CN103466930A - Cutting system and cutting method for glass panel - Google Patents
Cutting system and cutting method for glass panel Download PDFInfo
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- CN103466930A CN103466930A CN201310316180XA CN201310316180A CN103466930A CN 103466930 A CN103466930 A CN 103466930A CN 201310316180X A CN201310316180X A CN 201310316180XA CN 201310316180 A CN201310316180 A CN 201310316180A CN 103466930 A CN103466930 A CN 103466930A
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- 239000011521 glass Substances 0.000 title claims abstract description 92
- 238000005520 cutting process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 33
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 8
- 208000037656 Respiratory Sounds Diseases 0.000 description 6
- 229910001651 emery Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 208000013201 Stress fracture Diseases 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011222 crystalline ceramic Substances 0.000 description 1
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000005383 fluoride glass Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000035488 systolic blood pressure Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Embodiments in the invention disclose a cutting system for a glass panel. The cutting system comprises a platform used for disposing the glass panel. A focusing mirror is vertically arranged above the platform. A laser beam guiding apparatus used for reflecting laser emitted by a laser transmitter is vertically arranged above the focusing mirror. The embodiments in the invention further disclose a cutting method for the glass panel. The cutting method comprises the following steps: starting the laser transmitter and reflecting laser emitted by the laser transmitter through the laser beam guiding apparatus; then allowing the reflected laser to form a focused body through the focusing mirror; and allowing the focused body to be irradiated onto the glass panel moved by the platform so as to complete cutting of the glass panel. The glass panel cutting system provided by the invention has the characteristics of a simple structure and low cost; and the glass panel cutting method using the glass panel cutting system has the characteristics of a fast cutting speed, good quality and high intensity.
Description
Technical field
The present invention relates to a kind of equipment of glass-cutting, relate in particular to a kind of face glass diced system and method thereof.
Background technology
Mobile equipment and consumption electronic product substantially all adopt contact panel at present, and traditional working method is to adopt CNC cut mechanically method, and maximum shortcoming is that process velocity is slower, yields poorly down, and more scrap is also arranged.In cut mechanically, by emery wheel or mechanical wheel, on glass, delineated, produce the tangential tension along cut direction, thereby glass is split along cut, and the edge of this cutting is unsmooth, and micro-fractures is arranged, on material, local stress easily causes the product fragmentation, the yield rate of impact cutting.In addition, the emery wheel of CNC cut mechanically can produce wearing and tearing along with the time, thereby has influence on cutting quality.The operator must predict the work-ing life of emery wheel, and the emery wheel more renewed when arriving duration of service.Too early replacing emery wheel has improved the cost of equipment.Secondly, the cutting condition, as cutting dynamics, speed, the degree of depth and angle, must accurately be controlled to avoid to produce slight crack at glass surface.Along with scientific and technological development, also growing to the demand of thinner face glass, it is lightening that current mobile equipment and consumption electronic product more and more tend to, and contact panel is also to more broad future development, and the frivolous glass cutting of strengthening more and more becomes a difficult problem.Frivolous chilled glass, because the raising of hardness is used the CNC cut mechanically more frangible, no longer be suitable for the cutting mode of CNC machinery.
Summary of the invention
Technical problem to be solved by this invention is, a kind of face glass diced system is provided, there are characteristics simple in structure, that cost is low, use the method for described face glass diced system glass-cutting panel simultaneously, have the advantages that cutting speed in feet per minute is fast, quality good, intensity is high.
In order to solve the problems of the technologies described above, the embodiment of the present invention provides a kind of face glass diced system, comprises the platform for the placing glass panel, and the vertical top of described platform is provided with condensing lens; The vertical top of described condensing lens is provided with the laser beam guide device that the laser for laser transmitter is sent is reflected.
For improvement of the technical scheme, described platform is moveable platform.
For further improvement in the technical proposal, the laser that described laser transmitter sends is carbon dioxide laser, Nd YV04 laser, Nd YAG laser, optical-fiber laser or above four kinds of laser that produce by SHG and THG.
For further improvement in the technical proposal, the wavelength of the laser that described laser transmitter sends is 200 ~ 12000nm.
Correspondingly, the embodiment of the present invention also provides a kind of method of face glass cutting, comprises the steps:
Open described laser transmitter, the laser sent is through the laser beam guide device reflection;
Laser after reflection forms and focuses on body through described condensing lens;
Focus on body and expose to by the face glass of described platform movement, thereby complete the cutting to described face glass.
For improvement of the technical scheme, described platform linearly at the uniform velocity moves.
For further improvement in the technical proposal, the laser after reflection is after described condensing lens focuses on, and described focus point forms the focusing body be comprised of focus point and focused beam in face glass.
For further improvement in the technical proposal, the laser after reflection is after described condensing lens focuses on, and described focus point forms in the 5mm scope and focuses on body above face glass.
For further improvement in the technical proposal, the laser after reflection is after described condensing lens focuses on, and described focus point forms in the 5mm scope and focuses on body below face glass.
In sum, the present invention adopts contactless laser cutting pattern, by laser beam guide device by after Laser emission, the line focus mirror forms the focusing body be comprised of laser focusing light beam and focus point after focusing on again, energy in described focusing body makes the glass contraction speed that is positioned at the glass focusing body that focuses on the body edge faster, thereby makes inside glass produce crackle.In the at the uniform velocity mobile process of face glass straight line on described platform, complete cutting operation.In this process, the method for being delineated due to forgone existing use emery wheel or mechanical wheel,
Implement the embodiment of the present invention, there is following beneficial effect:
(1) diced system is simple in structure, cost is low;
(2) cutting method speed is fast, quality good, intensity is high.
The accompanying drawing explanation
Fig. 1 is the light path schematic diagram of face glass diced system of the present invention in embodiment 1;
Fig. 2 focuses on the schematic diagram of body in face glass diced system of the present invention;
Fig. 3 is the principle schematic that the crackle in face glass diced system embodiment 1 of the present invention forms;
Fig. 4 is the principle schematic in the cutting process in face glass diced system embodiment 1 of the present invention;
Fig. 5 is the light path schematic diagram of face glass diced system of the present invention in embodiment 2;
Fig. 6 is the light path schematic diagram of face glass diced system of the present invention in embodiment 4.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the present invention is described in further detail.
Embodiment 1:
As shown in Figure 1, face glass diced system of the present invention, comprise platform 1, condensing lens 2, laser beam guide device 4 and laser transmitter 3, and described platform 1 is used for placing face glass to be cut 5, and can move, translational speed can be adjusted as the case may be; Described face glass 5 can be silicate glass, alumina silicate glass, aluminosilicate chemically reinforced glass, borosilicate glass, fluoride glass, soda-lime glass, silica glass, ultrathin flexible glass, sapphire, crystalline ceramics, semitransparent ceramics etc.; Described laser transmitter 3 is for Emission Lasers; 4 of described laser beam guide devices are reflected for the laser that described laser transmitter 3 is launched; 2 laser after described laser beam guide device 4 reflections of described condensing lens carry out focussing force, it is formed and focus on body, and described focusing body is comprised of focused beam 7 and focus point 6.Energy in described focusing body can be faster than the glass contraction speed that focuses on body so that be positioned at the glass that focuses on the body edge, thereby inside glass is cracked.The laser that wherein said laser transmitter 3 sends comprises carbon dioxide laser, Nd YV04 laser, Nd YAG laser, optical-fiber laser and above four kinds of laser that produce by SHG and THG, wavelength all between 200 ~ 12000nm pulse width comprise millisecond, delicate, nanosecond, psec, femtosecond pulse.Be all below to use comparatively common laser, but the present invention is not limited to above several laser.
Adopt described face glass diced system to carry out the method for glass-cutting, concrete steps are as follows:
(1) open described laser transmitter 3;
(2) laser that laser transmitter 3 sends is through laser beam guide device 4 reflections;
(3) laser after laser beam guide device 4 reflections is after condensing lens 2, at the interior formation aggregate of face glass 5, as shown in Fig. 2 (a);
(4) described platform 1 is with translational motion movable glass panel 5 at the uniform velocity, thereby the focusing body that is is radiated at the circuit that light path on face glass 5 forms cutting, finally completes the cutting operation to described face glass.
This method has been utilized the object characteristic of laser-Melting And Solidification phenomenon, as shown in Figure 3, focus on glass 2 that energy in body makes to focus on the body edge slowly fusing solidify rapidly again, shrink more fast than the glass 2 focused in body, and produced crackle.Can more know and see that crackle 8 produces along the direction of central melting line in conjunction with Fig. 4.Due to the motion of platform 1, focused beam 7 is along one side of face glass 5 to the other side scanning on opposite, and crackle 8 extends to the direction of focused beam 7 scannings, thereby makes face glass 5 be cut into less unit.
Embodiment 2:
The face glass diced system that the present embodiment and embodiment 1 adopt is just the same, difference only is: in the face glass cutting method, laser after reflection after condensing lens 2, shown in focus point 6 5mm above face glass 5 form to focus on body, be shown in (c) of Fig. 2.The light path of whole face glass diced system as shown in Figure 5.
This method has been utilized the object characteristic of laser equally, works as focus point 6 at face glass 5 5mm places, surface, can produce a kind of thermal induction different from embodiment 1 Melting And Solidification phenomenon and heat cooling phenomenon.The energy of the focusing body in face glass 5 can't produce fusing very little, but enough cause face glass 5 heating that focus on the body edge, the face glass 5 that causes focusing on the body edge heats again cooling sooner more slowly, shrinks sooner than the face glass 2 focused in body, thereby cracks 8.
Embodiment 3:
The face glass diced system method that the present embodiment and embodiment 2 adopts is just the same, and difference only is: in the face glass cutting method, the laser after reflection after condensing lens 2, shown in focus point 6 2mm above face glass 5 form and focus on body.Utilize equally this you the object characteristic-thermal induction of laser heat cooling phenomenon, process in the same manner as in Example 2, is only wanted quicker point in time.
Embodiment 4:
The face glass diced system that the present embodiment and embodiment 1 adopt is just the same, difference only is: in the face glass cutting method, laser after reflection after condensing lens 2, shown in focus point 6 5mm below face glass 5 form to focus on body, be shown in (b) of Fig. 2.The light path of whole face glass diced system as shown in Figure 6.
This method has been utilized the object characteristic of laser equally, both the Melting And Solidification phenomenon may occur, also may occur that thermal induction heats cooling phenomenon, as for specifically there will be any phenomenon, depends on the energy focused in body, and is determined by the working parameter of focused beam 7.After the fusing of induced with laser or heating, at first fusing formation 10， molten bath, molten bath 10 occurs at the centerplane that focuses on body, and reason is to focus on most of energy of body at center.The glass that focuses on the body edge slowly fusing not only solidifies rapidly (or slowly heating but also cooling rapidly), than the glass that focuses on the body center, shrinks faster.The result of this Melting And Solidification (or heating cooling) is exactly, and solidifies (or cooling) to final stage, and the glass that focuses on the body centerplane has been not enough to bear the inner radial systolic pressure produced by adjacent glass fusing (or heating).Like this, in the process of Melting And Solidification (or heating cooling), crackle is produced to bottom by the surface of face glass 5.
Embodiment 5:
The face glass diced system method that the present embodiment and embodiment 4 adopts is just the same, and difference only is: in the face glass cutting method, the laser after reflection after condensing lens 2, shown in focus point 6 2mm below face glass 5 form and focus on body.Utilize equally this you the object characteristic of laser, process is in the same manner as in Example 4, only short in time.
Above disclosed is only a kind of preferred embodiment of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the claims in the present invention, still belong to the scope that the present invention is contained.
Claims (9)
1. a face glass diced system, comprise the platform (1) for placing glass panel (5), it is characterized in that:
The vertical top of described platform (1) is provided with condensing lens (2);
The vertical top of described condensing lens (2) is provided with the laser beam guide device (4) that the laser for laser transmitter (3) is sent is reflected.
2. face glass diced system according to claim 1 is characterized in that:
Described platform (1) is moveable platform.
3. face glass diced system according to claim 1 is characterized in that:
The laser that described laser transmitter (3) sends is carbon dioxide laser, Nd YV04 laser, Nd YAG laser, optical-fiber laser or above four kinds of laser that produce by SHG and THG.
4. face glass diced system according to claim 3 is characterized in that:
The wavelength of the laser that described laser transmitter (3) sends is 200 ~ 12000nm.
5. a method of utilizing face glass diced system glass-cutting claimed in claim 1, is characterized in that, comprises the steps:
Open described laser transmitter (3), the laser sent is through laser beam guide device (4) reflection;
Laser after reflection forms the focusing body be comprised of focus point (6) and focused beam (7) through described condensing lens (2);
Focus on body and expose to the face glass (5) mobile by described platform (1) above, thereby complete the cutting to described face glass (5).
6. the method that face glass according to claim 5 cuts is characterized in that:
Described platform (1) linearly at the uniform velocity moves.
7. the method that face glass according to claim 5 cuts is characterized in that:
Laser after reflection is after described condensing lens (2) focuses on, and described focus point (6) forms and focuses on body in face glass.
8. the method that face glass according to claim 5 cuts is characterized in that:
Laser after reflection is after described condensing lens (2) focuses on, and described focus point (6) forms in the 5mm scope and focuses on body above face glass.
9. the method that face glass according to claim 5 cuts is characterized in that:
Laser after reflection is after described condensing lens (2) focuses on, and described focus point (6) forms in the 5mm scope and focuses on body below face glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310316180XA CN103466930A (en) | 2013-07-25 | 2013-07-25 | Cutting system and cutting method for glass panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310316180XA CN103466930A (en) | 2013-07-25 | 2013-07-25 | Cutting system and cutting method for glass panel |
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| CN103466930A true CN103466930A (en) | 2013-12-25 |
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| CN201310316180XA Pending CN103466930A (en) | 2013-07-25 | 2013-07-25 | Cutting system and cutting method for glass panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109014602A (en) * | 2018-07-17 | 2018-12-18 | 孙超 | A kind of cutter device for big thickness glass panel |
| CN111018334A (en) * | 2019-12-28 | 2020-04-17 | 深圳中科光子科技有限公司 | Laser processing method and laser processing device for fluorescent glass ceramic |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63230289A (en) * | 1987-03-19 | 1988-09-26 | Hitachi Ltd | Laser outline processing method |
| CN101136361A (en) * | 2000-09-13 | 2008-03-05 | 浜松光子学株式会社 | Laser processing method |
| CN201087172Y (en) * | 2006-12-28 | 2008-07-16 | 上海市激光技术研究所 | Ultra-thin glass substrate laser cutting machine |
| CN102308372A (en) * | 2008-12-05 | 2012-01-04 | 新加坡科技研究局 | A wafer cutting method and a system thereof |
-
2013
- 2013-07-25 CN CN201310316180XA patent/CN103466930A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63230289A (en) * | 1987-03-19 | 1988-09-26 | Hitachi Ltd | Laser outline processing method |
| CN101136361A (en) * | 2000-09-13 | 2008-03-05 | 浜松光子学株式会社 | Laser processing method |
| CN201087172Y (en) * | 2006-12-28 | 2008-07-16 | 上海市激光技术研究所 | Ultra-thin glass substrate laser cutting machine |
| CN102308372A (en) * | 2008-12-05 | 2012-01-04 | 新加坡科技研究局 | A wafer cutting method and a system thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109014602A (en) * | 2018-07-17 | 2018-12-18 | 孙超 | A kind of cutter device for big thickness glass panel |
| CN109014602B (en) * | 2018-07-17 | 2020-07-07 | 诸暨市开翎工业设计有限公司 | Cutting device for large-thickness glass panel |
| CN111018334A (en) * | 2019-12-28 | 2020-04-17 | 深圳中科光子科技有限公司 | Laser processing method and laser processing device for fluorescent glass ceramic |
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Application publication date: 20131225 |
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