体相比具有更高的导热系数，从而单位时间内传热工质可以带走热源面更多热量，使热源温度迅速降低；与此同时在相变传热过程中，纳米颗粒由于具有高比表面积，与液体传热工质具有更多的能量交换，从而提高吸收热源面能量效率；沸腾过程中纳米颗粒会减少汽泡与热源接触面三相接触线长度，减少接触面的表面张力，从而促进沸腾汽泡产生，增加汽泡脱离频率及减少脱离直径，因此起到强化沸腾传热效果。对于纳米颗粒选用，目前一般使用Fe2O3、Al2O3、SiO2、CuO等纳米颗粒材料与相变工质丙酮、乙醇、R22等制备成纳米流体用于强化LED灯体散热器散热，已公开的发明申请号201410521191.6、201410526065.X、201410522681.8、201410522702.6分别用Fe2O3、Al2O3、SiO2、CuO等纳米颗粒与水、乙醇等液体制备成纳米流体用于泡沫金属吸液芯热板强化LED灯体散热散热，这些发明能有效提高换热器传热性能，但存在颗粒堵塞泡沫金属吸液芯活化汽泡孔，传热效率有限，纳米流体不稳定等问题，因此进一步提升LED灯体散热器传热性能非常必要。解决这些问题，可以从提高纳米颗粒材料传热系数、提高纳米流体稳定性入手。石墨烯材料本身传热系数是Fe2O3、Al2O3、SiO2、CuO等纳米材料传热系数10余倍，因此石墨烯材料被广泛用于强化传热领域，对于使用石墨烯纳米材料与传热工质制备纳米流体强化LED散热，虽然相关研究有涉及石墨烯纳米流体用于强化沸腾传热，发现石墨烯纳米流体强化沸腾传热性能主要和石墨烯结构特征、颗粒大小、质量浓度有关，但公开的技术发明并没有涉及到，目前使用石墨烯用于强化LED灯体散热相关技术发明，主要集中使用在灯体灯板与灯体连接处，用于加强面板和灯体散热的热传导，例如已授权的发明号211289725；已公开的发明申请号201921485616.7，直接设计石墨烯散热器用于强化LED散热。前期自主研发制备的三维构造石墨烯，申请制备专利申请号201810410572.5，相比其它石墨烯结构形态，三维构造石墨烯表面成多孔，比表面积大，传热工质沸腾过程中三维构造石墨烯与传热工质产生更多的热交换，相同条件下能带走更多液体中热量，而此三维构造结构其它类型石墨烯不具有，因此三维构造石墨烯纳米流体相比其它类型的石墨烯纳米流体具有更好的强化沸腾传热效果。为进一步提高大功率LED灯散热器传热性能，在传热工质中加入多孔、比表面积大的三维构造石墨烯，开发一种新型混合的强化相变传热工质，对强化大功率LED灯散热及提高LED灯使用寿命有重要意义。The vapor chamber phase change heat sink has a fast response speed, uniform temperature of the heated panel, and is less affected by the illumination angle of the lamp body, so it is widely used for heat dissipation of high-power LEDs. The heat dissipation efficiency of the vapor chamber radiator is affected by the phase change working medium, so it is very necessary to develop an efficient and feasible heat transfer working medium for high-power LED lamps. At present, the phase change working fluid has disadvantages such as high phase transition temperature, low latent heat of vaporization, and low phase change heat transfer coefficient. The disclosed technology with the application number of 201410172539.5 is to design an LED flat plate heat sink for high-power LED heat dissipation. This technology injects a phase change working medium into the flat cavity body, and the phase change heat transfer in the cavity is possible. The medium is heated and boiled, and the steam is quickly filled into each part of the cavity, so that the temperature of each point of the bottom plate tends to be consistent, and the uniformity of heat dissipation is improved, but this technology does not mention the total phase change working medium used. At present, the phase change working fluids used on the market include acetone, ethanol, R22, etc. Compared with pure heat transfer working fluids, mixed nanofluids have higher thermal conductivity, so that heat transfer working fluids can take away more heat source surface per unit time. Due to the high specific surface area, the nanoparticles have more energy exchange with the liquid heat transfer medium, thereby improving the energy efficiency of absorbing heat source surface; boiling During the process, nanoparticles will reduce the length of the three-phase contact line between the contact surface of the bubble and the heat source, reduce the surface tension of the contact surface, thereby promoting the generation of boiling bubbles, increasing the frequency of bubble detachment and reducing the detachment diameter, thus enhancing the effect of boiling heat transfer. . For the selection of nanoparticles, at present, nano-particle materials such as Fe 2 O 3 , Al 2 O 3 , SiO 2 , and CuO are generally used and phase-change working fluids such as acetone, ethanol, R22, etc. are used to prepare nano-fluids for strengthening the heat dissipation of the LED lamp body radiator. , the published invention application numbers 201410521191.6, 201410526065.X, 201410522681.8, 201410522702.6 were prepared with Fe 2 O 3 , Al 2 O 3 , SiO 2 , CuO and other nanoparticles and water, ethanol and other liquids to prepare nanofluids for metal foam absorption The liquid core hot plate strengthens the heat dissipation of the LED lamp body. These inventions can effectively improve the heat transfer performance of the heat exchanger, but there are problems such as particle blockage of the foam metal liquid absorbent core to activate the bubble pores, limited heat transfer efficiency, and unstable nanofluid. It is necessary to further improve the heat transfer performance of the LED lamp body heat sink. To solve these problems, we can start from improving the heat transfer coefficient of nanoparticle materials and improving the stability of nanofluids. The heat transfer coefficient of graphene material itself is more than 10 times that of nanomaterials such as Fe 2 O 3 , Al 2 O 3 , SiO 2 , CuO, etc. Therefore, graphene materials are widely used in the field of strengthening heat transfer. Materials and heat transfer working fluid Preparation of nanofluids to enhance LED heat dissipation, although related research involves graphene nanofluids used to enhance boiling heat transfer, it is found that the performance of graphene nanofluids to enhance boiling heat transfer is mainly related to the structural characteristics, particle size, and quality of graphene. It is related to the concentration, but the disclosed technical inventions do not involve it. Currently, graphene is used to strengthen the heat dissipation of the LED lamp body. The related technical inventions are mainly used in the connection between the lamp body and the lamp body, and are used to strengthen the heat dissipation of the panel and the lamp body. For example, the authorized invention number 211289725; the published invention application number 201921485616.7, the graphene heat sink is directly designed to strengthen the LED heat dissipation. The three-dimensional structure graphene prepared by independent research and development in the early stage, the patent application number 201810410572.5 was applied for, compared with other graphene structures, the surface of the three-dimensional structure graphene is porous, and the specific surface area is large. The thermal working fluid produces more heat exchange, and can take away more heat in the liquid under the same conditions, while other types of graphene do not have this three-dimensional structural structure, so the three-dimensional structural graphene nanofluid is compared with other types of graphene nanofluids. It has better enhanced boiling heat transfer effect. In order to further improve the heat transfer performance of the heat sink for high-power LED lamps, three-dimensional graphene with porous and large specific surface area was added to the heat transfer medium, and a new type of mixed enhanced phase change heat transfer medium was developed. It is of great significance to dissipate heat and improve the service life of LED lamps.
公开于该背景技术部分的信息仅仅旨在增加对本发明的总体背景的理解，而不应当被视为承认或以任何形式暗示该信息构成已为本领域一般技术人员所公知的现有技术。The information disclosed in this Background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
发明内容SUMMARY OF THE INVENTION
本发明针对现有技术中存在相变工质较为单一、散热效果一般的技术问题，发明了一种用于强化大功率LED灯均热板散热器的传热工作介质，旨在得到一种沸点低、状态稳定、传热效率高的传热工作介质。Aiming at the technical problems in the prior art that the phase change working medium is relatively single and the heat dissipation effect is general, the present invention invents a heat transfer working medium for strengthening the heat sink of the high-power LED lamp vaporizing plate, aiming to obtain a boiling point Low heat transfer working medium with stable state and high heat transfer efficiency.
为实现上述目的，本发明提供的技术方案如下：For achieving the above object, the technical scheme provided by the invention is as follows:
一种用于强化大功率LED灯散热器效率的传热工作介质，按照质量百分比，包含以下组分：一氯四氟乙烷29％-31％、丙酮68.9％-70.8％、三维构造石墨烯0.01％-1％。A heat transfer working medium for enhancing the efficiency of a high-power LED lamp radiator, comprising the following components according to mass percentage: 29%-31% of chlorotetrafluoroethane, 68.9%-70.8% of acetone, three-dimensional structured graphene 0.01%-1%.
如上所述用于强化大功率LED灯散热器效率的传热工作介质，按照质量百分比，包含以下组分：一氯四氟乙烷30％、丙酮69-69.99％、三维构造石墨烯0.01％-1％。As mentioned above, the heat transfer working medium used to enhance the efficiency of the radiator of the high-power LED lamp, according to the mass percentage, contains the following components:
优选地，所述三维构造石墨烯是由二维石墨烯片构成的具有类蜂窝状结构的粉体材料，具有超高的表面积>1000平方米每克，并含有大量微孔结构，其结构基本特征符合技术标准DB 45/T 1421-2016和DB 45/T 1425-2016的要求。Preferably, the three-dimensional structured graphene is a powder material with a honeycomb-like structure composed of two-dimensional graphene sheets, has an ultra-high surface area >1000 square meters per gram, and contains a large number of microporous structures, and its structure is basically Features meet the requirements of technical standards DB 45/T 1421-2016 and DB 45/T 1425-2016.
上述用于强化大功率LED灯散热器效率的传热工作介质使用时，按照质量百分比，称取以下组分：一氯四氟乙烷29％-31％、丙酮68.9％-70.8％、三维构造石墨烯0.01％-1％，然后将一氯四氟乙烷、丙酮、三维构造石墨烯通过机械振动使各组分混合均匀，得到混合物，将LED灯体的均热板传热抽成真空，将混合物注入LED腔体中，即得。When the above-mentioned heat transfer working medium used to enhance the efficiency of the radiator of the high-power LED lamp is used, the following components are weighed according to the mass percentage: chlorotetrafluoroethane 29%-31%, acetone 68.9%-70.8%, three-dimensional structure Graphene 0.01%-1%, then chlorotetrafluoroethane, acetone, and three-dimensional graphene are mixed uniformly through mechanical vibration to obtain a mixture, and the heat transfer plate of the LED lamp body is evacuated into a vacuum, Inject the mixture into the LED cavity and you're done.
与现有技术相比，本发明具有如下有益效果：Compared with the prior art, the present invention has the following beneficial effects:
本发明传热工作介质能够使大于100W的LED灯体发光面板温度控制在60℃以下，面板温度更加均匀，温差不超过1℃，并可使灯体温度下降2-7℃，还可以削减LED灯体安装角度对灯体温度的影响，扩展LED灯投照范围；进一步的，本发明传热工作介质沸点低、状态稳定、制备方法简便、传热效率高，可解决大功率LED灯热传导问题，能够使高功率LED灯使用寿命提高2.5倍以上。The heat transfer working medium of the invention can control the temperature of the light-emitting panel of the LED lamp body larger than 100W below 60°C, the panel temperature is more uniform, the temperature difference does not exceed 1°C, the temperature of the lamp body can be lowered by 2-7°C, and the LEDs can be reduced. The influence of the installation angle of the lamp body on the temperature of the lamp body expands the projection range of the LED lamp; further, the heat transfer working medium of the present invention has low boiling point, stable state, simple preparation method and high heat transfer efficiency, and can solve the problem of heat conduction of high-power LED lamps. , which can increase the service life of high-power LED lamps by more than 2.5 times.
附图说明Description of drawings
图1是本发明实施例1所得传热工作介质与对比实施例1所得传热工作介质面板温度对比图。1 is a comparison diagram of the panel temperature of the heat transfer working medium obtained in Example 1 of the present invention and the heat transfer working medium obtained in Comparative Example 1.
图2是本发明实施例1所得传热工作介质与对比实施例1所得传热工作介质面板不同测温点温度分布对比图。2 is a comparison diagram of the temperature distribution at different temperature measurement points of the heat transfer working medium obtained in Example 1 of the present invention and the heat transfer working medium obtained in Comparative Example 1.
图3是本发明实施例2所得传热工作介质与对比实施例2所得传热工作介质面板不同测温点温度对比图。3 is a temperature comparison diagram of the heat transfer working medium obtained in Example 2 of the present invention and the heat transfer working medium obtained in Comparative Example 2 at different temperature measurement points.
图4是本发明实施例2所得传热工作介质与对比实施例2所得传热工作介质面板不同测温点温度分布对比图。4 is a comparison diagram of the temperature distribution at different temperature measurement points of the heat transfer working medium obtained in Example 2 of the present invention and the heat transfer working medium obtained in Comparative Example 2.
图5是本发明实施例1所得传热工作介质与对比实施例1所得传热工作介质安装角度对发光面板角度温度影响对比。5 is a comparison of the effect of the installation angle of the heat transfer working medium obtained in Example 1 of the present invention and the heat transfer working medium obtained in Comparative Example 1 on the angle temperature of the light-emitting panel.
具体实施方式Detailed ways
下面结合附图具体实施方式进行详细描述，但应当理解本发明的保护范围并不受具体实施方式的限制。实施例中采用的原料、试剂若无特殊说明，皆为市售所得。实施例中采用的三维构造石墨烯为根据申请号201810410572.5的专利申请制备所得，由二维石墨烯片构成的具有类蜂窝状结构的粉体材料，具有超高的表面积>1000平方米每克，并含有大量微孔结构，其结构基本特征符合技术标准DB 45/T 1421-2016和DB 45/T 1425-2016的要求。The following will describe in detail the specific embodiments in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments. The raw materials and reagents used in the examples are commercially available unless otherwise specified. The three-dimensional structure graphene used in the embodiment is prepared according to the patent application of the application number 201810410572.5, and the powder material with a honeycomb-like structure composed of two-dimensional graphene sheets has an ultra-high surface area>1000 square meters per gram, And contains a large number of microporous structures, and its basic structural characteristics meet the requirements of technical standards DB 45/T 1421-2016 and DB 45/T 1425-2016.
实施例1Example 1
一种用于强化大功率LED灯散热器效率的传热工作介质，称取以下组分：一氯四氟乙烷30g、丙酮69.9g、三维构造石墨烯0.01g，然后将一氯四氟乙烷、丙酮、三维构造石墨烯混合，混合后机械振动3小时，即得用于强化大功率LED灯散热器效率的传热工作介质。测量不同压力状态下传热工作介质的沸点，如表1所示。A heat transfer working medium for enhancing the efficiency of a high-power LED lamp radiator, the following components are weighed: 30 g of chlorotetrafluoroethane, 69.9 g of acetone, 0.01 g of three-dimensional structured graphene, and then 1 g of chlorotetrafluoroethane Alkane, acetone, and three-dimensional structural graphene are mixed, and mechanically vibrated for 3 hours after mixing to obtain a heat transfer working medium used to enhance the efficiency of the high-power LED lamp radiator. Measure the boiling point of the heat transfer working medium under different pressure states, as shown in Table 1.
表1传热工质状态参数Table 1 State parameters of heat transfer medium
实施例2Example 2
一种用于强化大功率LED灯散热器效率的传热工作介质，称取以下组分：一氯四氟乙烷30g、丙酮69g、三维构造石墨烯1g，然后将一氯四氟乙烷、丙酮、三维构造石墨烯混合，混合后机械振动3小时，即得用于强化大功率LED灯散热器效率的传热工作介质。A heat transfer working medium for enhancing the efficiency of a high-power LED lamp radiator, the following components are weighed: 30 g of chlorotetrafluoroethane, 69 g of acetone, 1 g of three-dimensional structured graphene, and then 1 g of chlorotetrafluoroethane, Acetone and three-dimensional structural graphene are mixed, and after mixing, mechanical vibration is obtained for 3 hours to obtain a heat transfer working medium for enhancing the efficiency of the radiator of the high-power LED lamp.
实施例3Example 3
一种用于强化大功率LED灯散热器效率的传热工作介质，称取以下组分：一氯四氟乙烷29g、丙酮70.8g、三维构造石墨烯0.2g，然后将一氯四氟乙烷、丙酮、三维构造石墨烯混合，混合后机械振动3小时，即得用于强化大功率LED灯散热器效率的传热工作介质。A heat transfer working medium for enhancing the efficiency of a high-power LED lamp radiator, the following components are weighed: 29 g of chlorotetrafluoroethane, 70.8 g of acetone, 0.2 g of three-dimensional structured graphene, and then chlorotetrafluoroethane is weighed. Alkane, acetone, and three-dimensional structural graphene are mixed, and mechanically vibrated for 3 hours after mixing to obtain a heat transfer working medium used to enhance the efficiency of the high-power LED lamp radiator.
实施例4Example 4
一种用于强化大功率LED灯散热器效率的传热工作介质，称取以下组分：一氯四氟乙烷31g、丙酮68.9g、三维构造石墨烯0.1g，然后将一氯四氟乙烷、丙酮、三维构造石墨烯混合，混合后机械振动3小时，即得用于强化大功率LED灯散热器效率的传热工作介质。A heat transfer working medium for enhancing the efficiency of a high-power LED lamp radiator, the following components are weighed: 31 g of chlorotetrafluoroethane, 68.9 g of acetone, 0.1 g of three-dimensional structured graphene, and then chlorotetrafluoroethane is weighed. Alkane, acetone, and three-dimensional structural graphene are mixed, and mechanically vibrated for 3 hours after mixing to obtain a heat transfer working medium used to enhance the efficiency of the high-power LED lamp radiator.
对比实施例1Comparative Example 1
一种用于LED灯散热器效率的传热工作介质，称取以下组分：一氯四氟乙烷30g、丙酮69.9g，然后将一氯四氟乙烷、丙酮混合，混合后机械振动3小时，即得用于LED灯散热器效率的传热工作介质。A heat transfer working medium used for the efficiency of the radiator of LED lamps, the following components are weighed: 30 g of chlorotetrafluoroethane and 69.9 g of acetone, and then mixed with chlorotetrafluoroethane and acetone, and mechanically vibrated for 3 Hours, that is, the heat transfer working medium used for the efficiency of the heat sink of the LED lamp.
对比实施例2Comparative Example 2
一种用于LED灯散热器效率的传热工作介质，称取以下组分：一氯四氟乙烷30g、丙酮69g，然后将一氯四氟乙烷、丙酮混合，混合后机械振动3小时，即得用于LED灯散热器效率的传热工作介质。A heat transfer working medium for LED lamp radiator efficiency, weigh the following components: 30 g of chlorotetrafluoroethane and 69 g of acetone, then mix chlorotetrafluoroethane and acetone, and mechanically vibrate for 3 hours after mixing , that is, the heat transfer working medium used for the efficiency of the LED lamp radiator.
应用application
应用例1：Application example 1:
将实施例1、对比实施例1制备所得传热工作介质分别注入到如申请号为201410172539.5的发明申请所示的200W大功率LED灯体均热板散热器中(先将均热板散热器抽真空)，灯体照明正常稳定后，灯体发光面板温度稳定在78℃。比对二者发现，实施例1的传热工质可使发光面板灯体温度比对比实施例1低5-7℃(如图1所示)，面板温度更加均匀，温差不超过1℃(如图2所示)。The heat transfer working media prepared in Example 1 and Comparative Example 1 were respectively injected into the 200W high-power LED lamp body vapor chamber radiator as shown in the invention application with the application number of 201410172539.5 (the vapor chamber radiator was pumped first. Vacuum), after the lighting of the lamp body is normal and stable, the temperature of the light-emitting panel of the lamp body is stable at 78 ℃. Comparing the two, it is found that the heat transfer working medium of Example 1 can make the temperature of the light-emitting panel lamp body 5-7°C lower than that of Comparative Example 1 (as shown in Figure 1), the panel temperature is more uniform, and the temperature difference does not exceed 1°C ( as shown in picture 2).
应用例2：Application example 2:
将实施例2、对比实施例1制备所得传热工作介质分别注入到如申请号为201410172539.5的发明申请所示的200W大功率LED灯体均热板散热器中(先将均热板散热器抽真空)，灯体照明正常稳定后，灯体发光面板温度稳定在60℃。比对二者发现，实施例2的传热工质可使发光面板灯体温度比对比实施例1低25℃(如图3所示)，面板温度更加均匀，温差不超过0.9℃(如图4所示)，灯珠使用寿命提高2.5倍以上。The heat transfer working media prepared in Example 2 and Comparative Example 1 were respectively injected into the 200W high-power LED lamp body vapor chamber radiator as shown in the invention application with the application number of 201410172539.5 (the vapor chamber radiator was pumped first. Vacuum), after the lighting of the lamp body is normal and stable, the temperature of the light-emitting panel of the lamp body is stable at 60 °C. Comparing the two, it is found that the heat transfer working medium of Example 2 can make the temperature of the light-emitting
应用例3：Application example 3:
将申请号为201410172539.5的发明申请所示的200W大功率LED灯体分别按照0°、15°、30°、45°60°、75°、90°的角度安装，然后再分别注入实施例1和对比实施例1制备素的传热工作介质。发现本发明传热工作介质作用下不同安装角度LED灯发光面板温度最大温差为1.9℃、而对比实施例1不同安装角度LED灯发光面板温度最大温差为6.5℃(如图5所示)，说明本发明传热工作介质能削减安装角度可削减LED灯体安装角度对灯体温度的影响，这样可扩展LED灯投照范围。The 200W high-power LED lamp body shown in the invention application with the application number of 201410172539.5 was installed according to the angles of 0°, 15°, 30°, 45°, 60°, 75°, and 90°, and then injected into Examples 1 and 9 respectively. The heat transfer working medium of Comparative Example 1 was prepared. It is found that under the action of the heat transfer working medium of the present invention, the maximum temperature difference of the LED lamp light-emitting panel temperature at different installation angles is 1.9°C, while the maximum temperature difference of the LED lamp light-emitting panel temperature at different installation angles in Comparative Example 1 is 6.5°C (as shown in Figure 5). The heat transfer working medium of the invention can reduce the installation angle and the influence of the installation angle of the LED lamp body on the temperature of the lamp body, so that the projection range of the LED lamp can be expanded.
本发明的传热工质中的三维构造石墨烯为根据申请号201810410572.5的专利申请制备所得，三维构造石墨烯和一氯四氟乙烷、丙酮按一定比例制备成混合工质，将LED灯体的均热板传热抽成真空，将传热相变工质注入LED腔体中，真空状态次下，工质遇热源在40℃以上，媒介迅速汽化，均匀充满整个密封空间并迅速扩散，分子运动消耗热能的同时将热传递于整个密封腔体，因为均热板上方存在与空气对流传热的散热片，可将腔体内部热量输送到空气中，从而使得腔体内部的压力稳定在一定的范围，保持混合相变工质底温相变温度。同时均热板内部相变工质处于微重力状态下，不同安装角度的灯体温度相对比较均匀，所制成的均热板传热器可以任意方向使用，因此本发明的微重力分子热传导媒，沸点低，状态稳定，工艺简便，相变传热系数强，可解决大功率热传导问题。The three-dimensional structure graphene in the heat transfer working medium of the present invention is prepared according to the patent application of the application number 201810410572.5. The three-dimensional structure graphene, chlorotetrafluoroethane and acetone are prepared into a mixed working medium in a certain proportion, and the LED lamp body is prepared into a mixed working medium. The heat transfer of the soaking plate is evacuated into a vacuum, and the heat transfer phase change working medium is injected into the LED cavity. In the vacuum state, when the working medium encounters the heat source above 40 °C, the medium rapidly vaporizes, evenly fills the entire sealed space and spreads rapidly. Molecular motion consumes heat energy while transferring heat to the entire sealed cavity, because there are heat sinks above the vapor chamber that conduct heat convection with the air, which can transport the heat inside the cavity to the air, so that the pressure inside the cavity is stabilized at In a certain range, keep the bottom temperature phase change temperature of the mixed phase change working medium. At the same time, the phase change working medium inside the soaking plate is in a state of microgravity, the temperature of the lamp body at different installation angles is relatively uniform, and the made soaking plate heat transfer device can be used in any direction. Therefore, the microgravity molecular heat transfer medium of the present invention is , The boiling point is low, the state is stable, the process is simple, and the phase change heat transfer coefficient is strong, which can solve the problem of high-power heat conduction.
前述对本发明的具体示例性实施方案的描述是为了说明和例证的目的。这些描述并非想将本发明限定为所公开的精确形式，并且很显然，根据上述教导，可以进行很多改变和变化。对示例性实施例进行选择和描述的目的在于解释本发明的特定原理及其实际应用，从而使得本领域的技术人员能够实现并利用本发明的各种不同的示例性实施方案以及各种不同的选择和改变。本发明的范围意在由权利要求书及其等同形式所限定。The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise form disclosed, and obviously many changes and modifications are possible in light of the above teachings. The exemplary embodiments were chosen and described for the purpose of explaining certain principles of the invention and their practical applications, to thereby enable one skilled in the art to make and utilize various exemplary embodiments and various different aspects of the invention. Choose and change. The scope of the invention is intended to be defined by the claims and their equivalents.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1976916A1 (en) * | 2006-01-10 | 2008-10-08 | Dow Global Technologies Inc. | Improved foams for vehicular energy absorbance |
| TW201331352A (en) * | 2011-12-16 | 2013-08-01 | Biofilm Ip Llc | Cryogenic injection compositions, systems and methods for cryogenically modulating flow in a conduit |
| WO2016115225A1 (en) * | 2015-01-14 | 2016-07-21 | Immunolight, Llc. | Non-invasive systems and methods for treatment of a host carrying a virus with photoactivatable drugs |
| CN107556450A (en) * | 2016-06-30 | 2018-01-09 | 翁秋梅 | A kind of dynamic aggregation thing and application with hybrid cross-linked network |
| WO2018028365A1 (en) * | 2016-08-09 | 2018-02-15 | 翁秋梅 | Dynamic polymer with hybrid cross-linked network and application thereof |
| CN107978384A (en) * | 2017-11-27 | 2018-05-01 | 西安工程大学 | A kind of electrocondution slurry aerosol and preparation method thereof |
| CN109486342A (en) * | 2018-09-05 | 2019-03-19 | 广西大学 | A kind of anticorrosive paint of D structure graphene reinforced epoxy |
| CN111446220A (en) * | 2020-03-31 | 2020-07-24 | 广西大学 | Radiator for short-time junction temperature protection of thyristor and protection time obtaining method thereof |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA923389A (en) * | 1968-05-20 | 1973-03-27 | Union Carbide Corporation | Heat transfer process |
| US20070213418A1 (en) * | 2004-05-18 | 2007-09-13 | Vermilion Donn R | Asphalt-filled polymers |
| TW201604465A (en) * | 2010-06-15 | 2016-02-01 | 拜歐菲樂Ｉｐ有限責任公司 | Methods, devices and systems for extraction of thermal energy from a heat conducting metal conduit |
| US9605193B2 (en) * | 2012-10-19 | 2017-03-28 | The Hong Kong University Of Science And Technology | Three dimensional interconnected porous graphene-based thermal interface materials |
| US9856272B2 (en) * | 2015-11-06 | 2018-01-02 | The Board Of Regents Of The University Of Texas System | [1-3]-thiazine-fulleropyrrolo derivatives of C60 and C70 as HIV-inhibitor agents |
| CN106986960A (en) * | 2016-11-09 | 2017-07-28 | 广西大学 | It is a kind of to prepare graphene three-dimensional construction method of the powder body material containing carbon polymer |
| CN108690454B (en) * | 2017-03-17 | 2020-12-25 | 山东圣泉新材料股份有限公司 | Graphene heat dissipation coating and preparation method and application thereof |
| EP3602641A4 (en) * | 2017-03-20 | 2021-01-13 | Charles J. Cauchy | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
| CN107246579A (en) * | 2017-07-27 | 2017-10-13 | 湖州明朔光电科技有限公司 | Graphene intelligence joins LED headlights |
| CN110873363A (en) * | 2018-09-01 | 2020-03-10 | 广西大学 | Air conditioner with graphene added into refrigerant and graphene coated on heat exchange component |
-
2020
- 2020-10-27 CN CN202011163132.8A patent/CN112555784B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1976916A1 (en) * | 2006-01-10 | 2008-10-08 | Dow Global Technologies Inc. | Improved foams for vehicular energy absorbance |
| TW201331352A (en) * | 2011-12-16 | 2013-08-01 | Biofilm Ip Llc | Cryogenic injection compositions, systems and methods for cryogenically modulating flow in a conduit |
| WO2016115225A1 (en) * | 2015-01-14 | 2016-07-21 | Immunolight, Llc. | Non-invasive systems and methods for treatment of a host carrying a virus with photoactivatable drugs |
| CN107556450A (en) * | 2016-06-30 | 2018-01-09 | 翁秋梅 | A kind of dynamic aggregation thing and application with hybrid cross-linked network |
| WO2018028365A1 (en) * | 2016-08-09 | 2018-02-15 | 翁秋梅 | Dynamic polymer with hybrid cross-linked network and application thereof |
| CN107978384A (en) * | 2017-11-27 | 2018-05-01 | 西安工程大学 | A kind of electrocondution slurry aerosol and preparation method thereof |
| CN109486342A (en) * | 2018-09-05 | 2019-03-19 | 广西大学 | A kind of anticorrosive paint of D structure graphene reinforced epoxy |
| CN111446220A (en) * | 2020-03-31 | 2020-07-24 | 广西大学 | Radiator for short-time junction temperature protection of thyristor and protection time obtaining method thereof |
Non-Patent Citations (3)
| Title |
|---|
| Enhanced Oxygen Reduction Reaction by In Situ Anchoring Fe2N Nanoparticles on Nitrogen-Doped Pomelo Peel-Derived Carbon;Yiqing Wang等;《Nanomaterials》;20171122;第17卷(第11期);全文 * |
| Three-dimensional graphene networks: synthesis, properties and applications;Yanfeng Ma等;《National Science Review》;20141217;全文 * |
| 石墨烯在散热及热管理中的应用;张勇等;《电子元件与材料》;20170930;第36卷(第9期);全文 * |
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