CN101206506B - Cover structure - Google Patents

Cover structure Download PDF

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Publication number
CN101206506B
CN101206506B CN2006101692240A CN200610169224A CN101206506B CN 101206506 B CN101206506 B CN 101206506B CN 2006101692240 A CN2006101692240 A CN 2006101692240A CN 200610169224 A CN200610169224 A CN 200610169224A CN 101206506 B CN101206506 B CN 101206506B
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electronic device
cover structure
main body
retaining wall
shaped retaining
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CN101206506A (en
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杨成群
杨永吉
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State Grid Shanghai Electric Power Co Ltd
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Inventec Corp
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Abstract

A cover structure is used for being arranged on a main body casing of an electronic device to cover an opening formed on the electronic device and comprises a main body, a first clamping piece and a hot melting column, wherein the first clamping piece and the hot melting column are arranged on the main body casing of the electronic device, a second clamping hole and a hot melting hole are formed on the main body casing of the electronic device corresponding to the periphery of the opening, so that the first clamping piece and the second clamping piece are combined to limit the displacement of the cover structure relative to the main body casing, and meanwhile, the hot melting column of the cover structure penetrates through the hot melting hole of the main body casing and is fixed in a hot melting mode, so that the cover structure is effectively fixed on the main body casing of the electronic device.

Description

盖件结构Cover structure

技术领域technical field

本发明涉及一种盖件结构,详言之,涉及一种关于装设于电子装置的盖件结构。The invention relates to a cover structure, in particular, to a cover structure installed on an electronic device.

背景技术Background technique

随着信息产业的发展,各式电子装置的使用早已遍及不同年龄层的使用者,同时应电子产品轻薄短小的发展趋势,如笔记型电脑(NB)或个人数字助理(PDA)等具有强大数据处理能力及携带性的电子装置已成为现代人不可或缺的得力助手。With the development of the information industry, the use of various electronic devices has already spread to users of different ages. At the same time, in response to the development trend of electronic products, such as notebook computers (NB) or personal digital assistants (PDA) with powerful data Electronic devices with processing power and portability have become an indispensable right-hand man for modern people.

以笔记型电脑为例,为强化及扩充该笔记型电脑的功能,一般即须在该笔记型电脑主体机壳的周边预设有许多如USB的连接插口或其它供与外界作电性连接及信息传送的输入或输出端,其中对应于笔记型电脑中为供外界通过该些输入/输出端而与该笔记型电脑连接,其可独立在一附加盖件上预设有许多对应该些输入/输出端的开孔,且该附加盖件一般即与该笔记型电脑的主体机壳结构分开制作,且在该主体机壳上预留有对应该附加盖件的开口,从而通过预设于该主体机壳及附加盖件上相对应的卡扣件,用以后续将该附加盖件以卡扣方式加以组装于笔记型电脑的主体机壳上。Taking a notebook computer as an example, in order to strengthen and expand the functions of the notebook computer, it is generally necessary to preset many connection sockets such as USB or other electrical connections and information on the periphery of the main body of the notebook computer. The input or output port of the transmission, which corresponds to the notebook computer for the outside world to connect with the notebook computer through these input/output ports, it can be independently preset on an additional cover with many corresponding to these input/output ports. The opening of the output end, and the additional cover is generally made separately from the main casing structure of the notebook computer, and an opening corresponding to the additional cover is reserved on the main casing, so that through the The corresponding buckle parts on the casing and the additional cover are used to subsequently assemble the additional cover on the main body casing of the notebook computer in a buckle manner.

然而,针对前述传统以卡扣方式将附加盖件组装于笔记型电脑的主体机壳时、常因设于该附加盖件或主体机壳上的卡扣件的规格设计或尺寸制作误差,而在彼此接合时产生间隙,甚或产生翘边问题,不仅影响产品外观,而且容易导致外在污染物入侵,严重影响产品的品质及可靠度。However, when assembling the additional cover on the main body casing of the notebook computer in a buckling manner in the aforementioned tradition, it is often due to the specification design or dimensional error of the buckle on the additional cover or the main casing. Gaps or even edge warping occur when joining each other, which not only affects the appearance of the product, but also easily leads to the intrusion of external pollutants, seriously affecting the quality and reliability of the product.

因此,如何提供如笔记型电脑的电子装置在组装附加盖件时、避免因规格设计或尺寸制作误差而在彼此接合时产生间隙、翘边等情况以导致产品外观不佳,以及外在污染物入侵等问题,确为此相关研发领域所需迫切面临的课题。Therefore, how to provide an electronic device such as a notebook computer when assembling an additional cover to avoid gaps, edge warping, etc. when being joined to each other due to specification design or dimensional manufacturing errors, resulting in poor product appearance and external pollutants Intrusion and other issues are indeed urgent issues for this related research and development field.

发明内容Contents of the invention

鉴于以上现有的缺点,本发明的一个目的在于提供一种盖件结构,以避免因规格设计或尺寸制作误差而在盖合时产生间隙、翘边,以至导致产品外观不佳的问题。In view of the above existing disadvantages, an object of the present invention is to provide a cover structure to avoid problems such as gaps, edge warping and poor product appearance caused by specification design or dimensional manufacturing errors.

本发明的再一目的在于提供一种盖件结构,其可紧密盖合,以防止外在污染物入侵,提升产品的品质及可靠度。Another object of the present invention is to provide a cover structure that can be tightly closed to prevent the intrusion of external pollutants and improve product quality and reliability.

为实现上述及其他目的,本发明提供一种盖件结构,其用以装设于电子装置的主体机壳上,以覆盖形成于该电子装置的开口,该盖件结构包括有:主体;设于该主体上的第一卡固件,该电子装置的主体机壳上对应该开口周围设有第二卡固件,以供该第一及第二卡固件结合而限制该盖件结构相对该主体机壳的位移,其中,该第一卡固件为T型挡墙或卡槽,而该第二卡固件为配合该T型挡墙的卡槽或配合该卡槽的T型挡墙;设于该主体上的热熔柱,在该电子装置的主体机壳上对应其开口周围设有热熔孔,从而通过该盖件结构的热熔柱穿过该主体机壳的热熔孔并热熔固定,以有效地将该盖件结构固着于该电子装置的主体机壳上。In order to achieve the above and other objects, the present invention provides a cover structure, which is used to be installed on the main body casing of the electronic device to cover the opening formed in the electronic device. The cover structure includes: a main body; The first fastener on the main body, the main body casing of the electronic device is provided with a second fastener corresponding to the opening around, so that the first and second fasteners can be combined to limit the cover structure relative to the main body The displacement of the shell, wherein, the first clamping member is a T-shaped retaining wall or a card slot, and the second clamping member is a card slot matching the T-shaped retaining wall or a T-shaped retaining wall matching the card slot; The heat-melt column on the main body is provided with a heat-melt hole corresponding to its opening on the main body casing of the electronic device, so that the heat-melt column passed through the cover structure passes through the heat-melt hole of the main body casing and is fixed by heat fusion , so as to effectively fix the cover structure on the main casing of the electronic device.

该电子装置可为笔记型电脑或个人数字助理等可携式电子装置,该盖件结构为相对独立于该电子装置主体机壳所附加的盖件,且在该盖件结构主体上预设有许多对应电子装置输入/输出端的开孔,以供该电子装置与外界作电性连接及信息传送的输入/输出。The electronic device can be a portable electronic device such as a notebook computer or a personal digital assistant. A plurality of openings corresponding to the input/output ends of the electronic device are provided for the electronic device to be electrically connected to the outside world and input/output for information transmission.

较理想为,该T型挡墙插入该卡槽后限制该盖件结构相对该电子装置主体机壳的位移,同时通过该盖件结构的热熔柱熔接于热熔孔,从而有效地将该盖件结构固着于电子装置的主体机壳上。Ideally, after the T-shaped retaining wall is inserted into the card slot, the displacement of the cover structure relative to the main body casing of the electronic device is limited, and at the same time, the heat-melt column of the cover structure is welded to the heat-melt hole, thereby effectively The cover structure is fixed on the main casing of the electronic device.

相比于现有技术以卡扣方式将盖件组装于电子装置的主体机壳时,常因设于该盖件或主体机壳上的卡扣件规格设计或尺寸制作误差,在彼此接合时产生间隙、翘边而造成产品外观不良、外在污染物入侵等严重影响产品的品质及可靠度问题,本发明中通过在盖件结构主体上预设有热熔柱及第一卡固件,同时在电子装置上预设有相对的热熔孔及第二卡固件,从而可通过该第一及第二卡固件的结合而限制该盖件结构相对该主体机壳位移,同时通过该盖件结构的热熔柱穿过该主体机壳的热熔孔并热熔固定,以有效地将该盖件结构固着于该电子装置的主体机壳上。Compared with the prior art, when the cover is assembled to the main body casing of the electronic device in a snap-fit manner, it is often due to errors in specification design or dimensional manufacturing of the snap-fits on the cover or the main casing, when they are engaged with each other. Gaps and warped edges cause poor product appearance, external pollutants intrusion, etc., which seriously affect the quality and reliability of the product. In the present invention, the heat-melt column and the first clamping member are preset on the main body of the cover structure, and at the same time The electronic device is preset with a relative hot-melt hole and a second fastener so that the displacement of the cover structure relative to the main casing can be limited through the combination of the first and second fasteners, and at the same time, the cover structure can The hot-melt column passes through the hot-melt hole of the main casing and is fixed by hot-melting, so as to effectively fix the cover structure on the main casing of the electronic device.

附图说明Description of drawings

图1为本发明的盖件结构组装于电子装置主体机壳的外观示意图;1 is a schematic diagram of the appearance of the cover structure of the present invention assembled in the main casing of the electronic device;

图2为本发明的盖件结构进行组装的分解示意图;Fig. 2 is the disassembled schematic view that the cover structure of the present invention is assembled;

图3为本发明的盖件结构组装在电子装置主体机壳的内部示意图。FIG. 3 is a schematic diagram of the inside of the cover structure of the present invention assembled in the main casing of the electronic device.

符号说明Symbol Description

1    盖件结构      10    主体1 Cover structure 10 Main body

11   第一卡固件    12    热熔柱11 First card firmware 12 Hot melt column

13   开孔          2     主体机壳13 Opening hole 2 Main body casing

20   开口          21    第二卡固件20 Opening 21 Second card firmware

211  导引部        22    热熔孔211 Guiding part 22 Hot melt hole

具体实施方式Detailed ways

下面通过特定的具体实施例说明本发明的实施方式,本领域技术人员可由本说明书所阐述的内容轻易地了解本发明的其他优点与作用。The implementation of the present invention will be described below through specific specific examples, and those skilled in the art can easily understand other advantages and functions of the present invention from the content described in this specification.

请参阅图1,其为表示本发明的盖件结构组装在电子装置的主体机壳上的外观示意图。Please refer to FIG. 1 , which is a schematic view illustrating the assembly of the cover structure of the present invention on the main casing of the electronic device.

该电子装置可为笔记型电脑,也可为个人数字助理等可携式电子装置,而该盖件结构1为相对独立于该电子装置主体机壳2所附加的盖件,该盖件结构1用以装设于电子装置的主体机壳2上,以覆盖形成于该电子装置主体机壳的开口20,其中在该盖件结构1上设有许多对应如USB介面的输入/输出端的开孔13,以作为该电子装置与外界作电性连接及信息传送的输入/输出端。The electronic device can be a notebook computer, or a portable electronic device such as a personal digital assistant, and the cover structure 1 is an additional cover relatively independent of the main casing 2 of the electronic device. The cover structure 1 It is used to be installed on the main casing 2 of the electronic device to cover the opening 20 formed in the main casing of the electronic device, wherein the cover structure 1 is provided with a plurality of openings corresponding to the input/output ports of the USB interface 13, used as an input/output terminal for electrical connection and information transmission between the electronic device and the outside world.

请配合参阅图2及图3,其为表示本发明的盖件结构组装于电子装置主体机壳的分解示意图及组装完成内部示意图,该盖件结构1包括有:主体10;设于该主体10上的第一卡固件11,在该电子装置的主体机壳2上对应其开口周围设有第二卡固件21,以供该第一及第二卡固件11、21结合而限制该盖件结构1相对该主体机壳2的位移;设于该主体10上的热熔柱12,且在该电子装置的主体机壳2上对应其开口周围设有热熔孔22,从而通过该盖件结构1的热熔柱12穿过该主体机壳2的热熔孔22并热熔固定,以有效地将该盖件结构1固着于该电子装置的主体机壳2上。Please refer to FIG. 2 and FIG. 3 , which are an exploded view showing that the cover structure of the present invention is assembled in the main casing of the electronic device and an internal view after assembly. The cover structure 1 includes: a main body 10 ; The first clip 11 on the top of the electronic device is provided with a second clip 21 corresponding to its opening on the main body casing 2 of the electronic device, so that the first and second clips 11, 21 can be combined to limit the cover structure 1 relative to the displacement of the main body casing 2; the heat-melt column 12 provided on the main body 10, and a heat-melt hole 22 corresponding to its opening is provided on the main body casing 2 of the electronic device, so that through the cover structure The heat-melt column 12 of 1 passes through the heat-melt hole 22 of the main casing 2 and is fixed by heat-melting, so as to effectively fix the cover structure 1 on the main casing 2 of the electronic device.

该设于盖件结构1的第一卡固件11可例如为T型挡墙,而该设于电子装置主体机壳2上的第二卡固件21为配合该T型挡墙的卡槽,且该卡槽两侧设有导引部211,以供该T型挡墙滑入该卡槽,从而通过该呈T型的挡墙卡固于卡槽两侧的导引部211而限制盖件结构1相对于电子装置主体机壳2位移。The first fastening member 11 provided on the cover structure 1 can be, for example, a T-shaped retaining wall, and the second fastening member 21 provided on the main body casing 2 of the electronic device is a slot matching the T-shaped retaining wall, and Guide parts 211 are provided on both sides of the slot for the T-shaped retaining wall to slide into the slot, so that the T-shaped retaining wall is fastened to the guide parts 211 on both sides of the slot to restrict the cover The structure 1 is displaced relative to the main casing 2 of the electronic device.

此外,本发明中也相对于该盖件结构上设置如卡槽的第一卡固件,而在该电子装置的主体机壳上设置如挡墙的第二卡固件,且在该卡槽两侧设有导引部,以使该T型挡墙卡固于卡槽两侧的导引部而限制盖件结构相对于电子装置主体机壳位移。In addition, in the present invention, the first fastening member such as a card slot is also arranged on the cover structure, and the second fastening member such as a retaining wall is arranged on the main body casing of the electronic device, and on both sides of the card slot A guide part is provided, so that the T-shaped retaining wall is fastened to the guide parts on both sides of the slot to limit the displacement of the cover structure relative to the main casing of the electronic device.

该盖件结构1的热熔柱12穿过该电子装置主体机壳2的热熔孔22,以供后续熔接于该热熔孔22上,进而有效地将该盖件结构1固着于电子装置的主体机壳2上。The hot-melt column 12 of the cover structure 1 passes through the hot-melt hole 22 of the main casing 2 of the electronic device for subsequent welding on the hot-melt hole 22, thereby effectively fixing the cover structure 1 to the electronic device on the main body casing 2.

因此,相比于现有技术以卡扣方式将盖件组装于电子装置的主体机壳时、常因设于该盖件或主体机壳上的卡扣件规格设计或尺寸制作误差,在彼此接合时产生间隙、翘边而造成产品外观不良、外在污染物入侵等严重影响产品的品质及可靠度问题,本发明所阐述的盖件结构通过在该盖件结构主体上预设有热熔柱及第一卡固件,同时在电子装置的主体机壳上预设有相对的热熔孔及第二卡固件,从而可通过该热熔柱熔接于热熔孔以限制该盖件结构的位移,同时通过该第一及第二卡固件的卡合而限制盖件结构水平向的位移,进而有效地将该盖件结构固定于电子装置的主体机壳上。Therefore, compared with the prior art when the cover is assembled to the main body casing of the electronic device in a buckle manner, it is often due to errors in specification design or dimensional manufacturing of the buckle provided on the cover or the main casing. Gaps and edge warping occur during bonding, resulting in poor appearance of the product, intrusion of external pollutants, etc., which seriously affect the quality and reliability of the product. The cover structure described in the present invention is preset with a hot melt The column and the first clamping member are preset on the main casing of the electronic device with a relative thermal fusion hole and a second clamping component, so that the thermal fusion column can be welded to the thermal fusion hole to limit the displacement of the cover structure At the same time, the horizontal displacement of the cover structure is limited by the engagement of the first and second fasteners, so as to effectively fix the cover structure on the main casing of the electronic device.

但是以上所述的具体实施例,仅用以例释本发明的特点及作用,而非用以限定本发明的可实施范畴,因此在未脱离本发明上述的精神与技术范畴下,本领域技术人员可运用本发明所阐述的内容完成等效的改变及修饰。However, the specific embodiments described above are only used to illustrate the characteristics and effects of the present invention, rather than to limit the scope of the present invention. Therefore, without departing from the spirit and technical scope of the present invention, those skilled in the art Personnel can use the contents described in the present invention to carry out equivalent changes and modifications.

Claims (5)

1.一种盖件结构,其用以装设在电子装置的主体机壳上,以覆盖形成于该电子装置的开口,其特征在于,该盖件结构包括有:1. A cover structure, which is used to be installed on the main casing of the electronic device to cover the opening formed in the electronic device, characterized in that the cover structure includes: 主体;main body; 设于该主体上的第一卡固件,在该电子装置的主体机壳上对应该开口周围设有第二卡固件,以供该第一及第二卡固件结合而限制该盖件结构相对该主体机壳的位移,其中,该第一卡固件为T型挡墙或卡槽,而该第二卡固件为配合该T型挡墙的卡槽或配合该卡槽的T型挡墙;The first fastening member is arranged on the main body, and the second fastening member is provided around the opening corresponding to the main casing of the electronic device, so that the first and second fastening members can be combined to limit the cover structure relative to the The displacement of the main body casing, wherein the first clamping member is a T-shaped retaining wall or a card slot, and the second clamping member is a card slot matching the T-shaped retaining wall or a T-shaped retaining wall matching the card slot; 设于该主体上的热熔柱,在该电子装置的主体机壳上对应其开口周围设有热熔孔,从而通过该盖件结构的热熔柱穿过该主体机壳的热熔孔并热熔固定,以将该盖件结构固着于该电子装置的主体机壳上。The heat-melt column arranged on the main body is provided with a heat-melt hole corresponding to its opening on the main body casing of the electronic device, so that the heat-melt column passed through the cover structure passes through the heat-melt hole of the main body casing and hot-melt fixing to fix the cover structure on the main casing of the electronic device. 2.根据权利要求1所述的盖件结构,其特征在于,该电子装置为笔记型电脑、个人数字助理及可携式电子装置其中一者。2. The cover structure according to claim 1, wherein the electronic device is one of a notebook computer, a personal digital assistant and a portable electronic device. 3.根据权利要求1所述的盖件结构,其特征在于,该盖件结构上设有作为电子装置输入/输出端的开孔。3. The cover structure according to claim 1, characterized in that, the cover structure is provided with an opening serving as an input/output port of the electronic device. 4.根据权利要求1所述的盖件结构,其特征在于,当该第一卡固件为T型挡墙且该第二卡固件为配合该T型挡墙的卡槽时,该卡槽两侧设有导引部,以供该T型挡墙滑入该卡槽,使该T型挡墙卡固于卡槽两侧的导引部而限制盖件结构相对于电子装置主体机壳位移。4. The cover structure according to claim 1, wherein when the first clamping member is a T-shaped retaining wall and the second clamping member is a slot matching the T-shaped retaining wall, the two clamping slots There is a guide part on the side for the T-shaped retaining wall to slide into the card slot, so that the T-shaped retaining wall is fixed on the guide parts on both sides of the card slot to limit the displacement of the cover structure relative to the main body casing of the electronic device . 5.根据权利要求1所述的盖件结构,其特征在于,当该第一卡固件为卡槽且该第二卡固件为配合该卡槽的T型挡墙时,该卡槽两侧设有导引部,以使该T型挡墙卡固于卡槽两侧的导引部而限制盖件结构相对于电子装置主体机壳位移。5. The cover structure according to claim 1, wherein when the first fastening member is a slot and the second fastening member is a T-shaped retaining wall matching the slot, both sides of the slot are provided with There is a guide part, so that the T-shaped retaining wall is fastened to the guide parts on both sides of the slot to limit the displacement of the cover structure relative to the main body casing of the electronic device.
CN2006101692240A 2006-12-20 2006-12-20 Cover structure Expired - Fee Related CN101206506B (en)

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CN1543418A (en) * 2000-11-14 2004-11-03 ���������߶��عɺ�Ͷ�ʹɷ����޹�˾ Opening device for packaging containers

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CN1543418A (en) * 2000-11-14 2004-11-03 ���������߶��عɺ�Ͷ�ʹɷ����޹�˾ Opening device for packaging containers

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