CN102732938A - Electroplating device and method for dynamically adjusting anode power supply area - Google Patents

Abstract

An electroplating device and method for dynamically adjusting the power supply area of an anode, the electroplating device comprises: an electroplating bath, wherein the electroplating solution is contained in the electroplating bath; a fixing device for fixing one end of a plated object to immerse the plated object into the electroplating solution, wherein the plated object is connected with a cathode power supply; a first anode metal plate connected with an anode power supply, wherein the first anode metal plate is positioned in the electroplating bath and is parallel to the plated object, one side of the first anode metal plate completely corresponds to one side of the plated object, and the anode power supply connected to the first anode metal plate can continuously supply power to the first anode metal plate; and a second anode metal plate connected with another anode power supply, the first anode metal plate is positioned in the electroplating bath and is parallel to the plated object, one side part of the second anode metal plate corresponds to the position of one side of the plated object adjacent to the other end, and the another anode power supply connected to the second anode metal plate can intermittently supply power to the second anode metal plate.

Description

Electroplating device and method for dynamically adjusting anode power supply area

technical field

The present invention relates to an electroplating device and its method. It mainly includes setting a first anode metal plate and a second anode metal plate in an electroplating tank, and the anode metal plates are located at different depths, and are connected to a The plated objects are parallel to each other, wherein the second anode metal plate corresponds to the position near the bottom end of the side of the plated object, and the anode power supply connected to the second anode metal plate can intermittently power the second anode metal plate Power supply, by dynamically adjusting the power supply area and power of the anode metal plate, a uniform electroplating layer is formed on the object to be plated, and excessive metal ions are effectively prevented from adhering to the side of the object to be plated adjacent to the bottom end surface.

Background technique

Press, electroplating technology is a fairly common film-forming technology. The purpose of electroplating is mainly to prevent rust, increase aesthetics or form a circuit base layer. The basic operation process of electroplating includes grinding, polishing, hanging, degreasing and degreasing, water washing, electrolytic polishing (or chemical polishing), pickling activation, pre-plating, electroplating, water washing and other post-treatment steps. All processes before plating are generally called pretreatment, the main purpose is to repair the surface of the object to be plated to remove grease, rust, oxide film, etc. on the surface of the object to be plated. According to statistics, 60% of defective electroplating products are caused by poor pretreatment, which shows the importance of pretreatment. In addition, in the operation process, polishing is to remove visible defects such as rust and scratches on the surface of the plated object, while polishing is to further reduce the roughness of the surface of the plated object to obtain a bright appearance. In addition, the purpose of pickling is to remove the surface rust and oxide film of the plated object, and pickling includes chemical pickling and electrochemical pickling. In the electroplating operation of some items, the industry may make appropriate adjustments to the above-mentioned basic operation process according to the material characteristics or actual needs of the plated object, or appropriately omit or increase the above-mentioned basic operation process to achieve the best electroplating effects or product needs.

Electroplating mainly uses the principle of electrolysis to supply electric energy in the form of an external DC power supply to reduce the metal ions in the solution to metal, and to deposit the metal on the surface of the plated object. Although electroplating technology is a fairly mature technology, there are still many technical problems to be solved. For example, in the electroplating process of printed circuit board (referred to as PCB), there is often a problem of uneven thickness of the electroplating layer (or circuit base layer), and the causes and shortcomings of the uneven thickness of the electroplating layer are explained. as follows:

Please refer to Fig. 1, which is a known electroplating device 1. In the past, when the electroplating operation of the circuit board B was performed, the electroplating bath 11 was first filled in an electroplating tank 10. At present, the electroplating solution 11 is often used by the industry. Solution 11, copper sulfate (CuSO ₄ ) can dissociate into copper ions (Cu ²⁺ ) and sulfate ions (SO ₄ ²⁻ ) after dissolving in water, forming a copper sulfate solution. During the electroplating process, after the reduction reaction between copper ions and electrons, they can combine to form copper atoms (Cu), which is the composition of the electroplating layer. Referring back to Fig. 1, the electroplating device 1 includes two anode metal plates 12 and a clamp 13 in addition to the aforementioned electroplating tank 10, wherein the anode metal plate 12 is located in the electroplating tank 10 and is immersed in the electroplating tank 10. In the liquid 11, each of the anode metal plates 12 is connected to the anode power supply P respectively.

In addition, please refer to FIG. 1 again, the clamp 13 clamps and fixes the top of the circuit board B, and immerses the circuit board B in the electroplating solution 11 . The circuit board B is connected to a cathode power supply N. When the anode power supply P supplies power to the anode metal plate 12, and the cathode power supply N also supplies power to the circuit board B, the anode metal plate 12 and the circuit board B will The potential difference can drive the copper ions (hereinafter referred to as metal ions M) in the electroplating solution to move towards the direction of the circuit board B, and since the circuit board B is connected to the cathode power supply N, the surface of the circuit board B will be covered with electrons ( electron), when the metal ions M move to the surface of the circuit board B, the metal ions M can undergo a reduction reaction with the electrons, so that the metal ions M can combine with the electrons on the surface of the circuit board B. In this way, please refer to Figure 2 Shown, the metal ions M can be reduced to metal, and an electroplating layer E is formed on the circuit board B. Now, please refer to Fig. 1 and shown in Fig. 2 again, if the length of circuit board B (that is, the depth that circuit board B is immersed in the electroplating solution 11) is less than the length of anode metal plate 12 (that is, anode metal plate 12 is immersed in depth in the electroplating solution 11), the part D on the anode metal plate 12 that exceeds the length of the circuit board B will still carry out the electroplating operation on the surface of the circuit board B, so that the distance between the part D and the circuit board B on the anode metal plate 12 The metal ions M in the electroplating solution 11 move towards the direction of the circuit board B, and combine with the electrons on the surface of the adjacent bottom end of the circuit board B, resulting in that after the electroplating operation is completed, as viewed from the cross-sectional structure of the electroplating layer E, The thickness of the part of the electroplating layer E adjacent to the bottom of the circuit board B will be greater than that of other parts. The problem of flatness makes it possible to use etching technology to form the required electrical lines on the electroplating layer E of the circuit board B in the future, and the impedance of the electrical lines will be uneven, or the impedance of the electrical lines cannot be controlled. The problem will have a serious negative impact on the overall electrical performance of circuit board B (that is, the circuit board on which the electrical circuit has been etched). Therefore, the circuit board B that has been electroplated will become defective and be eliminated, resulting If the rate is too low, it will not only cause unnecessary waste of resources, but also cause the cost of electroplating to be greatly reduced, which obviously does not meet the expected benefits. In addition, although the industry may carry out follow-up grinding and other processing operations on the electroplating layer E in order to obtain a smooth surface of the electroplating layer E, this will undoubtedly increase the process and complexity of the operation, and greatly increase the cost of electroplating operations. Cause unnecessary time consumption, quite undesirable.

Please refer to Fig. 3 , although there are industry operators who have added a barrier plate 14 in the electroplating device 1 to cover the part D that exceeds the circuit board B on the anode metal plate 12 in order to solve the above problems, so that the protruding part on the anode metal plate 12 D cannot perform electroplating operations on the surface of the circuit board B, so as to effectively avoid the occurrence of the aforementioned uneven surface of the electroplating layer E, etc., wherein the two barrier plates 14 are respectively located adjacent to each anode metal plate 12, and the two barrier plates 14 can isolate The position D on the anode metal plate 12 that exceeds the circuit board B prevents the excess position D from performing electroplating operations on the surface of the circuit board B. Thus, when the anode power supply P supplies power to the anode metal plate 12, and the cathode power supply N also supplies power to the circuit board B, the electroplating solution 11 between the anode metal plate 12 and the corresponding part of the circuit board B is not blocked. With the isolation of the board 14, the metal ions M in it will move towards the circuit board B and undergo a reduction reaction to form a uniform electroplating layer on the circuit board B. Also, because of being isolated by the barrier plate 14 between the protruding portion D of the anode metal plate 12 and the circuit board B, the metal ions in the electroplating solution 11 cannot face the circuit board B, and will not be adjacent to the circuit board B. An uneven plating layer is formed at the bottom portion. In this way, excessive metal ions can be effectively prevented from moving to the portion near the bottom of the circuit board B, and problems such as uneven thickness of the electroplating layer can be prevented. However, in order to install the barrier plate 14 in the electroplating device 1, the operator must additionally add the automation mechanism and fixtures (omitted in the figure) required for lifting the barrier plate 14, which not only greatly increases the design and manufacturing costs of the electroplating device 1, but also The complexity of the mechanism of the electroplating device 1 is greatly increased. Moreover, in order to accommodate the barrier plate 14, the industry must reserve an extra space for the barrier plate 14 in the electroplating tank 10 when designing the electroplating tank 10, which will obviously greatly increase the electroplating capacity. The width and volume of the tank 10 not only cause unnecessary waste of the electroplating solution 11, but also increase the distance between the anode metal plate 12 and the circuit board B, resulting in a large increase in the voltage required for the electroplating operation, resulting in a substantial increase in power consumption, which makes the industry Higher production costs must be paid, which severely reduces the profit margin of the industry, and needs to be improved immediately.

Therefore, how to design a novel electroplating device to effectively improve the above-mentioned problems of the known electroplating device, so that the industry can be installed on the circuit board B without adding a barrier plate and without increasing the width and volume of the electroplating tank. Form a uniform electroplating layer on the circuit board B, and completely avoid the problem of uneven electroplating layer on the circuit board B, in order to effectively reduce the width and volume of the electroplating tank 10, and greatly reduce the power consumption and cost of the electroplating operation, which becomes the present invention. An important topic to be explored.

Contents of the invention

In view of the many problems disclosed above, the inventor has finally developed and designed the electroplating device and method for dynamically adjusting the anode power supply area of the present invention after long-term hard research and experiments, hoping to prevent problems such as uneven thickness of the electroplating layer and further simplify electroplating. The mechanism design of the device saves power consumption during electroplating.

An object of the present invention is to provide an electroplating device for dynamically adjusting the anode power supply area, the electroplating device includes an electroplating tank, a fixing device, a first anode metal plate and a second anode metal plate, wherein the electroplating tank Contains electroplating solution; the fixing device is to fix one end of an object to be plated, and the object to be plated is connected to a cathode power supply, and each of the anode metal plates is respectively connected to an anode power supply, wherein the first anode metal plate One side of the plate corresponds completely to one side of the object to be plated, and is connected to the anode power supply of the first anode metal plate, which can continuously supply power to the first anode metal plate, so that adjacent to the first anode in the electroplating solution The first metal ion of the metal plate can move to the object to be plated and complete the reduction reaction. In addition, one side of the second anode metal plate corresponds to the position where one side of the object to be plated is adjacent to the other end, and The anode power supply connected to the second anode metal plate can intermittently supply power to the second anode metal plate, so that the second metal ions in the electroplating solution between the second anode metal plate and the object to be plated It can be dissociated intermittently and move to the plated object, and complete the reduction reaction. Since the second anode metal plate only receives intermittent input power, the power supply area and power of the anode metal plate can be dynamically adjusted to effectively prevent excessive metal ions from adhering to the adjacent side of the object to be plated The surface of the other end effectively prevents problems such as uneven thickness of the electroplating layer from occurring, and since the present invention does not need to use a barrier plate to cover the part of the anode metal plate that exceeds the plated object, it can greatly reduce the width and volume of the electroplating tank and avoid causing The needless waste of the electroplating solution simplifies the mechanism design of the electroplating device and greatly saves power consumption.

Another object of the present invention is that the electroplating device also includes a power supply and a programmable controller, wherein the anode power supply and the cathode power supply are arranged in the power supply, and the power supply is connected to an external power supply , to obtain power, and the power supply is connected to the programmable controller, the programmable controller can control the power supply, so that the anode power connected to the second anode metal plate can be intermittently connected to the The second anode metal plate supplies power.

Another object of the present invention is to provide an electroplating method for dynamically adjusting the anode power supply area, which is applied to an electroplating device, and the electroplating device includes an electroplating tank, a first anode metal plate and a second anode metal plate, The electroplating tank is filled with electroplating solution and accommodates an object to be plated, the object to be plated is connected to a cathode power supply, one side of the first anode metal plate is completely corresponding to one side of the object to be plated, and the first One side part of the two anode metal plates corresponds to the position adjacent to the other end of the one side of the object to be plated, and the method includes: making the anode power supply connected to the first anode metal plate continuously supply the first anode metal plate power supply, and make the anode power supply connected to the second anode metal plate intermittently supply power to the second anode metal plate, and dynamically adjust the power supply area and power of the anode metal plate, in the An electroplating layer with a uniform thickness is formed on one side, which effectively prevents problems such as uneven thickness of the electroplating layer from occurring.

Description of drawings

In order to enable the examiner to further understand and understand the purpose, structure and effect of the present invention, the following examples are listed in conjunction with the accompanying drawings, and the detailed description is as follows, wherein:

Fig. 1 is the schematic diagram of known electroplating device;

Fig. 2 is another schematic diagram of known electroplating device;

Fig. 3 is a schematic diagram of a known electroplating device plus a barrier plate;

Fig. 4 is the schematic diagram of the first preferred embodiment of the present invention;

Figure 5 is a schematic block diagram of a first preferred embodiment of the present invention; and

Fig. 6 is a schematic diagram of a second preferred embodiment of the present invention.

Detailed ways

The inventor has been engaged in the research and development and design of electroplating and other related fields for a long time, and found that the current electroplating operation often has uneven thickness of the electroplating layer. In order to improve the above-mentioned problems, however, the addition of barrier plates greatly increases the width of the electroplating tank, which also causes problems such as increased power consumption. Although the industry wants to further seek improvement solutions for the above-mentioned problems, they have not yet obtained a perfect solution. In view of this, the inventor thought and improved the structure of the electroplating device, and used the method of dynamically adjusting the anode power supply area to effectively solve the problem of uneven thickness of the electroplating layer.

The present invention is an electroplating device and its method for dynamically adjusting the anode power supply area. Please refer to FIG. And a plurality of anode metal plates 41a, 41b, wherein the electroplating tank 40 is filled with electroplating solution 400, in the first preferred embodiment, copper sulfate solution is used as electroplating solution 400, to plate on an object 42 to be plated The upper layer of copper metal, however, the present invention is not limited thereto, and the industry can also replace the copper sulfate solution with other electrolyte solutions according to actual needs when performing electroplating operations according to the present invention, so as to achieve the effect of electroplating. Changes easily conceived by those in the technical field do not depart from the technical scope to be protected by the present invention. In this preferred embodiment, the object to be plated 42 is a circuit board, and the fixing device 43 is a clamp, the lower end of the fixing device 43 clamps the top of the object to be plated 42, and the fixing device 43 The top is connected with a driving mechanism (omitted in the figure), and the driving mechanism can drive the fixing device 43 to make the fixing device 43 move so that the object to be plated 42 can be immersed in the electroplating solution 400. In particular, this preferred embodiment is described with a clamp as the fixing device 43 as an example, but the present invention is not limited thereto, and the fixing device 43 can also be other materials that can fix the object to be plated. 42. The mechanism or device at one end shall be explained in advance.

Continued, please refer to Figure 4 again, the object to be plated 42 is connected to a cathode power supply N1, and the anode metal plates 41a, 41b include two first anode metal plates 41a and two second anode metal plates 41b , wherein the first anode metal plate 41a is respectively connected to the anode power supply Pa, and the second anode metal plate 41b is connected to the anode power supply Pb. Both the first anode metal plate 41 a and the second anode metal plate 42 b are located in the electroplating bath 40 and immersed in the electroplating solution 400 . The length of the object to be plated 42 (i.e. the depth of the object to be plated 42 immersed in the electroplating solution 400) is greater than the length of the first anode metal plate 41a (i.e. the depth of the first anode metal plate 41a immersed in the electroplating solution 400), In addition, compared with the first anode metal plate 41a, the second anode metal plate 41b is located at a deeper position in the electroplating tank 40, and the bottom end of the second anode metal plate 41b is immersed in the electroplating solution 400 The depth is greater than the depth at which the bottom of the object to be plated 42 is immersed in the electroplating solution 400 . The first anode metal plate 41a and the second anode metal plate 41b are kept parallel to the object to be plated 42 respectively, and keep a predetermined distance from the object to be plated 42, and the predetermined distance depends on the width of the electroplating tank 40 or other conditions. Depends on factors, explained in advance.

In Fig. 4, the side surfaces of each of the first anode metal plates 41a completely correspond to the left and right sides of the object to be plated 42, on the other hand, only a part of the sides of each of the second anode metal plates 41b (The portion near the top) respectively corresponds to the left and right sides of the object to be plated 42 , and corresponds to the position on the object to be plated 42 near the bottom end. In addition, among the side surfaces of each of the second anode metal plates 41b, the portion close to the bottom end does not correspond to the object to be plated 42 . When actually manufacturing the electroplating device 4, an insulator can also be provided between each of the first anode metal plates 41a and each of the second anode metal plates 41b to respectively connect adjacent first anode metal plates 41a and the second anode metal plate 41b. In addition, in this preferred embodiment, two first anode metal plates 41a and two second anode metal plates 41b are used as a preferred embodiment to electroplate the two corresponding sides of the object to be plated 42, but The present invention is not limited thereto, and when designing and manufacturing the electroplating device 4 according to the present invention, the industry can also use a piece of the first anode metal plate 41a and A piece of the second anode metal plate 41b is electroplated to produce an electroplated layer on one side of the object to be plated 42, as explained in advance.

Please refer to shown in Fig. 5, this electroplating device still comprises a power supply 50 and a programmable controller 52, wherein the anode power supply Pa, Pb and cathode power N1 are provided in the power supply 50, the power supply 50 It is connected with an external power supply 51 to obtain the power supplied by the external power supply 51, and the power supply 50 is connected with the programmable controller 52 (ProgrammableLogic Controller, PLC for short). The so-called programmable controller refers to a digital electronic device with a microprocessor. The programmable controller used for automatic control can load control instructions into the memory for storage and execution at any time. Programmable controller is composed of internal central processing unit, data memory, input and output unit, digital simulation and other units, and is widely used in the field of industrial control. The programmable controller 52 can control the power supply 50 so that the anode power supply Pa connected to the first anode metal plate 41a can continuously supply power to the first anode metal plate 41a, please refer to FIG. 4 and FIG. 5 In this way, the first metal ions M1 (copper ions) in the electroplating solution 400 between the first anode metal plate 41a and the object to be plated 42 can be dissociated and move toward the object to be plated 42, and Combine with the electrons on the surface of the object to be plated 42, and firmly attach to the object to be plated 42 after completing the reduction reaction. On the other hand, one side of the second anode metal plate 41b is partly corresponding to the position adjacent to the other end (bottom end) of the side of the object to be plated 42, and the programmable controller 52 can control the power supply 50 , so that the anode power supply Pb connected to the second anode metal plate 41b can intermittently supply power to the second anode metal plate 41b, so that the plated object 42 between the second anode metal plate 41b and the The second metal ion M2 in the electroplating solution 400 can intermittently move towards the object to be plated 42, and after the reduction reaction is completed, it is firmly attached to the object to be plated 42, so as to be on the object to be plated The sides of 42 form an electroplating layer.

According to the technical characteristics of the present invention, since the second anode metal plate 41b adjacent to the other end corresponding to the left and right sides of the object to be plated 42 only receives intermittent input power, the present invention can be dynamically adjusted. The power supply area and electricity of the anode metal plates 41a, 41b can effectively prevent excessive second metal ions M2 from adhering to the surface of the left and right sides of the object to be plated 42 adjacent to the other end (bottom end), thereby effectively preventing the plating layer Therefore, when the industry uses etching technology to form electrical circuits on the electroplating layer in the future, it can easily control the impedance of the electrical circuits according to product design requirements, and there is no need to worry about the known impedance. The problem of uniformity not only greatly improves the product yield, but also effectively reduces the cost of electroplating and avoids waste of resources. Not only that, because the present invention does not need to use an insulating plate to cover the position exceeding the length of the object to be plated 42 on each of the second anode metal plates 41b, so there is no need to reserve an extra space for accommodating the insulating plate in the electroplating tank 40, which not only greatly reduces the amount of electroplating. The width and volume of the tank 40 can save the consumption of the electroplating solution 400. Moreover, the automatic mechanism and fixtures required for lifting the barrier plate can be avoided, which greatly simplifies the mechanism design of the electroplating device 4. In addition, because the electroplating tank 40 The width and volume are reduced, so the distance between the object to be plated 42 and the anode metal plates 41a, 41b can be greatly reduced, and the voltage required for electroplating can be effectively reduced, thereby greatly saving power consumption.

In the second preferred embodiment of the present invention, as shown in FIG. 6, the electroplating device 4 includes the electroplating tank 40, the fixing device 43, and the first anode metal plate 41a and the second anode metal plate 41b. In addition, it also includes two intermediate anode metal plates 41c, wherein each of the intermediate anode metal plates 41c is located between each of the first anode metal plates 41a and the second anode metal plates 41b, in other words, the first anode metal plates 41a, The middle anode metal plate 41c and the second anode metal plate 41b are located at positions of different depths in the electroplating tank 40, and each of the middle anode metal plates 41c is kept parallel to the object to be plated 42, and each of the middle anode metal plates 41c is respectively Connect to the anode power supply Pc. In this preferred embodiment, one side of each of the middle anode metal plates 41c is completely corresponding to the left and right sides of the object to be plated 42, so the anode power supply Pc connected to the middle anode metal plate 41c can continuously The intermediate anode metal plate 41c supplies power, so that the metal ions between the intermediate anode metal plate 41c and the object to be plated 42 can move to the object to be plated 42, and after the reduction reaction is completed, they are stably attached to the object to be plated. Plating 42 on. In addition, in the second preferred embodiment, the power supply method of the anode power supply Pa, Pb is the same as that described in the first preferred embodiment, so it will not be repeated, but will be described in advance.

By the technical characterictic of the present invention, when carrying out electroplating operation actually, the industry can use a plated object as the sample of trial plating earlier, to determine the pattern of the intermittent power supply of this anode power supply Pb (such as: the time interval of power supply and stop power supply) , and input the parameters for controlling the intermittent power supply mode into the aforementioned programmable controller 52, so that the programmable controller 52 can control the power supply of the anode power supply Pb according to the parameters preset by the operator, so as to achieve the purpose of the present invention Effect. In summary, the electroplating method adopted in the present invention is to make the connection To the anode power supply Pb of the second anode metal plate 41b, this second anode metal plate 41b is powered intermittently, so as to avoid excessive metal ions from being attached to one side of the object to be plated 42 adjacent to the other end (bottom end) surface and eliminates the extra space required to accommodate the barrier plate, reducing the voltage required for plating. The invention not only simplifies the mechanism design of the electroplating device, reduces the production cost, but also saves the power consumption of electroplating, and further improves the efficiency of electroplating.

According to, the above descriptions are only some preferred embodiments of the present invention, but the technical characteristics of the present invention are not limited thereto. Anyone who is familiar with this technology can easily think of them in the technical field of the present invention. Any change or modification shall fall within the scope of the claims of the present invention.

Claims (4)

1. An electroplating device for dynamically adjusting the anode power supply area, comprising: An electroplating tank, which is filled with electroplating solution; A fixing device, fixing one end of an object to be plated, so that the object to be plated is immersed in the electroplating solution, and the object to be plated is connected to a cathode power supply; A first anode metal plate, connected to an anode power supply, the first anode metal plate is located in the electroplating tank, and kept parallel to the object to be plated, one side of the first anode metal plate is completely corresponding to the plated object one side of the object, and the anode power supply connected to the first anode metal plate is capable of continuously supplying power to the first anode metal plate; and A second anode metal plate is connected with another anode power supply. The first anode metal plate is located in the electroplating tank and kept parallel to the object to be plated. One side part of the second anode metal plate corresponds to the One side of the object to be plated is adjacent to the other end, and the other anode power supply connected to the second anode metal plate can intermittently supply power to the second anode metal plate. 2. The electroplating device for dynamically adjusting the anode power supply area as claimed in claim 1, further comprising a power supply and a programmable controller, the anode power supply and the cathode power supply are provided in the power supply, and the power supply The device is connected to an external power supply to obtain power, and the power supply is connected to the programmable controller, and the programmable controller can control the power supply so that the other connected to the second anode metal plate The anode power supply can intermittently supply power to the second anode metal plate. 3. The electroplating device for dynamically adjusting the anode power supply area as claimed in claim 2, wherein the fixing device is a clamp, and the fixing device clamps and fixes one end of the object to be plated. 4. An electroplating method for dynamically adjusting the anode power supply area, which is applied to an electroplating device, the electroplating device includes an electroplating tank, a first anode metal plate and a second anode metal plate, the electroplating tank is filled with electroplating liquid and contains an object to be plated, the object to be plated is connected to a cathode power supply, one side of the first anode metal plate completely corresponds to one side of the object to be plated, and one side of the second anode metal plate The portion corresponds to a position where one side of the object to be plated is adjacent to the other end, the method comprising: causing an anode power supply connected to the first anode metal plate to continuously power the first anode metal plate; and The anode power supply connected to the second anode metal plate is intermittently powered to the second anode metal plate to form an electroplating layer on one side of the object to be plated.

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