CN111370359A - Fixtures for Open Wafer Cassettes - Google Patents
Fixtures for Open Wafer Cassettes Download PDFInfo
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- CN111370359A CN111370359A CN202010142716.0A CN202010142716A CN111370359A CN 111370359 A CN111370359 A CN 111370359A CN 202010142716 A CN202010142716 A CN 202010142716A CN 111370359 A CN111370359 A CN 111370359A
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- 230000007246 mechanism Effects 0.000 claims abstract description 92
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- 235000012431 wafers Nutrition 0.000 abstract description 69
- 230000008520 organization Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- -1 photovoltaic Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
本发明公开了一种开放式晶圆盒用治具,包括治具底座、定位组织、传感器、智能调整安全机构,定位组织、传感器、智能调整安全机构均安装于治具底座上,治具底座下表面可以安装在驱动器上,治具底座由立板、下底板、上底板组成,一个定位组织由两个上部定位机构、两个侧部定心机构、一个下部定位机构组成,下定位机构、侧部定心机构、上部定位机构用于晶圆盒定位,提高其定位精度,以便机器人抓取,智能调整安全机构对晶圆盒位置进行判断和调整使其放置到位,传感器用来判断是否有开放式晶圆盒。本发明的开放式晶圆盒用治具大大提高了晶圆在运输过程中的安全性,具有安全性高、节约成本的优点。
The invention discloses a jig for an open wafer box, comprising a jig base, a positioning organization, a sensor and an intelligent adjustment safety mechanism. The positioning organization, the sensor and the intelligent adjustment safety mechanism are all mounted on the jig base, and the jig base The lower surface can be installed on the driver. The base of the fixture consists of a vertical plate, a lower bottom plate and an upper bottom plate. A positioning organization consists of two upper positioning mechanisms, two side centering mechanisms, and a lower positioning mechanism. The lower positioning mechanism, The side centering mechanism and the upper positioning mechanism are used for the positioning of the wafer cassette to improve its positioning accuracy so that the robot can grasp it. The intelligent adjustment safety mechanism judges and adjusts the position of the wafer cassette to place it in place. Open wafer cassette. The jig for the open wafer cassette of the present invention greatly improves the safety of wafers during transportation, and has the advantages of high safety and cost saving.
Description
技术领域technical field
本发明涉及半导体、光伏、蓝宝石晶圆或硅片或蓝宝石片搬运领域,具体涉及一种开放式晶圆盒用治具。The invention relates to the field of semiconductor, photovoltaic, sapphire wafer or silicon wafer or sapphire wafer handling, in particular to a jig for an open wafer box.
背景技术Background technique
半导体、光伏、蓝宝石晶圆或硅片或蓝宝石片是一种非常贵重的产品,在放置和运输过程中必须要保证其不能损坏。其中在开放式晶圆盒是其行业常见装晶圆及蓝宝石的装置,在生产过程中大量周转,现在一般由人工轻拿轻放搬取,或放入手推车,对其精细附加固定,然后慢慢推到机台边,再对其拆开上下料,在搬放过程需要非常小心,对操作人员的素质要求很高,而且效率低下。同时人工拿取有损伤或掉落,会给公司带来极大的效益损失。Semiconductors, photovoltaics, sapphire wafers or silicon or sapphire wafers are very valuable products that must not be damaged during placement and transport. Among them, the open wafer box is a common device for loading wafers and sapphire in its industry. It has a lot of turnover in the production process. Now it is generally handled by hand, or put into a trolley, and it is finely attached and fixed, and then slowly Slowly push it to the edge of the machine, and then disassemble it for loading and unloading. It needs to be very careful during the handling process, which requires high quality of operators and low efficiency. At the same time, if it is damaged or dropped by manual handling, it will bring great loss of benefits to the company.
近年来,随着工业机器人等智能装备技术的快速发展和劳动力成本的不断上升,行业对自动化生产制造的需求也越来越高。传统的人工生产难于管理,质量和成本的控制太难,开放式晶圆盒搬运周转及上下料的自动化需求日益迫切。所以就有用复合机器人的来抓取和运输的方案,复合机器人为机器人+AGV+视觉,在复合机器人上装上夹具抓取机台上的开放式晶圆盒,然而此方案有要解决抓区放置过成中可能对产品造成损坏的风险,运输过程产品可能从开口滑出损坏的风险。同时视觉定位时间长,多次视觉定位需要更多时间,影响生产效率,如果用加复合机器人来解决,成本太高。In recent years, with the rapid development of intelligent equipment technology such as industrial robots and the continuous rise of labor costs, the industry's demand for automated manufacturing is also increasing. Traditional manual production is difficult to manage, quality and cost control are too difficult, and the automation of open wafer cassette handling, turnover and loading and unloading is increasingly urgent. Therefore, there is a solution for grasping and transporting with a composite robot. The composite robot is a robot + AGV + vision, and a clamp is installed on the composite robot to grab the open wafer box on the machine table. However, this solution has to solve the problem that the grasping area has been placed. There is a risk of damage to the product during assembly, and the risk that the product may slip out of the opening during shipping and be damaged. At the same time, the visual positioning time is long, and multiple visual positioning takes more time, which affects the production efficiency. If it is solved by adding a composite robot, the cost is too high.
发明内容SUMMARY OF THE INVENTION
本发明要解决的技术问题在于,针对上述问题,提供一种开放式晶圆盒用治具。The technical problem to be solved by the present invention is to provide a jig for an open wafer cassette in view of the above problems.
本发明通过以下技术方案来实现上述目的:一种开放式晶圆盒用治具,其中:包括治具底座、定位组织、传感器、智能调整安全机构,所述定位组织、传感器、智能调整安全机构均安装于治具底座上;The present invention achieves the above object through the following technical solutions: a jig for an open wafer cassette, which includes a jig base, a positioning organization, a sensor, and an intelligent adjustment safety mechanism, the positioning organization, the sensor, and the intelligent adjustment safety mechanism are installed on the base of the fixture;
治具底座由立板、下底板、上底板组成,上底板通过多块立板倾斜固定于下底板上;The base of the fixture is composed of a vertical plate, a lower bottom plate and an upper bottom plate, and the upper bottom plate is inclined and fixed on the lower bottom plate through a plurality of vertical plates;
所述定位组织由上部定位机构、侧部定心机构、下部定位机构组成,上部定位机构安装于上底板最高端,侧部定心机构安装于上底板的中部,下部定位机构安装于上底板最低端;The positioning mechanism is composed of an upper positioning mechanism, a side centering mechanism, and a lower positioning mechanism. The upper positioning mechanism is installed at the highest end of the upper base plate, the side centering mechanism is installed at the middle of the upper base plate, and the lower positioning mechanism is installed at the lowest point of the upper base plate. end;
智能调整安全机构由调整安全机构座、对射传感器组成,调整安全机构座活动设置于上底板的四角,在每个调整安全机构座上均设置有对射传感器,且同一高度上的两个对射传感器发射端相对。The intelligent adjustment safety mechanism is composed of an adjustment safety mechanism seat and a shooting sensor. The adjustment safety mechanism seat is movably arranged at the four corners of the upper bottom plate. Each adjustment safety mechanism seat is provided with a shooting sensor, and two pairs of the same height are installed. The transmitter side of the radiation sensor is opposite.
作为本发明的进一步优化方案,上部定位机构由上部定位座、弹簧一、导向块、旋转轴组成,上部定位座固定于上底板上,导向块通过旋转轴安装于上部定位座上,且上部定位座与导向块之间形成第一弹性空间,所述第一弹性空间内安装有弹簧一,弹簧一的两端分别连接上部定位座与导向块。As a further optimized solution of the present invention, the upper positioning mechanism is composed of an upper positioning seat, a
作为本发明的进一步优化方案,侧部定心机构由侧部定心座、挡板、轴承、弹性件,侧部定心座固定于上底板上,挡板设置于侧部定心座的侧面,轴承通过弹性件横向固定于侧部定心座内,挡板上开设有通孔,轴承穿过通孔。As a further optimized solution of the present invention, the side centering mechanism consists of a side centering seat, a baffle plate, a bearing, and an elastic member. The side centering seat is fixed on the upper bottom plate, and the baffle plate is arranged on the side of the side centering seat. The bearing is laterally fixed in the side centering seat through the elastic piece, the baffle plate is provided with a through hole, and the bearing passes through the through hole.
作为本发明的进一步优化方案,下部定位机构由固定板、定位板、弹簧二、导向杆,固定板固定于上底板上,导向杆固定于固定板上,定位板活动固定于导向杆上,定位板与固定板之间形成第二弹性空间,所述第二弹性空间内设有弹簧二,弹簧二的两端分别连接定位板与固定板。As a further optimized solution of the present invention, the lower positioning mechanism consists of a fixed plate, a positioning plate, a second spring, and a guide rod. The fixed plate is fixed on the upper bottom plate, the guide rod is fixed on the fixed plate, and the positioning plate is movably fixed on the guide rod. A second elastic space is formed between the plate and the fixing plate, the second elastic space is provided with a second spring, and two ends of the second spring are respectively connected to the positioning plate and the fixing plate.
作为本发明的进一步优化方案,弹簧二的最小弹力大于等于弹簧一最大弹力加晶圆盒与上底板之间的静摩擦力,且弹簧一的最小弹力大于等于晶圆盒与上底板之间的静摩擦力。由于上底板具有一定的倾斜度,因此为了防止在放置好后晶圆盒不会从上底板上滑出,因此弹簧二的最小弹力因大于等于弹簧一最大弹力加晶圆盒与上底板之间的静摩擦力。且弹簧一的最小弹力大于等于晶圆盒与上底板之间的静摩擦力,保证晶圆盒能够依靠在定位板上,防止运输过程中发生滑动。As a further optimized solution of the present invention, the minimum elastic force of spring two is greater than or equal to the maximum elastic force of spring one plus the static friction force between the wafer cassette and the upper bottom plate, and the minimum elastic force of spring one is greater than or equal to the static friction between the wafer box and the upper bottom plate force. Since the upper base plate has a certain inclination, in order to prevent the wafer cassette from sliding out of the upper base plate after being placed, the minimum elastic force of
作为本发明的进一步优化方案,弹性件的最小弹力大于等于轴承与晶圆盒之间的摩擦力加晶圆盒与上底板之间的静摩擦力。保证了弹性件能够夹紧晶圆盒。As a further optimized solution of the present invention, the minimum elastic force of the elastic member is greater than or equal to the frictional force between the bearing and the wafer cassette plus the static frictional force between the wafer cassette and the upper bottom plate. It is ensured that the elastic member can clamp the wafer cassette.
作为本发明的进一步优化方案,两个侧部定心机构之间的距离大于晶圆盒盒宽。两个侧部定心机构之间距离略大于晶圆盒盒宽,能够有效保证晶圆盒的快速放入,且能够有效保证轴承夹紧晶圆盒。As a further optimized solution of the present invention, the distance between the two side centering mechanisms is greater than the width of the wafer cassette. The distance between the two side centering mechanisms is slightly larger than the width of the wafer box, which can effectively ensure the rapid insertion of the wafer box, and can effectively ensure that the bearing clamps the wafer box.
作为本发明的进一步优化方案,一个定位组织由两个上部定位机构、两个侧部定心机构、一个下部定位机构组成。As a further optimized solution of the present invention, one positioning organization is composed of two upper positioning mechanisms, two side centering mechanisms, and one lower positioning mechanism.
作为本发明的进一步优化方案,导向块呈凹形结构。通过设置凹形结构的导向块,可有效匹配晶圆盒侧壁上凸起的,实现晶圆盒的稳定放置。As a further optimized solution of the present invention, the guide block has a concave structure. By arranging the guide block of the concave structure, the convex on the side wall of the wafer box can be effectively matched, and the stable placement of the wafer box can be realized.
本发明的有益效果是:The beneficial effects of the present invention are:
通过设置上部定位机构、侧部定心机构、下部定位机构,实现了晶圆盒的稳定放置,防止在运输过程中发生错位。By setting the upper positioning mechanism, the side centering mechanism, and the lower positioning mechanism, the stable placement of the wafer cassette is realized to prevent misalignment during transportation.
通过设置凹形结构的导向块,可有效匹配晶圆盒侧壁上凸起的,实现晶圆盒的稳定放置。By arranging the guide block of the concave structure, the convex on the side wall of the wafer box can be effectively matched, and the stable placement of the wafer box can be realized.
通过设置射传感器,实现了晶圆盒的精确放置,防止晶圆盒子摆放错位。By setting the shot sensor, the precise placement of the wafer cassette is realized, and the misplacement of the wafer cassette is prevented.
附图说明Description of drawings
图1是本发明开放式晶圆盒用治具结构示意图;1 is a schematic structural diagram of a jig for an open wafer cassette of the present invention;
图2是本发明开放式晶圆盒用治具治具底座结构示意图;2 is a schematic structural diagram of a jig base for an open-type wafer cassette of the present invention;
图3是本发明开放式晶圆盒用治具定位组织结构示意图;3 is a schematic diagram of the positioning organization structure of the jig for the open wafer cassette of the present invention;
图4是本发明开放式晶圆盒用治具上部定位机构、侧部定心机构、下部定位机构结构示意图;4 is a schematic structural diagram of the upper positioning mechanism, the side centering mechanism and the lower positioning mechanism of the jig for the open wafer cassette according to the present invention;
图5是本发明开放式晶圆盒用治具智能调整安全机构结构示意图;5 is a schematic structural diagram of an intelligent adjustment safety mechanism for a fixture for an open wafer cassette according to the present invention;
图6是本发明开放式晶圆盒用治具侧部定心机构侧视图;6 is a side view of the side centering mechanism of the jig for an open wafer cassette of the present invention;
图7是本发明开放式晶圆盒用治具侧部定心机构内部结构示意图;7 is a schematic diagram of the internal structure of the side centering mechanism of the jig for an open wafer cassette according to the present invention;
1-治具底座、3-传感器、4-智能调整安全机构、11-立板、12-下底板、13-上底板、21-上部定位机构、22-侧部定心机构、23-下部定位机构、41-调整安全机构座、42-对射传感器、211-上部定位座、212-弹簧一、213-导向块、214-旋转轴、221-侧部定心座、222-挡板、223-轴承、224-弹性件、231-固定板、232-定位板、233-弹簧二、234-导向杆、41-调整安全机构座、42-对射传感器。1- Fixture base, 3- Sensor, 4- Intelligent adjustment safety mechanism, 11- Vertical plate, 12- Lower base plate, 13- Upper base plate, 21- Upper positioning mechanism, 22- Side centering mechanism, 23- Lower positioning Mechanism, 41-adjustment safety mechanism seat, 42-air sensor, 211-upper positioning seat, 212-
具体实施方式Detailed ways
下面结合附图对本申请作进一步详细描述,有必要在此指出的是,以下具体实施方式只用于对本申请进行进一步的说明,不能理解为对本申请保护范围的限制,该领域的技术人员可以根据上述申请内容对本申请作出一些非本质的改进和调整。The application will be described in further detail below in conjunction with the accompanying drawings. It is necessary to point out that the following specific embodiments are only used to further illustrate the application, and should not be construed as limiting the protection scope of the application. Those skilled in the art can The above application content makes some non-essential improvements and adjustments to this application.
实施例1Example 1
如图1所示的一种开放式晶圆盒用治具,包括治具底座1、定位组织、传感器3、智能调整安全机构4,所述定位组织、传感器3、智能调整安全机构4均安装于治具底座1上,结构简单,制作成本相对较低。As shown in FIG. 1, a jig for an open wafer cassette includes a
如图2所示,治具底座1由立板11、下底板12、上底板13组成,上底板13通过多块立板11倾斜固定于下底板12上。其中立板11可以为直角三角形,使上底板13通过立板11固定在下底板12上时具有一定的倾斜度。当开放式晶圆盒放在上底板13上时开口向上,使其在运动过程中晶圆不会从开放式晶圆盒因惯性或震动而滑出来。As shown in FIG. 2 , the
如图3所示,所述定位组织由上部定位机构21、侧部定心机构22、下部定位机构23组成,上部定位机构21安装于上底板13最高端,侧部定心机构22安装于上底板13的中部,下部定位机构23安装于上底板13最低端。且一个定位组织由两个上部定位机构21、两个侧部定心机构22、一个下部定位机构23组成。上部定位机构21、侧部定心机构22、下部定位机构23相互配合,使开放式晶圆盒稳定放置在上底板13上。As shown in FIG. 3 , the positioning organization consists of an
如图5所示,智能调整安全机构4由调整安全机构座41、对射传感器42组成,调整安全机构座41活动设置于上底板13的四角,在每个调整安全机构座41上均设置有对射传感器42,且同一高度上的两个对射传感器42发射端相对。对射传感器42一端发射光线,一端接收光线,当光线被遮挡,对射传感器42可触发信号。当机器人放置开放式晶圆盒的过程中,若光线被遮挡,对射传感器42可触发信号给机器人,机器人向反方向移动晶圆盒,直到无信号触发,说明在晶圆盒位于可放置范围内,可以安全放下。若上下两条光线均被遮挡,在机器人微量双方旋转后扔没有作用,则要停止并报警。As shown in FIG. 5 , the intelligent
实施例2Example 2
如实施例1所示的一种开放式晶圆盒用治具,其区别仅在于,如图4所示,上部定位机构21由上部定位座211、弹簧一212、导向块213、旋转轴214组成,上部定位座211固定于上底板13上,导向块213通过旋转轴214安装于上部定位座211上,且上部定位座211与导向块213之间形成第一弹性空间,所述第一弹性空间内安装有弹簧一212,弹簧一212的两端分别连接上部定位座211与导向块213。As shown in
如图4、图6、图7所示,侧部定心机构22由侧部定心座221、挡板222、轴承223、弹性件224,侧部定心座221固定于上底板13上,挡板222设置于侧部定心座221的侧面,轴承223通过弹性件224横向固定于侧部定心座221内,挡板222上开设有通孔2221,轴承223穿过通孔2221。且两个侧部定心机构22之间的距离略大于晶圆盒盒宽,开放式晶圆盒在成两个侧部定心机构22中间,有很小的间隙,在开放式晶圆盒放置的过程中轴承可以向后移动,放置好后轴承223将开放式晶圆盒推到两个轴承223之间,此时至少有一个轴承223与开放式晶圆盒有一定间隙。As shown in FIGS. 4 , 6 and 7 , the
如图4所示,下部定位机构23由固定板231、定位板232、弹簧二233、导向杆234,固定板231固定于上底板13上,导向杆234固定于固定板231上,定位板232活动固定于导向杆234上,定位板232与固定板231之间形成第二弹性空间,所述第二弹性空间内设有弹簧二233,弹簧二233的两端分别连接定位板232与固定板231。As shown in FIG. 4 , the
弹簧二233的最小弹力为F1,弹簧一212的最大弹力为F2,最小弹力为F3,弹性件224的最小弹力为F4,晶圆盒与上底板13之间的静摩擦力为F0,放置好后,晶圆盒与轴承223之间的摩擦力为F5。其中,F1≥F2+F0,F3≥F0,F4≥F0+F5。由于上底板13具有一定的倾斜度,为了防止在放置好后晶圆盒不会从上底板上滑出,因此弹簧二的最小弹力F1因大于等于弹簧一最大弹力F2加晶圆盒与上底板之间的静摩擦力F0。且弹簧一的最小弹力F3大于等于晶圆盒与上底板之间的静摩擦力F0,保证晶圆盒能够依靠在定位板上,防止运输过程中发生滑动。上定位机构21、侧部定心机构22、下部定位机构23不一定只限于此一种结构,结构之间可以互换也可以使用其他弹性机构,如上定位机构可在无外加驱动力的情况下将开放式晶圆盒精确定位,使复合机器人在不使用视觉定位的情况下对其抓取,用很少的成本减少了时间节拍,提高生产效率。The minimum elastic force of the
实施例3Example 3
如实施例1所示的一种开放式晶圆盒用治具,其区别仅在于,导向块213呈凹形结构。由于晶圆盒的侧壁上设置有一块小凸起,为了更好地配合晶圆盒,因此导向块213呈凹形结构,能够更好地固定住晶圆盒。A jig for an open wafer cassette as shown in
上面所述的实施例仅仅是对本发明的优选实施方式进行描述,并非对本发明的构思和范围进行限定。在不脱离本发明设计构思的前提下,本领域普通人员对本发明的技术方案做出的各种变型和改进,均应落入到本发明的保护范围,本发明请求保护的技术内容,已经全部记载在权利要求书中。The above-mentioned embodiments are only to describe the preferred embodiments of the present invention, and do not limit the concept and scope of the present invention. On the premise of not departing from the design concept of the present invention, various modifications and improvements made by those of ordinary skill in the art to the technical solutions of the present invention should fall within the protection scope of the present invention, and the technical content claimed in the present invention has been fully recorded in the claims.
Claims (9)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116469830A (en) * | 2023-06-19 | 2023-07-21 | 北京芯士联半导体科技有限公司 | Wafer box overturning device of etching machine |
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| CN101685788A (en) * | 2008-09-23 | 2010-03-31 | 家登精密工业股份有限公司 | Front-opening wafer box with latch and airtight structure |
| US20120067770A1 (en) * | 2010-09-17 | 2012-03-22 | Sinfonia Technology Co., Ltd. | Cassette adapter, adapter main body locking apparatus and seating sensor mechanism |
| CN108364894A (en) * | 2018-02-08 | 2018-08-03 | 上海华岭集成电路技术股份有限公司 | A kind of wafer cassette convenient for wafer cassette closing lid stores transport device |
| CN211719570U (en) * | 2020-03-04 | 2020-10-20 | 杭州中为光电技术有限公司 | Open wafer box jig |
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| CN101685788A (en) * | 2008-09-23 | 2010-03-31 | 家登精密工业股份有限公司 | Front-opening wafer box with latch and airtight structure |
| US20120067770A1 (en) * | 2010-09-17 | 2012-03-22 | Sinfonia Technology Co., Ltd. | Cassette adapter, adapter main body locking apparatus and seating sensor mechanism |
| CN108364894A (en) * | 2018-02-08 | 2018-08-03 | 上海华岭集成电路技术股份有限公司 | A kind of wafer cassette convenient for wafer cassette closing lid stores transport device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116469830A (en) * | 2023-06-19 | 2023-07-21 | 北京芯士联半导体科技有限公司 | Wafer box overturning device of etching machine |
| CN116469830B (en) * | 2023-06-19 | 2023-08-22 | 北京芯士联半导体科技有限公司 | Wafer box overturning device of etching machine |
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